公开(公告)号：US5935871A

公开(公告)日：1999-08-10

申请号：US916297

申请日：1997-08-22

申请人： Janos Farkas ,  David Watts ,  Melissa Freeman

发明人： Janos Farkas ,  David Watts ,  Melissa Freeman

IPC分类号： H01L21/02 ,  H01L21/321 ,  H01L21/768 ,  H01L21/00

CPC分类号： H01L21/3212 ,  H01L21/02074 ,  H01L21/7684

摘要： A process has been developed for a post-chemical mechanical polishing cleaning/passivting step to remove slurry particles (52) and form a passivating film (64) from a portion of an interconnect material within a conductive layer (42) without attacking the interconnecting material. In one particular embodiment, a solution having a pH greater than the isoelectric point of alumina particles is exposed to the surface of an interconnect material of a conductive layer (42) to passivate a portion of the interconnect material while changing the charge of the slurry particles (52) such that they are repelled away from the surface of the substrate and removed by the cleaning solution, or other cleaning processes.

摘要翻译： 已经开发了用于后化学机械抛光清洗/钝化步骤以从导电层（42）内的互连材料的一部分去除浆料颗粒（52）并形成钝化膜（64）的方法，而不侵害互连材料 。 在一个具体实施方案中，将具有大于氧化铝颗粒的等电点的pH的溶液暴露于导电层（42）的互连材料的表面，以钝化一部分互连材料，同时改变浆料颗粒的电荷 （52），使得它们被排出离开基板的表面并被清洁溶液或其它清洁过程除去。

公开(公告)号：US5897375A

公开(公告)日：1999-04-27

申请号：US954190

申请日：1997-10-20

申请人： David Watts ,  Rajeev Bajaj ,  Sanjit Das ,  Janos Farkas ,  Chelsea Dang ,  Melissa Freeman ,  Jaime A. Saravia ,  Jason Gomez ,  Lance B. Cook

发明人： David Watts ,  Rajeev Bajaj ,  Sanjit Das ,  Janos Farkas ,  Chelsea Dang ,  Melissa Freeman ,  Jaime A. Saravia ,  Jason Gomez ,  Lance B. Cook

IPC分类号： B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  B24B1/00

CPC分类号： C23F3/00 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472

摘要： A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abrasive slurry such as alumna abrasive, an optional triazole or triazole derivative, and a remaining balance of a solvent such as deionized water. The use of the slurry (24) polishes the copper layer (22) with a high rate of removal whereby pitting and corrosion of the copper layer (22) is reduced and good copper interconnect planarity is achieved. This slurry (24) has good selectivity of copper to oxide, and results in copper devices which have good electrical performance. In addition, disposal of the slurry (24) is not environmentally difficult since the slurry (24) is environmentally sound when compared to other prior art slurries.

摘要翻译： 通过形成铜层（22）开始化学机械抛光（CMP）铜层（22）的方法。 然后将铜层（22）暴露于浆料（24）。 浆料（24）含有氧化剂如H 2 O 2，羧酸盐如柠檬酸铵，研磨浆如校准研磨剂，任选的三唑或三唑衍生物，剩余的溶剂如去离子水。 浆料（24）的使用以高的去除速度抛光铜层（22），从而降低了铜层（22）的点蚀和腐蚀，并实现了良好的铜互连平面性。 这种浆料（24）具有铜对氧化物的良好选择性，并且导致具有良好电性能的铜器件。 此外，浆料（24）的处理不是环境困难的，因为与其它现有技术的浆料相比，浆料（24）是无害环境的。

公开(公告)号：US20050260855A1

公开(公告)日：2005-11-24

申请号：US11114907

申请日：2005-04-26

申请人： David Watts

发明人： David Watts

IPC分类号： B24B37/04 ,  H01L21/00 ,  H01L21/302 ,  H01L21/321 ,  H01L21/4763 ,  H01L21/768 ,  H01L21/8242

CPC分类号： H01L21/3212 ,  B24B37/042 ,  H01L21/67092 ,  H01L21/7684 ,  H01L27/10852

摘要： A method for planarizing a semiconductor wafer includes providing a fluid on a surface of the wafer, the fluid containing particles, and generating a field to apply a force to the particles, the force having a component that is normal to the surface such that the particles contact the surface to remove material therefrom. Alternative methods, semiconductor devices and semiconductor processing apparatuses are also disclosed.

摘要翻译： 用于平坦化半导体晶片的方法包括在晶片的表面上提供流体，含有颗粒的流体，并且产生一个对颗粒施加力的场，该力具有与表面垂直的分量，使得颗粒 接触表面以从中去除材料。 还公开了替代方法，半导体器件和半导体处理装置。

公开(公告)号：US06379463B1

公开(公告)日：2002-04-30

申请号：US09422845

申请日：1999-10-21

申请人： John Kelley ,  David Watts

发明人： John Kelley ,  David Watts

IPC分类号： B05C1100

CPC分类号： B05C1/0813 ,  B05C1/0834

摘要： A web coating apparatus having a partially submerged drum in a tray of coating material. The drum rotates and transfers coating material from the tray to a web material passing over the drum. A control system carefully controls the level of the coating material in the tray using an ultrasonic fluid level sensor in combination with a programmable system that can add or remove coating material to or from the tray.

摘要翻译： 一种幅材涂布装置，其具有在涂料托盘中的部分浸没的滚筒。 滚筒旋转并将涂料从托盘转移到通过滚筒的卷材上。 控制系统使用超声波液位传感器与可编程系统组合地仔细地控制托盘中的涂层材料的水平，该可编程系统可以向托盘或从托盘添加或去除涂料。

公开(公告)号：US4493120A

公开(公告)日：1985-01-15

申请号：US434767

申请日：1982-10-18

申请人： David Watts

发明人： David Watts

IPC分类号： A47D13/06 ,  A47C29/00

CPC分类号： A47D13/063

摘要： A portable and collapsible playpen has two side walls supported under tension by a pair of poles bent in the form of an arch and crossing each other like an "X" midway of their length. The poles are divided into segments for ease of assembling and segments of each pole nest together inside a hub at both front and back ends of the pen.

摘要翻译： 便携式和可折叠的幼儿围栏具有两个侧壁，这两个侧壁由一对弯曲成弓形的极柱支撑，并且像其长度中间的“X”彼此相交。 这些极被分成多个段以便于组装，并且每个极点的段在笔的前端和后端处于毂内。