Transistor and method of forming the same
    1.
    发明授权
    Transistor and method of forming the same 有权
    晶体管及其形成方法

    公开(公告)号:US07919378B2

    公开(公告)日:2011-04-05

    申请号:US12397176

    申请日:2009-03-03

    IPC分类号: H01L21/336

    CPC分类号: H01L29/785 H01L29/66795

    摘要: According to some embodiments of the invention, a fin type transistor includes an active structure integrally formed with a silicon substrate. The active structure includes grooves that form blocking regions under source/drain regions. A gate structure is formed to cross the upper face of the active structure and to cover the exposed side surfaces of the lateral portions of the active structure. An effective channel length of a fin type transistor may be sufficiently ensured so that a short channel effect of the transistor may be prevented and the fin type transistor may have a high breakdown voltage.

    摘要翻译: 根据本发明的一些实施例,鳍型晶体管包括与硅衬底一体形成的有源结构。 活性结构包括在源极/漏极区域下形成阻挡区的沟槽。 栅极结构形成为跨越有源结构的上表面并且覆盖有源结构的侧部的暴露的侧表面。 可以充分确保翅片型晶体管的有效沟道长度,从而可以防止晶体管的短沟道效应,并且鳍式晶体管可能具有高击穿电压。

    Fin field effect transistor device and method of fabricating the same
    3.
    发明授权
    Fin field effect transistor device and method of fabricating the same 失效
    Fin场效应晶体管器件及其制造方法

    公开(公告)号:US07323375B2

    公开(公告)日:2008-01-29

    申请号:US11091457

    申请日:2005-03-28

    IPC分类号: H01L21/00

    摘要: Methods of forming field effect transistors (FETs) having fin-shaped active regions include patterning a semiconductor substrate to define a fin-shaped semiconductor active region therein, which is surrounded by a trench. At least an upper portion of the fin-shaped semiconductor active region is covered with a sacrificial layer. This sacrificial layer is selectively etched-back to define sacrificial spacers on sidewalls of the fin-shaped semiconductor active region. The electrically insulating region is formed on the sacrificial spacers. The sacrificial spacers are then removed by selectively etching the sacrificial spacers using the electrically insulating region as an etching mask. An insulated gate electrode is then formed on the sidewalls of the fin-shaped semiconductor active region.

    摘要翻译: 形成具有鳍状有源区的场效应晶体管(FET)的方法包括图案化半导体衬底以在其中限定由沟槽包围的鳍状半导体有源区。 鳍形半导体有源区域的至少上部被牺牲层覆盖。 该牺牲层被有选择地回蚀刻以在鳍状半导体有源区域的侧壁上限定牺牲隔离物。 电绝缘区域形成在牺牲间隔物上。 然后通过使用电绝缘区域作为蚀刻掩模选择性地蚀刻牺牲隔离物来去除牺牲间隔物。 然后在鳍状半导体有源区的侧壁上形成绝缘栅电极。

    Fin field effect transistor device and method of fabricating the same
    4.
    发明申请
    Fin field effect transistor device and method of fabricating the same 失效
    Fin场效应晶体管器件及其制造方法

    公开(公告)号:US20050250285A1

    公开(公告)日:2005-11-10

    申请号:US11091457

    申请日:2005-03-28

    摘要: Methods of forming field effect transistors (FETs) having fin-shaped active regions include patterning a semiconductor substrate to define a fin-shaped semiconductor active region therein, which is surrounded by a trench. At least an upper portion of the fin-shaped semiconductor active region is covered with a sacrificial layer. This sacrificial layer is selectively etched-back to define sacrificial spacers on sidewalls of the fin-shaped semiconductor active region. The electrically insulating region is formed on the sacrificial spacers. The sacrificial spacers are then removed by selectively etching the sacrificial spacers using the electrically insulating region as an etching mask. An insulated gate electrode is then formed on the sidewalls of the fin-shaped semiconductor active region.

    摘要翻译: 形成具有鳍状有源区的场效应晶体管(FET)的方法包括图案化半导体衬底以在其中限定由沟槽包围的鳍状半导体有源区。 鳍形半导体有源区域的至少上部被牺牲层覆盖。 该牺牲层被有选择地回蚀刻以在鳍状半导体有源区域的侧壁上限定牺牲隔离物。 电绝缘区域形成在牺牲间隔物上。 然后通过使用电绝缘区域作为蚀刻掩模选择性地蚀刻牺牲隔离物来去除牺牲间隔物。 然后在鳍状半导体有源区的侧壁上形成绝缘栅电极。

    Semiconductor device having a fin structure and method of manufacturing the same
    6.
    发明申请
    Semiconductor device having a fin structure and method of manufacturing the same 失效
    具有翅片结构的半导体器件及其制造方法

    公开(公告)号:US20060022262A1

    公开(公告)日:2006-02-02

    申请号:US11183995

    申请日:2005-07-19

    IPC分类号: H01L27/108

    摘要: A semiconductor device may include a fin structure having source/drain regions and channel fins connected between source/drain patterns. A gate insulation layer may be provided on the channel fins. A gate electrode may include lower gate patterns and an upper gate pattern. The lower gate patterns may extend in a vertical direction and contact the gate insulation layer. The upper gate pattern may extend in a second horizontal direction substantially perpendicular to the first horizontal direction. The upper gate pattern may be connected to upper portions of the lower gate patterns.

    摘要翻译: 半导体器件可以包括具有连接在源极/漏极图案之间的源极/漏极区域和沟道鳍片的鳍结构。 栅极绝缘层可以设置在通道散热片上。 栅电极可以包括下栅极图案和上栅极图案。 下栅极图案可以在垂直方向上延伸并接触栅极绝缘层。 上栅极图案可以在基本上垂直于第一水平方向的第二水平方向上延伸。 上栅极图案可以连接到下栅极图案的上部。

    Transistor and method of forming the same
    7.
    发明申请
    Transistor and method of forming the same 有权
    晶体管及其形成方法

    公开(公告)号:US20050194616A1

    公开(公告)日:2005-09-08

    申请号:US11070598

    申请日:2005-03-01

    CPC分类号: H01L29/785 H01L29/66795

    摘要: According to some embodiments of the invention, a fin type transistor includes an active structure integrally formed with a silicon substrate. The active structure includes grooves that form blocking regions under source/drain regions. A gate structure is formed to cross the upper face of the active structure and to cover the exposed side surfaces of the lateral portions of the active structure. An effective channel length of a fin type transistor may be sufficiently ensured so that a short channel effect of the transistor may be prevented and the fin type transistor may have a high breakdown voltage.

    摘要翻译: 根据本发明的一些实施例,鳍型晶体管包括与硅衬底一体形成的有源结构。 活性结构包括在源极/漏极区域下形成阻挡区的沟槽。 栅极结构形成为跨越有源结构的上表面并且覆盖有源结构的侧部的暴露的侧表面。 可以充分确保翅片型晶体管的有效沟道长度,从而可以防止晶体管的短沟道效应,并且鳍式晶体管可能具有高击穿电压。

    Semiconductor device having a channel pattern and method of manufacturing the same
    8.
    发明授权
    Semiconductor device having a channel pattern and method of manufacturing the same 有权
    具有沟道图案的半导体器件及其制造方法

    公开(公告)号:US07579648B2

    公开(公告)日:2009-08-25

    申请号:US11183997

    申请日:2005-07-19

    IPC分类号: H01L27/108

    摘要: A semiconductor device may include a tubular channel pattern vertically extending from a semiconductor substrate. A gate insulation layer may be provided on faces exposed through the channel pattern. A gate electrode may be provided on the gate insulation layer. The gate electrode may fill the channel pattern. A conductive region, which may serve as lower source/drain regions, may be formed at a surface portion of the semiconductor substrate. The conductive region may contact a lower portion of the channel pattern. A conductive pattern, which may serve as upper source/drain regions, may horizontally extend from an upper portion of the channel pattern.

    摘要翻译: 半导体器件可以包括从半导体衬底垂直延伸的管状沟道图案。 可以在通过通道图案暴露的面上设置栅极绝缘层。 栅极电极可以设置在栅极绝缘层上。 栅电极可以填充沟道图案。 可以在半导体衬底的表面部分处形成可用作下部源极/漏极区域的导电区域。 导电区域可以接触通道图案的下部。 可以用作上部源极/漏极区域的导电图案可以从沟道图案的上部部分水平延伸。

    Semiconductor device having a fin structure and method of manufacturing the same
    9.
    发明申请
    Semiconductor device having a fin structure and method of manufacturing the same 失效
    具有翅片结构的半导体器件及其制造方法

    公开(公告)号:US20080293203A1

    公开(公告)日:2008-11-27

    申请号:US12219984

    申请日:2008-07-31

    IPC分类号: H01L21/336

    摘要: A semiconductor device may include a fin structure having source/drain regions and channel fins connected between source/drain patterns. A gate insulation layer may be provided on the channel fins. A gate electrode may include lower gate patterns and an upper gate pattern. The lower gate patterns may extend in a vertical direction and contact the gate insulation layer. The upper gate pattern may extend in a second horizontal direction substantially perpendicular to the first horizontal direction. The upper gate pattern may be connected to upper portions of the lower gate patterns.

    摘要翻译: 半导体器件可以包括具有连接在源极/漏极图案之间的源极/漏极区域和沟道鳍片的鳍结构。 栅极绝缘层可以设置在通道散热片上。 栅电极可以包括下栅极图案和上栅极图案。 下栅极图案可以在垂直方向上延伸并接触栅极绝缘层。 上栅极图案可以在基本上垂直于第一水平方向的第二水平方向上延伸。 上栅极图案可以连接到下栅极图案的上部。