公开(公告)号：US20180324951A1

公开(公告)日：2018-11-08

申请号：US15774863

申请日：2015-11-13

申请人： Intel Corporation

发明人： Penang Goh ,  Hoay Tien Teoh ,  Jia Yan Go ,  Jenny Shio Yin Ong

IPC分类号： H05K1/18 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01L25/105 ,  H01L2224/81203 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10734 ,  Y02P70/613

摘要： The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.