-
公开(公告)号：US20190023847A1
公开(公告)日：2019-01-24
申请号：US16081430
申请日：2017-02-28
发明人： Takeshi FUJIWARA , TAKAYUKI HATTORI , JYUNICHI INAGAKI , TAKAFUMI KUNINOBU , Kazuhiro TAKIZAWA , YASUYUKI AGARI , HIROSHI HIRANO , JOJI KADOTA , AKINORI OKADA
IPC分类号： C08G77/04 , C08L63/00 , C08K3/04 , C08K3/14 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , H01L23/373
摘要： This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.
-
公开(公告)号：US20200095472A1
公开(公告)日：2020-03-26
申请号：US16469148
申请日：2017-11-27
申请人： JNC CORPORATION
发明人： Shin KOGA , Takeshi FUJIWARA
IPC分类号： C09J7/38 , H01L21/48 , H01L23/373 , B32B37/00 , B32B7/06 , B32B7/12 , B32B27/30 , B32B37/12 , C09J7/20
摘要： To provide a heat radiation member having a smaller size and high performance. A transfer sheet including the following layers laminated in the following order: a release layer including a releasable film; a first adhesive layer, which includes a poly(vinyl formal) resin; a thermally conductive material layer including a carbon material; and a second adhesive layer, which includes a poly(vinyl formal) resin.
-
公开(公告)号：US20210101373A1
公开(公告)日：2021-04-08
申请号：US16499323
申请日：2018-03-29
申请人： JNC CORPORATION
IPC分类号： B32B27/08 , H05K1/03 , H01L23/373
摘要： The present application relates to a laminate between an inorganic substance and metal, which is excellent in thermal conductivity and interlayer adhesion. The laminate of the present application has a thermally conductive first inorganic filler bonded with one end of first coupling agent 11; and a metal layer bonded with one end of a third coupling agent, in which the other end of the third coupling agent is bonded with the other end of the first coupling agent. The laminate has such a bond between the inorganic filler and the metal layer through an organic compound, whereby the laminate may be excellent in thermal conductivity and interlayer adhesion.
-
公开(公告)号：US20210187902A1
公开(公告)日：2021-06-24
申请号：US16081424
申请日：2017-02-28
发明人： Takeshi FUJIWARA , Jyunichi INAGAKI , Yasuyuki AGARI , Hiroshi HIRANO , Joji KADOTA , Akinori OKADA
IPC分类号： B32B7/027 , B32B27/20 , H01L23/373 , C09K19/02 , C09K19/04
摘要： The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
-
公开(公告)号：US20190023900A1
公开(公告)日：2019-01-24
申请号：US16081426
申请日：2017-02-28
发明人： Takeshi FUJIWARA , Jyunichi INAGAKI , Masako HINATSU , Yasuyuki AGARI , Hiroshi HIRANO , Joji KADOTA , Akinori OKADA
摘要： The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
-
公开(公告)号：US20180002580A1
公开(公告)日：2018-01-04
申请号：US15543238
申请日：2016-01-13
申请人： JNC CORPORATION
发明人： Kento UJIIYE , Takeshi FUJIWARA
IPC分类号： C09J129/14 , H01G11/18 , H01G11/78 , H01M4/583 , B32B7/12 , C09J11/06 , B32B27/30 , H01L23/373 , H01G11/06 , H01G11/10
CPC分类号： C09J129/14 , B32B7/12 , B32B27/30 , B32B2457/10 , B32B2457/16 , B32B2605/08 , C09J11/06 , C09J201/06 , H01G11/06 , H01G11/10 , H01G11/18 , H01G11/78 , H01L23/36 , H01L23/3735 , H01M4/583 , C08K5/353 , C08L39/04
摘要： The invention relates to a composition for forming an adhesive layer, an adhesive layer, a manufacturing method for the adhesive layer, a composite material, a sheet, a heat dissipation member, an electronic device, a battery, a capacitor, an automobile component and a machine mechanism component, and the composition for forming the adhesive layer contains a polyvinyl acetal resin and a compound having an oxazoline group.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.02 秒)
