公开(公告)号：US20110265887A1

公开(公告)日：2011-11-03

申请号：US12907947

申请日：2010-10-19

申请人： JARED AHMAD LEE ,  MARTIN JEFF SALINAS ,  ANKUR AGARWAL ,  EZRA ROBERT GOLD ,  JAMES P. CRUSE ,  ANIRUDDHA PAL ,  ANDREW NGUYEN

发明人： JARED AHMAD LEE ,  MARTIN JEFF SALINAS ,  ANKUR AGARWAL ,  EZRA ROBERT GOLD ,  JAMES P. CRUSE ,  ANIRUDDHA PAL ,  ANDREW NGUYEN

IPC分类号： F15D1/00

CPC分类号： H01L21/67017 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/68785 ,  Y10T137/6416 ,  Y10T137/8593

摘要： Apparatus for the delivery of a gas to a chamber and methods of use thereof are provided herein. In some embodiments, a gas distribution system for a process chamber may include a body having a first surface configured to couple the body to an interior surface of a process chamber, the body having a opening disposed through the body; a flange disposed proximate a first end of the opening opposite the first surface of the body, the flange extending inwardly into the opening and configured to support a window thereon; and a plurality of gas distribution channels disposed within the body and fluidly coupling a channel disposed within the body and around the opening to a plurality of holes disposed in the flange, wherein the plurality of holes are disposed radially about the flange.

摘要翻译： 本文提供了将气体输送到室的装置及其使用方法。 在一些实施例中，用于处理室的气体分配系统可以包括主体，其具有构造成将主体连接到处理室的内表面的第一表面，主体具有穿过主体设置的开口; 靠近所述开口的与所述主体的第一表面相对的第一端附近的凸缘，所述凸缘向内延伸到所述开口中并且构造成在其上支撑窗户; 以及多个气体分配通道，其设置在所述主体内并且将设置在所述主体内并且围绕所述开口的通道流体连接到设置在所述凸缘中的多个孔，其中所述多个孔围绕所述凸缘径向设置。

公开(公告)号：US07741585B2

公开(公告)日：2010-06-22

申请号：US11929650

申请日：2007-10-30

申请人： David H. Quach ,  Martin Jeff Salinas

发明人： David H. Quach ,  Martin Jeff Salinas

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H05B3/68 ,  H01L21/67109 ,  H01L21/67184 ,  H01L21/67748

摘要： An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

摘要翻译： 一种集成热单元，包括：烘烤板，被配置为加热支撑在所述烘烤板的表面上的基底; 冷却板，被配置为冷却支撑在所述冷却板的表面上的基板; 以及衬底传送梭，其构造成将衬底从烘烤板转移到冷却板，其中衬底传送梭具有能够冷却由烘烤板加热的衬底的温度控制的衬底保持表面。

公开(公告)号：US07601934B2

公开(公告)日：2009-10-13

申请号：US11868453

申请日：2007-10-05

申请人： David H. Quach ,  Martin Jeff Salinas

发明人： David H. Quach ,  Martin Jeff Salinas

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01L21/67109 ,  G03F7/7075 ,  H01L21/67748

摘要： An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

摘要翻译： 一种集成热单元，包括：烘烤板，被配置为加热支撑在所述烘烤板的表面上的基底; 冷却板，被配置为冷却支撑在所述冷却板的表面上的基板; 以及衬底传送梭，其构造成将衬底从烘烤板转移到冷却板，其中衬底传送梭具有能够冷却由烘烤板加热的衬底的温度控制的衬底保持表面。

公开(公告)号：US20080145191A1

公开(公告)日：2008-06-19

申请号：US11689372

申请日：2007-03-21

申请人： Martin Jeff Salinas ,  Tetsuya Ishikawa ,  David H. Quach ,  Natarajan Ramanan

发明人： Martin Jeff Salinas ,  Tetsuya Ishikawa ,  David H. Quach ,  Natarajan Ramanan

IPC分类号： H01L21/677

CPC分类号： H01L21/67173 ,  H01L21/67109 ,  H01L21/67748

摘要： A substrate transport module adapted to transport a substrate in a processing chamber of a semiconductor processing apparatus. The substrate transport module includes a substrate cooling surface and a plurality of coolant channels disposed in the substrate transport module and in thermal communication with the substrate cooling surface. The substrate transport module also includes a plurality of vacuum channels disposed in the substrate transport module and a plurality of proximity pins extending to a predetermined height above the substrate cooling surface. Each of the plurality of proximity pins is in fluid communication with one or more of the plurality of vacuum channels.

摘要翻译： 一种适于在半导体处理装置的处理室中输送基板的基板输送模块。 衬底传送模块包括衬底冷却表面和布置在衬底输送模块中并与衬底冷却表面热连通的多个冷却剂通道。 衬底传送模块还包括设置在衬底传送模块中的多个真空通道和延伸到衬底冷却表面上方预定高度的多个接近销。 多个接近销中的每一个与多个真空通道中的一个或多个流体连通。

公开(公告)号：US07282675B2

公开(公告)日：2007-10-16

申请号：US11174988

申请日：2005-07-05

申请人： David H. Quach ,  Martin Jeff Salinas

发明人： David H. Quach ,  Martin Jeff Salinas

IPC分类号： H05B3/68

CPC分类号： H01L21/67184 ,  H01L21/67109 ,  H01L21/67742 ,  Y10S414/135

摘要： An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

摘要翻译： 一种集成热单元，包括：烘烤板，被配置为加热支撑在所述烘烤板的表面上的基底; 冷却板，被配置为冷却支撑在所述冷却板的表面上的基板; 以及衬底传送梭，其构造成将衬底从烘烤板转移到冷却板，其中衬底传送梭具有能够冷却由烘烤板加热的衬底的温度控制的衬底保持表面。

公开(公告)号：US20140087561A1

公开(公告)日：2014-03-27

申请号：US13985843

申请日：2012-02-29

申请人： Jared Ahmad Lee ,  Martin Jeff Salinas ,  Paul B. Reuter ,  Imad Yousif ,  Aniruddha Pal

发明人： Jared Ahmad Lee ,  Martin Jeff Salinas ,  Paul B. Reuter ,  Imad Yousif ,  Aniruddha Pal

IPC分类号： H01L21/677 ,  H01L21/306

CPC分类号： H01L21/67742 ,  C23C16/45517 ,  C23C16/4586 ,  H01L21/306 ,  H01L21/67751 ,  H01L21/68742

摘要： Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.

摘要翻译： 本发明的实施例提供了一种用于传送基板并将处理环境限制在室中的装置。 本发明的一个实施例提供一种用于使用处理室的环形组件。 环箍组件包括在其中限定限制区域的限制环和连接到箍的三个或更多个提升手指。 三个或更多个提升指状物构造成在限制环的内部容积之外支撑衬底。

公开(公告)号：US08562742B2

公开(公告)日：2013-10-22

申请号：US12907947

申请日：2010-10-19

申请人： Jared Ahmad Lee ,  Martin Jeff Salinas ,  Ankur Agarwal ,  Ezra Robert Gold ,  James P. Cruse ,  Aniruddha Pal ,  Andrew Nguyen

发明人： Jared Ahmad Lee ,  Martin Jeff Salinas ,  Ankur Agarwal ,  Ezra Robert Gold ,  James P. Cruse ,  Aniruddha Pal ,  Andrew Nguyen

IPC分类号： C23C16/00 ,  C23C16/455 ,  H01L21/3065

CPC分类号： H01L21/67017 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/68785 ,  Y10T137/6416 ,  Y10T137/8593

摘要： Apparatus for the delivery of a gas to a chamber and methods of use thereof are provided herein. In some embodiments, a gas distribution system for a process chamber may include a body having a first surface configured to couple the body to an interior surface of a process chamber, the body having a opening disposed through the body; a flange disposed proximate a first end of the opening opposite the first surface of the body, the flange extending inwardly into the opening and configured to support a window thereon; and a plurality of gas distribution channels disposed within the body and fluidly coupling a channel disposed within the body and around the opening to a plurality of holes disposed in the flange, wherein the plurality of holes are disposed radially about the flange.

摘要翻译： 本文提供了将气体输送到室的装置及其使用方法。 在一些实施例中，用于处理室的气体分配系统可以包括主体，其具有构造成将主体连接到处理室的内表面的第一表面，主体具有穿过主体设置的开口; 靠近所述开口的与所述主体的第一表面相对的第一端附近的凸缘，所述凸缘向内延伸到所述开口中并且构造成在其上支撑窗户; 以及多个气体分配通道，其设置在所述主体内并且将设置在所述主体内并且围绕所述开口的通道流体连接到设置在所述凸缘中的多个孔，其中所述多个孔围绕所述凸缘径向设置。

公开(公告)号：US20110269314A1

公开(公告)日：2011-11-03

申请号：US12905032

申请日：2010-10-14

申请人： JARED AHMAD LEE ,  JAMES P. CRUSE ,  ANDREW NGUYEN ,  CORIE LYNN COBB ,  MING XU ,  MARTIN JEFF SALINAS ,  ANCHEL SHEYNER

发明人： JARED AHMAD LEE ,  JAMES P. CRUSE ,  ANDREW NGUYEN ,  CORIE LYNN COBB ,  MING XU ,  MARTIN JEFF SALINAS ,  ANCHEL SHEYNER

IPC分类号： H01L21/3065

CPC分类号： H01L21/67109 ,  H01L21/6719

摘要： Process chambers having shared resources and methods of use are provided. In some embodiments, substrate processing systems may include a first process chamber having a first substrate support disposed within the first process chamber, wherein the first substrate support has a first heater and a first cooling plate to control a temperature of the first substrate support; a second process chamber having a second substrate support disposed within the second process chamber, wherein the second substrate support has a second heater and a second cooling plate to control a temperature of the second substrate support; and a shared heat transfer fluid source having an outlet to provide a heat transfer fluid to the first cooling plate and the second cooling plate and an inlet to receive the heat transfer fluid from the first cooling plate and the second cooling plate.

摘要翻译： 提供了具有共享资源和使用方法的过程室。 在一些实施例中，衬底处理系统可以包括第一处理室，其具有设置在第一处理室内的第一衬底支撑件，其中第一衬底支撑件具有第一加热器和第一冷却板以控制第一衬底支撑件的温度; 第二处理室，具有设置在所述第二处理室内的第二基板支撑件，其中所述第二基板支撑件具有第二加热器和第二冷却板，以控制所述第二基板支撑件的温度; 以及共用传热流体源，其具有出口以向第一冷却板和第二冷却板提供传热流体，以及从第一冷却板和第二冷却板接收传热流体的入口。

公开(公告)号：US20110265831A1

公开(公告)日：2011-11-03

申请号：US12907944

申请日：2010-10-19

申请人： JARED AHMAD LEE ,  MARTIN JEFF SALINAS ,  EZRA ROBERT GOLD ,  JAMES P. CRUSE

发明人： JARED AHMAD LEE ,  MARTIN JEFF SALINAS ,  EZRA ROBERT GOLD ,  JAMES P. CRUSE

IPC分类号： B08B5/00 ,  B08B13/00 ,  F15D1/00 ,  C23F1/08

CPC分类号： F17D3/03 ,  H01J37/3244 ,  H01J37/32899 ,  H01L21/02071 ,  H01L21/6719 ,  H01L21/67201 ,  Y10T137/0318 ,  Y10T137/877

摘要： A method and apparatus for supplying a gas mixture to a load lock chamber is described. In one embodiment, the apparatus supplies a gas mixture to a pair of process chambers, comprising a first ozone generator to provide a first gas mixture to a first process chamber, a second ozone generator to provide a second gas mixture to a second process chamber, a first gas source coupled to the first ozone generator via a first mass flow controller and a first gas line, and coupled to the second ozone generator via a second mass flow controller and a second gas line, and a second gas source coupled to the first ozone generator via a third mass flow controller and a third gas line and coupled to the second ozone generator via fourth mass flow controller and a fourth gas line.

摘要翻译： 描述了一种将气体混合物供应到负载锁定室的方法和装置。 在一个实施例中，该装置将气体混合物提供给一对处理室，包括第一臭氧发生器以向第一处理室提供第一气体混合物，第二臭氧发生器将第二气体混合物提供给第二处理室， 第一气体源，经由第一质量流量控制器和第一气体管线耦合到第一臭氧发生器，并且经由第二质量流量控制器和第二气体管线耦合到第二臭氧发生器，以及耦合到第一气体源的第一气体源 臭氧发生器，经由第三质量流量控制器和第三气体管线，并经由第四质量流量控制器和第四气体管线与第二臭氧发生器连接。

公开(公告)号：US20110094683A1

公开(公告)日：2011-04-28

申请号：US12821626

申请日：2010-06-23

申请人： ZHIGANG CHEN ,  SHAHID RAUF ,  KENNETH S. COLLINS ,  MARTIN JEFF SALINAS ,  SAMER BANNA ,  VALENTIN N. TODOROW

发明人： ZHIGANG CHEN ,  SHAHID RAUF ,  KENNETH S. COLLINS ,  MARTIN JEFF SALINAS ,  SAMER BANNA ,  VALENTIN N. TODOROW

IPC分类号： H05H1/24 ,  H01P5/12

CPC分类号： H05H1/46 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/32174

摘要： Apparatus for plasma processing are provided. In some embodiments, an RF feed structure includes a first RF feed to couple RF power to a plurality of symmetrically arranged stacked first RF coil elements; a second RF feed coaxially disposed about the first RF feed and electrically insulated therefrom, the second RF feed to couple RF power to a plurality of symmetrically arranged stacked second RF coil elements coaxially disposed with respect to the first RF coil elements. In some embodiments, a plasma processing apparatus includes a first RF coil; a second RF coil coaxially disposed with respect to the first RF coil; a first RF feed coupled to the first RF coil to provide RF power thereto; and a second RF feed coaxially disposed with respect to the first RF feed and electrically insulated therefrom, the second RF feed coupled to the second RF coil to provide RF power thereto.

摘要翻译： 提供等离子体处理装置。 在一些实施例中，RF馈送结构包括用于将RF功率耦合到多个对称布置的堆叠的第一RF线圈元件的第一RF馈送; 第二RF馈送，其围绕第一RF馈电同轴设置并与其电绝缘，第二RF馈送将RF功率耦合到相对于第一RF线圈元件同轴设置的多个对称布置的堆叠的第二RF线圈元件。 在一些实施例中，等离子体处理装置包括第一RF线圈; 相对于所述第一RF线圈同轴设置的第二RF线圈; 耦合到所述第一RF线圈以向其提供RF功率的第一RF馈送; 以及第二RF馈电，其相对于所述第一RF馈电同轴设置并与其电绝缘，所述第二RF馈电耦合到所述第二RF线圈以向其提供RF功率。