公开(公告)号：US10008474B2

公开(公告)日：2018-06-26

申请号：US15206729

申请日：2016-07-11

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Andreas Christian Doering ,  Ronald Peter Luijten ,  Stefano Sergio Oggioni ,  Patricia Maria Sagmeister ,  Martin Leo Schmatz

IPC分类号： H01L29/40 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC分类号： H01L25/0655 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/367 ,  H01L23/49805 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/153 ,  H05K1/145 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/0228 ,  H05K2203/143 ,  H01L2224/45099

摘要： Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of chip packages, each including: an overmold; and an IC chip, overmolded in the overmold, and wherein: the chip packages are stacked transversely to an average plane of each of the chip packages, thereby forming a stack wherein a main surface of one of the chip packages faces a main surface of another one of the chip packages; and each of the chip packages is laterally soldered to one or more of said one or more PCBs and arranged transversally to each of said one or more PCBs, whereby an average plane of each of said one or more PCBs extends transversely to the average plane of each of the chip packages of the stack. Further embodiments are directed to related devices and fabrication methods.

公开(公告)号：US10321580B2

公开(公告)日：2019-06-11

申请号：US15223621

申请日：2016-07-29

申请人： International Business Machines Corporation

发明人： Ralph Heller ,  Patricia Maria Sagmeister ,  Martin Leo Schmatz

IPC分类号： H05K7/20 ,  H05K3/40 ,  H05K3/36

摘要： Embodiments of the present invention are directed to an integrated circuit (IC) package assembly. The IC package assembly includes a base printed circuit board (PCB), and a set of IC packages. Each of the IC packages includes at least one IC chip, mounted on or partly in a support component, which mechanically supports and electrically connects to the IC chip. In addition, each of the IC packages is laterally soldered to the base PCB (e.g., a motherboard PCB) and arranged transversally to the base PCB and forms an angle α therewith. As a result, a slanted stack of IC packages is obtained, wherein the IC packages are essentially parallel to each other. Further embodiments are directed to related devices, including the above assembly, and to related fabrication methods.

公开(公告)号：US10659309B2

公开(公告)日：2020-05-19

申请号：US16389053

申请日：2019-04-19

申请人： International Business Machines Corporation

发明人： Martin Leo Schmatz

IPC分类号： H04L12/24 ,  H04L12/715 ,  H04L12/26 ,  H04L29/08

摘要： A method is provided for networking nodes in a data center network structure, including connecting at least ten base units each including connected nodes with southbound connections of a multi-host NIC controller having northbound a higher total bandwidth than southbound, the controllers configured as dragonfly switches; connecting the ten base units with their respective controllers in a modified Peterson graph form as an intragroup network to build a super unit including three groups, where each controller uses three northbound connections for a direct connection to three other base units of the super unit, and in which two base units of each group are connected via a respective one of a fourth northbound connection to one of the other groups, and a remaining base unit not being part of one of the groups is adapted for using three northbound connections for direct connection to one base unit in each group.

公开(公告)号：US10355939B2

公开(公告)日：2019-07-16

申请号：US15486878

申请日：2017-04-13

申请人： International Business Machines Corporation

发明人： Martin Leo Schmatz

IPC分类号： H04L12/24 ,  H04L12/715 ,  H04L12/26 ,  H04L29/08

摘要： A method is provided for networking nodes in a data center network structure, including connecting at least ten base units each including connected nodes with southbound connections of a multi-host NIC controller having northbound a higher total bandwidth than southbound, the controllers configured as dragonfly switches; connecting the ten base units with their respective controllers in a modified Peterson graph form as an intragroup network to build a super unit including three groups, where each controller uses three northbound connections for a direct connection to three other base units of the super unit, and in which two base units of each group are connected via a respective one of a fourth northbound connection to one of the other groups, and a remaining base unit not being part of one of the groups is adapted for using three northbound connections for direct connection to one base unit in each group.