Abstract:
According to one embodiment, a display device includes an insulating substrate, a first insulating film, a second insulating film, a third insulating film, a fourth insulating film, a fifth insulating film, a sixth insulating film, a color filter layer, a semiconductor layer disposed between the second insulating film and the third insulating film, and a gate electrode disposed between the third insulating film and the fourth insulating film, wherein the first, fourth, and sixth insulating films are formed of a silicon nitride, and the second, third, and fifth insulating films are formed of a silicon oxide.
Abstract:
According to one embodiment, a semiconductor device includes, an oxide semiconductor layer including a channel region, and a source region and a drain region, a first insulation film covering the channel region and exposing the source region and the drain region, a first conductive layer including a gate electrode, and a first terminal electrode, a second insulation film covering the first conductive layer, the source region and the drain region, a second conductive layer including a source electrode, a drain electrode, and a second terminal electrode which is opposed to the first terminal electrode via the second insulation film, and a third insulation film interposed between the second insulation film, and the source electrode and the drain electrode.
Abstract:
According to one embodiment, a method of manufacturing a thin-film transistor circuit substrate including forming an oxide semiconductor thin film above an insulative substrate, forming a gate insulation film and a gate electrode which are stacked on a first region of the oxide semiconductor thin film, and exposing from the gate insulation film a second region and a third region of the oxide semiconductor thin film, the second region and the third region being located on both sides of the first region of the oxide semiconductor thin film, forming an interlayer insulation film of silicon nitride including dangling bonds of silicon, the interlayer insulation film covering the second region and the third region of the oxide semiconductor thin film, the gate insulation film and the gate electrode, and forming a source electrode and a drain electrode.
Abstract:
According to one embodiment, a method of manufacturing a thin-film transistor circuit substrate including forming an oxide semiconductor thin film above an insulative substrate, forming a gate insulation film and a gate electrode which are stacked on a first region of the oxide semiconductor thin film, and exposing from the gate insulation film a second region and a third region of the oxide semiconductor thin film, the second region and the third region being located on both sides of the first region of the oxide semiconductor thin film, forming an interlayer insulation film of silicon nitride including dangling bonds of silicon, the interlayer insulation film covering the second region and the third region of the oxide semiconductor thin film, the gate insulation film and the gate electrode, and forming a source electrode and a drain electrode.
Abstract:
According to one embodiment, a display device includes an insulating substrate, a first insulating film, a second insulating film, a third insulating film, a fourth insulating film, a fifth insulating film, a sixth insulating film, a color filter layer, a semiconductor layer disposed between the second insulating film and the third insulating film, and a gate electrode disposed between the third insulating film and the fourth insulating film, wherein the first, fourth, and sixth insulating films are formed of a silicon nitride, and the second, third, and fifth insulating films are formed of a silicon oxide.
Abstract:
According to one embodiment, a liquid crystal panel includes substrates opposed to each other and paired. The liquid crystal panel includes a liquid crystal layer interposed between the substrates. The liquid crystal panel includes a sealed portion that includes bending corner portions at positions spaced from the outer edges of the substrates, and surrounds the periphery of the liquid crystal layer and bonds the substrates together. The liquid crystal panel includes main spacers that are interposed between the substrates at the position of the liquid crystal layer and hold the gap between the substrates. The liquid crystal panel includes auxiliary spacers that are interposed between the substrates to fill the portions between the outer side portions of the corner portions of the sealed portion and the outer edge sides of the substrates and hold the gap between the substrates.