公开(公告)号：US20230317706A1

公开(公告)日：2023-10-05

申请号：US17710753

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Kyle ARRINGTON ,  Kuang LIU ,  Bohan SHAN ,  Hongxia FENG ,  Don Douglas JOSEPHSON ,  Stephen MOREIN ,  Kaladhar RADHAKRISHNAN

IPC: H01L25/18 ,  H01L23/373 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L21/48

CPC classification number: H01L25/18 ,  H01L23/3736 ,  H01L25/0652 ,  H01L24/40 ,  H01L23/538 ,  H01L21/4871 ,  H01L24/37 ,  H01L2224/37147 ,  H01L24/83 ,  H01L2224/83385 ,  H01L2224/83447 ,  H01L24/33 ,  H01L2224/3303 ,  H01L24/06 ,  H01L2224/0603 ,  H01L2224/32258 ,  H01L2224/4046 ,  H01L24/32 ,  H01L2224/40499 ,  H01L24/16 ,  H01L2224/16225

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.