公开(公告)号：US20170062357A1

公开(公告)日：2017-03-02

申请号：US14909939

申请日：2015-03-19

Applicant: Intel Corporation

Inventor： Teleshpor KAMGAING ,  Thorsten MEYER

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/38 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/24 ,  H01L23/373 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/36 ,  H01L23/373 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/02 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6616 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/24245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82047 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/38

Abstract: A package is described for a radio frequency die that has a backside conductive plate. One example includes a conductive plate, a semiconductor die having a front side and a back side, the back side being attached to the plate, a radio frequency component attached to the plate, a dielectric filled cavity in the plate adjacent to the radio frequency component, and a redistribution layer attached to the front side of the die for external connection.

Abstract translation: 描述了一种具有背面导电板的射频管芯的封装。 一个例子包括导电板，具有前侧和后侧的半导体管芯，其背面附接到板上，附接到板的射频部件，邻近射频部件的板中的电介质填充腔 ，以及连接到模具前侧的再分配层，用于外部连接。