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10 条记录 (耗时 0.042 秒)

    Antenna pattern frame and method of manufacturing the same
    4.
    发明授权
    Antenna pattern frame and method of manufacturing the same 有权
    天线图案框架及其制造方法

    公开(公告)号：US08368597B2

    公开(公告)日：2013-02-05

    申请号：US12645992

    申请日：2009-12-23

    申请人： Jae Suk Sung ,  Dae Seong Jeon ,  Hyun Kil Nam ,  Sung Eun Cho ,  Tae Sung Kim ,  Chan Gwang An ,  Hyun Do Park ,  Chang Mok Han ,  Byung Hwa Lee ,  Jung Eun Noh

    发明人： Jae Suk Sung ,  Dae Seong Jeon ,  Hyun Kil Nam ,  Sung Eun Cho ,  Tae Sung Kim ,  Chan Gwang An ,  Hyun Do Park ,  Chang Mok Han ,  Byung Hwa Lee ,  Jung Eun Noh

    IPC分类号： H01Q1/38

    CPC分类号： H01Q1/38 ,  B29C45/14639 ,  B29C45/1671 ,  B29L2031/3456 ,  H01Q9/0471 ,  Y10T29/49016 ,  Y10T29/49018

    摘要： An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, while the antenna pattern portion is embedded in the electronic device case; and a contact surface extension provided on the radiator to prevent the radiator from being loosened from the radiator frame during injection molding of the radiator frame, and increasing a contact area with respect to the radiator frame.

    摘要翻译： 根据本发明的一个方面的天线图案框架可以包括：具有发射和接收信号的天线图案部分的散热器和允许信号传送到电子设备的电路板并从电子设备的电路板接收的连接端子部分; 连接部，其部分地形成所述散热器，并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 通过在散热器上注射成型制造的散热器框架，使得天线图案部分可以设置在散热器框架的一侧，并且连接端子部分可以设置在其另一侧，而天线图案部分嵌入电子 设备案例 以及设置在散热器上的接触表面延伸部，以防止散热器框架在注射模制期间散热器从散热器框架松动，并且增加相对于散热器框架的接触面积。

    Mobile communication terminal case and method of manufacturing the same
    6.
    发明授权
    Mobile communication terminal case and method of manufacturing the same 有权
    移动通信终端案例及其制造方法

    公开(公告)号：US08165645B2

    公开(公告)日：2012-04-24

    申请号：US12332244

    申请日：2008-12-10

    申请人： Byung Hwa Lee ,  Yong Won Yu ,  Hyun Sam Mun ,  Young Suk Kim

    发明人： Byung Hwa Lee ,  Yong Won Yu ,  Hyun Sam Mun ,  Young Suk Kim

    IPC分类号： H04M1/00

    CPC分类号： H01Q1/243 ,  H05K1/0284 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/0999 ,  H05K2201/10242

    摘要： There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.

    摘要翻译： 提供了一种移动通信终端壳体，包括：具有第一表面和与第一表面相对的第二表面的移动通信终端的壳体，以及穿过第一表面和第二表面形成的通孔; 设置在壳体的第一表面上的导电图案; 载体膜，设置在所述壳体的所述第一表面上以覆盖所述导电图案; 和导电环氧树脂填充通孔并且其一端与导电图案接触。

    Sonar system and impedance matching method thereof
    7.
    发明授权
    Sonar system and impedance matching method thereof 有权
    声纳系统及其阻抗匹配方法

    公开(公告)号：US09103905B2

    公开(公告)日：2015-08-11

    申请号：US13712169

    申请日：2012-12-12

    申请人： Jeong Min Lee ,  Byung Hwa Lee

    发明人： Jeong Min Lee ,  Byung Hwa Lee

    IPC分类号： G01S15/00 ,  G01S15/02 ,  G01S7/524 ,  B06B1/02 ,  G01V1/04

    CPC分类号： G01S15/02 ,  B06B1/0215 ,  G01S7/524 ,  G01V1/04

    摘要： This specification relates to an active SONAR system comprising a transmitter, a transducer and an impedance matching circuit for expanding bandwidth and increasing a power factor value in sound and ultrasonic wave bands by mutually matching resonant frequencies of the transducer and the impedance matching circuit or a resonant frequency between the transducer and the impedance matching circuit using an electrical equivalent model corresponding to actual impedance data of the transducer and controlling the positions and the intervals of the frequencies at which reactance components of the transducer including the impedance matching circuit become zero, and an impedance matching method thereof. This allows for efficient driving in a broadband between the transmitter and the transducer in the active SONAR system, contributing to output power performance and detection performance of the active SONAR system.

    摘要翻译： 本说明书涉及一种有源SONAR系统，其包括发射器，换能器和阻抗匹配电路，用于通过相互匹配换能器和阻抗匹配电路的谐振频率或共振，扩展带宽并增加声波和超声波波段中的功率因数值 使用与换能器的实际阻抗数据相对应的电等效模型来控制换能器和阻抗匹配电路之间的频率，并且控制包括阻抗匹配电路的换能器的电抗分量变为零的频率的位置和间隔，以及阻抗 匹配方法。 这允许在主动SONAR系统中的发射器和换能器之间的宽带中的有效驱动，有助于输出功率性能和有源SONAR系统的检测性能。

    Method for an equivalent circuit parameter estimation of a transducer and a sonar system using thereof
    8.
    发明授权
    Method for an equivalent circuit parameter estimation of a transducer and a sonar system using thereof 有权

    公开(公告)号：US10408927B2

    公开(公告)日：2019-09-10

    申请号：US15265375

    申请日：2016-09-14

    申请人： Jeong Min Lee ,  Byung Hwa Lee

    发明人： Jeong Min Lee ,  Byung Hwa Lee

    IPC分类号： G01S7/00 ,  G01S7/52 ,  G01S7/524

    摘要： The present disclosure relates to an active sonar system including a transmitter; a transducer; and an impedance matching circuit, and a method of estimating an equivalent model parameter of a multi-mode transducer, wherein an electrical equivalent model parameter having a plurality of stages corresponding to each mode is estimated by estimating an individual mode impedance and a total mode impedance from multi-mode impedance data and obtaining an interference amount of adjacent modes, and an equivalent model modeled thereby for which an interference effect by a multi-mode is taken into consideration is used for the design of an impedance matching circuit to minimize actual model fabrication and effectively derive detailed design elements and the like, thereby allowing an integrated circuit design with peripheral electronic units for interfacing the sonar system.

    BUILDING THAT USES COMPOSITE LIGHT-WEIGHT PANELS FOR STRUCTURE AND A CONSTRUCTION METHOD THEREFOR
    9.
    发明申请
    BUILDING THAT USES COMPOSITE LIGHT-WEIGHT PANELS FOR STRUCTURE AND A CONSTRUCTION METHOD THEREFOR 有权
    建筑物采用复合轻质结构板及其构造方法

    公开(公告)号：US20110036048A1

    公开(公告)日：2011-02-17

    申请号：US12937518

    申请日：2009-04-23

    申请人： Byung Hwa Lee ,  Kyung Hoon Kim

    发明人： Byung Hwa Lee ,  Kyung Hoon Kim

    IPC分类号： E04C2/284 ,  E04C2/24 ,  E04B1/62 ,  E04B2/00 ,  E04B7/00

    CPC分类号： E04B1/08 ,  E04C2/384

    摘要： The present invention relates to a building that uses composite light-weight panels for structure and a construction method therefor, more particularly, to a building constructed without pillars using composite light weight panels for structure and a construction method therefor, wherein the building comprises: a steel floor made out of sectional steel for example; walls which are formed by joining composite light-weight panels for structure having steel structure frames installed at corners to the steel floor by welding or joining means, neighboring steel structure frames being joined together by welding or joining means to form walls; roof frames which are constituted by a steel structure and have a truss structure to be positioned on the top of the walls and joined to the wall panels by welding or joining means; wall inner/outer coverings applied to the inner/outer peripherals of the walls; and roof coverings applied to the outer peripheral face of the roof frame.

    摘要翻译： 本发明涉及一种使用复合轻量面板的结构及其施工方法的建筑物，更具体地，涉及一种使用复合轻量面板进行结构的建筑物及其施工方法，其中建筑物包括： 例如用截面钢制成的钢地板; 通过将通过焊接或接合装置的钢结构框架安装在钢地板上的钢结构框架结合的复合轻量面板形成的壁，相邻的钢结构框架通过焊接或接合装置连接在一起以形成壁; 屋顶框架由钢结构构成，并具有定位在墙壁顶部的桁架结构，并通过焊接或接合方式与壁板接合; 墙壁内/外覆盖层施加到墙壁的内外周边; 以及施加到屋顶框架的外周面的屋顶覆盖物。

    Building that uses composite light-weight panels for structure and a construction method therefor
    10.
    发明授权
    Building that uses composite light-weight panels for structure and a construction method therefor 有权
    使用复合轻量面板的建筑结构及其施工方法

    公开(公告)号：US08607523B2

    公开(公告)日：2013-12-17

    申请号：US12937518

    申请日：2009-04-23

    申请人： Byung Hwa Lee ,  Kyung Hoon Kim

    发明人： Byung Hwa Lee ,  Kyung Hoon Kim

    IPC分类号： E04B1/02 ,  E04B1/35

    CPC分类号： E04B1/08 ,  E04C2/384

    摘要： The present invention relates to a building that uses composite light-weight panels for structure and a construction method therefor, more particularly, to a building constructed without pillars using composite light weight panels for structure and a construction method therefor, wherein the building comprises: a steel floor made out of sectional steel for example; walls which are formed by joining composite light-weight panels for structure having steel structure frames installed at corners to the steel floor by welding or joining means, neighboring steel structure frames being joined together by welding or joining means to form walls; roof frames which are constituted by a steel structure and have a truss structure to be positioned on the top of the walls and joined to the wall panels by welding or joining means; wall inner/outer coverings applied to the inner/outer peripherals of the walls; and roof coverings applied to the outer peripheral face of the roof frame.

    摘要翻译： 本发明涉及一种使用复合轻量面板的结构及其施工方法的建筑物，更具体地，涉及一种使用复合轻量面板进行结构的建筑物及其施工方法，其中建筑物包括： 例如用截面钢制成的钢地板; 通过将通过焊接或接合装置的钢结构框架安装在钢地板上的钢结构框架结合的复合轻量面板形成的壁，相邻的钢结构框架通过焊接或接合装置连接在一起以形成壁; 屋顶框架由钢结构构成，并具有定位在墙壁顶部的桁架结构，并通过焊接或接合方式与壁板接合; 墙壁内/外覆盖层施加到墙壁的内外周边; 以及施加到屋顶框架的外周面的屋顶覆盖物。