PROCESS CHAMBERS HAVING SHARED RESOURCES AND METHODS OF USE THEREOF
    1.
    发明申请
    PROCESS CHAMBERS HAVING SHARED RESOURCES AND METHODS OF USE THEREOF 审中-公开
    具有共享资源的过程池及其使用方法

    公开(公告)号:US20110269314A1

    公开(公告)日:2011-11-03

    申请号:US12905032

    申请日:2010-10-14

    IPC分类号: H01L21/3065

    CPC分类号: H01L21/67109 H01L21/6719

    摘要: Process chambers having shared resources and methods of use are provided. In some embodiments, substrate processing systems may include a first process chamber having a first substrate support disposed within the first process chamber, wherein the first substrate support has a first heater and a first cooling plate to control a temperature of the first substrate support; a second process chamber having a second substrate support disposed within the second process chamber, wherein the second substrate support has a second heater and a second cooling plate to control a temperature of the second substrate support; and a shared heat transfer fluid source having an outlet to provide a heat transfer fluid to the first cooling plate and the second cooling plate and an inlet to receive the heat transfer fluid from the first cooling plate and the second cooling plate.

    摘要翻译: 提供了具有共享资源和使用方法的过程室。 在一些实施例中,衬底处理系统可以包括第一处理室,其具有设置在第一处理室内的第一衬底支撑件,其中第一衬底支撑件具有第一加热器和第一冷却板以控制第一衬底支撑件的温度; 第二处理室,具有设置在所述第二处理室内的第二基板支撑件,其中所述第二基板支撑件具有第二加热器和第二冷却板,以控制所述第二基板支撑件的温度; 以及共用传热流体源,其具有出口以向第一冷却板和第二冷却板提供传热流体,以及从第一冷却板和第二冷却板接收传热流体的入口。

    METHODS AND APPARATUS FOR REDUCING FLOW SPLITTING ERRORS USING ORIFICE RATIO CONDUCTANCE CONTROL
    3.
    发明申请
    METHODS AND APPARATUS FOR REDUCING FLOW SPLITTING ERRORS USING ORIFICE RATIO CONDUCTANCE CONTROL 审中-公开
    减少流量分解误差的方法和装置

    公开(公告)号:US20110265883A1

    公开(公告)日:2011-11-03

    申请号:US12907942

    申请日:2010-10-19

    IPC分类号: F17D3/00 F16K7/00

    摘要: Methods and apparatus for gas delivery to a process chamber are provided herein. In some embodiments, an apparatus for processing substrates may include a mass flow controller to provide a desired total fluid flow; a first flow control manifold comprising a first inlet, a first outlet, and a first plurality of orifices selectably coupled therebetween, wherein the first inlet is coupled to the mass flow controller; and a second flow control manifold comprising a second inlet, a second outlet, and a second plurality of orifices selectably coupled therebetween, wherein the second inlet is coupled to the mass flow controller; wherein a desired flow ratio between the first outlet and the second outlet is selectably obtainable when causing the fluid to flow through one or more of the first plurality of orifices of the first manifold and one or more of the second plurality of orifices of the second manifold.

    摘要翻译: 本文提供了用于气体输送到处理室的方法和装置。 在一些实施例中,用于处理衬底的装置可以包括质量流量控制器以提供期望的总流体流量; 第一流量控制歧管,包括第一入口,第一出口和可选择地联接在其间的第一多个孔,其中所述第一入口联接到所述质量流量控制器; 以及第二流量控制歧管,包括第二入口,第二出口和可选择地联接在其间的第二多个孔,其中所述第二入口联接到所述质量流量控制器; 其中当所述流体流过所述第一歧管的所述第一多个孔中的一个或多个并且所述第二歧管的所述第二多个孔中的一个或多个时,可选择地获得所述第一出口和所述第二出口之间的期望流量比 。

    APPARATUS FOR RADIAL DELIVERY OF GAS TO A CHAMBER AND METHODS OF USE THEREOF
    4.
    发明申请
    APPARATUS FOR RADIAL DELIVERY OF GAS TO A CHAMBER AND METHODS OF USE THEREOF 失效
    用于将气体径向输送到室的装置及其使用方法

    公开(公告)号:US20110265887A1

    公开(公告)日:2011-11-03

    申请号:US12907947

    申请日:2010-10-19

    IPC分类号: F15D1/00

    摘要: Apparatus for the delivery of a gas to a chamber and methods of use thereof are provided herein. In some embodiments, a gas distribution system for a process chamber may include a body having a first surface configured to couple the body to an interior surface of a process chamber, the body having a opening disposed through the body; a flange disposed proximate a first end of the opening opposite the first surface of the body, the flange extending inwardly into the opening and configured to support a window thereon; and a plurality of gas distribution channels disposed within the body and fluidly coupling a channel disposed within the body and around the opening to a plurality of holes disposed in the flange, wherein the plurality of holes are disposed radially about the flange.

    摘要翻译: 本文提供了将气体输送到室的装置及其使用方法。 在一些实施例中,用于处理室的气体分配系统可以包括主体,其具有构造成将主体连接到处理室的内表面的第一表面,主体具有穿过主体设置的开口; 靠近所述开口的与所述主体的第一表面相对的第一端附近的凸缘,所述凸缘向内延伸到所述开口中并且构造成在其上支撑窗户; 以及多个气体分配通道,其设置在所述主体内并且将设置在所述主体内并且围绕所述开口的通道流体连接到设置在所述凸缘中的多个孔,其中所述多个孔围绕所述凸缘径向设置。

    METHODS AND APPARATUS FOR PROVIDING A GAS MIXTURE TO A PAIR OF PROCESS CHAMBERS
    6.
    发明申请
    METHODS AND APPARATUS FOR PROVIDING A GAS MIXTURE TO A PAIR OF PROCESS CHAMBERS 失效
    将气体混合物提供给过程池对的方法和装置

    公开(公告)号:US20110265831A1

    公开(公告)日:2011-11-03

    申请号:US12907944

    申请日:2010-10-19

    摘要: A method and apparatus for supplying a gas mixture to a load lock chamber is described. In one embodiment, the apparatus supplies a gas mixture to a pair of process chambers, comprising a first ozone generator to provide a first gas mixture to a first process chamber, a second ozone generator to provide a second gas mixture to a second process chamber, a first gas source coupled to the first ozone generator via a first mass flow controller and a first gas line, and coupled to the second ozone generator via a second mass flow controller and a second gas line, and a second gas source coupled to the first ozone generator via a third mass flow controller and a third gas line and coupled to the second ozone generator via fourth mass flow controller and a fourth gas line.

    摘要翻译: 描述了一种将气体混合物供应到负载锁定室的方法和装置。 在一个实施例中,该装置将气体混合物提供给一对处理室,包括第一臭氧发生器以向第一处理室提供第一气体混合物,第二臭氧发生器将第二气体混合物提供给第二处理室, 第一气体源,经由第一质量流量控制器和第一气体管线耦合到第一臭氧发生器,并且经由第二质量流量控制器和第二气体管线耦合到第二臭氧发生器,以及耦合到第一气体源的第一气体源 臭氧发生器,经由第三质量流量控制器和第三气体管线,并经由第四质量流量控制器和第四气体管线与第二臭氧发生器连接。

    SYSTEM AND METHOD FOR CALIBRATING PRESSURE GAUGES IN A SUBSTRATE PROCESSING SYSTEM
    7.
    发明申请
    SYSTEM AND METHOD FOR CALIBRATING PRESSURE GAUGES IN A SUBSTRATE PROCESSING SYSTEM 有权
    用于在基板处理系统中校准压力计的系统和方法

    公开(公告)号:US20110265899A1

    公开(公告)日:2011-11-03

    申请号:US12916450

    申请日:2010-10-29

    IPC分类号: F15D1/00 G01L27/00

    摘要: Systems and methods for calibrating pressure gauges in one or more process chambers coupled to a transfer chamber having a transfer volume is disclosed herein. The method includes providing a first pressure in the transfer volume and in a first inner volume of a first process chamber coupled to the transfer chamber, wherein the transfer volume and the first inner volume are fluidly coupled, injecting a calibration gas into the transfer volume to raise a pressure in the transfer volume and in the first inner volume to a second pressure, measuring the second pressure using each of a reference pressure gauge coupled to the transfer chamber and a first pressure gauge coupled to the first process chamber while the transfer volume and the first inner volume are fluidly coupled, and calibrating the first pressure gauge based on a difference in the measured second pressure between the reference pressure gauge and the first pressure gauge.

    摘要翻译: 本文公开了用于校准耦合到具有转移体积的转移室的一个或多个处理室中的压力计的系统和方法。 该方法包括在传送体积和连接到传送室的第一处理室的第一内部容积中提供第一压力,其中传送体积和第一内部体积被流体耦合,将校准气体注入到传送体积中 将传送体积和第一内部体积中的压力提高到第二压力,使用耦合到传送室的参考压力表中的每一个测量第二压力,以及耦合到第一处理室的第一压力表,同时传送体积和 第一内部体积流体耦合,并且基于测量的参考压力计和第一压力计之间的第二压力的差异校准第一压力计。

    METHODS FOR PROCESSING SUBSTRATES IN PROCESS SYSTEMS HAVING SHARED RESOURCES
    9.
    发明申请
    METHODS FOR PROCESSING SUBSTRATES IN PROCESS SYSTEMS HAVING SHARED RESOURCES 有权
    在具有共享资源的过程系统中处理基板的方法

    公开(公告)号:US20110265814A1

    公开(公告)日:2011-11-03

    申请号:US12915240

    申请日:2010-10-29

    IPC分类号: B08B6/00

    CPC分类号: H01L21/6719 H01J37/32899

    摘要: Methods for processing substrates in twin chamber processing systems having first and second process chambers and shared processing resources are provided herein. In some embodiments, a method may include flowing a process gas from a shared gas panel to a processing volume of the first process chamber and to a processing volume of the second process chamber; forming a first plasma in the first processing volume to process the first substrate and a second plasma to process the second substrate; monitoring the first processing volume and the second processing volume to determine if a process endpoint is reached in either volume; and either terminating the first and second plasma simultaneously when a first endpoint is reached; or terminating the first plasma when a first endpoint is reached in the first processing volume while continuing to provide the second plasma in the second processing volume until a second endpoint is reached.

    摘要翻译: 本文提供了具有第一处理室和第二处理室以及共享处理资源的双室处理系统中处理基板的方法。 在一些实施例中,一种方法可以包括使处理气体从共用气体面板流动到第一处理室的处理容积和第二处理室的处理容积; 在所述第一处理体积中形成第一等离子体以处理所述第一基板和第二等离子体以处理所述第二基板; 监测第一处理量和第二处理量以确定任一体积中是否达到过程终点; 并且当达到第一端点时同时终止第一和第二等离子体; 或在第一处理容积中达到第一端点时终止第一等离子体,同时继续在第二处理容积中提供第二等离子体直到达到第二端点。

    METHODS FOR MONITORING PROCESSING EQUIPMENT
    10.
    发明申请
    METHODS FOR MONITORING PROCESSING EQUIPMENT 有权
    监控加工设备的方法

    公开(公告)号:US20110270574A1

    公开(公告)日:2011-11-03

    申请号:US12915260

    申请日:2010-10-29

    IPC分类号: G06F15/00

    CPC分类号: H01L21/67276

    摘要: Methods for monitoring processing equipment are provided herein. In some embodiments, a method for monitoring processing equipment when in an idle state for a period of idle time may include selecting a test from a list of a plurality of tests to perform on the processing equipment when the processing equipment is in the idle state, wherein the test has a total run time; starting the selected test; comparing a remaining idle time of the period of idle time to a remaining run time of the total run time as the selected test is performed; and determining whether to end the selected test prior to completing the total run time in response to the comparison.

    摘要翻译: 本文提供了监控处理设备的方法。 在一些实施例中,一种用于在空闲状态下监视处理设备一段空闲时间的方法可以包括:当处理设备处于空闲状态时,从处理设备执行的多个测试的列表中选择一个测试, 其中所述测试具有总运行时间; 开始选择测试; 将执行所选择的测试的空闲时间的剩余空闲时间与总运行时间的剩余运行时间进行比较; 以及响应于所述比较,确定在完成所述总运行时间之前是否结束所选择的测试。