摘要:
Physical barriers (210) are present between neighbouring pixels (200) on a circuit substrate (100) of an active-matrix display device, such as an electroluminescent display formed with LEDs (25) of organic semiconductor materials. The invention forms at least parts of the barriers (210) with metal or other electrically-conductive material (240) that is insulated (40) from the LEDs but connected to the circuitry (4, 5, 6, 9, 140, 150, 160, T1, T2, Tm, Tg, Ch etc.) within the substrate (100). This conductive barrier material (240) may back up or replace, for example, matrix addressing lines (150) and/or form an additional component either within the pixel array or outside. The additional component comprising the conductive barrier material (240) is advantageously a capacitor (Ch), or an inductor (L) or transformer (W), or even an aerial.
摘要:
Physical barriers (210) are present between neighbouring pixels (200) on a circuit substrate (100) of an active-matrix electroluminescent display device, particularly with LEDs (25) of organic semi conductor materials. The invention forms these barriers (210) with metal or other electrically-conductive material (240), that is insulated (40) from the LEDs but connected circuitry within the substrate (100). This conductive barrier material (240) backs-up or replaces at least a part of the drive supply line (140,240) to which the LEDs are connected by a drive element T1. This transfers the problem of line resistance and associated voltage drop from within the circuit substrate (100), where it is severely constrained, to the much freer environment of the pixel barriers (210) on the substrate (100) where the conductive barrier material (240) can provide much lower resistance. Very large displays can be made with low voltage drops along this composite drive supply line (140,240). Furthermore, the structure can be optimised to form a smoothing capacitor (Cs) between this drive supply line (240,240) with its conductive barrier material (240) and the further supply line (230) of the LED upper electrodes (23) extending on an insulating coating (40) over the top of the conductive barrier material (240).
摘要:
Physical barriers (210) are present between neighbouring pixels (200) on a circuit substrate (100) of an active-matrix electroluminescent display device, particularly with LEDs (25) of organic semiconductor materials. In order to reduce parasitic capacitance in the circuit substrate, the invention forms these barriers (210) with metal or other electrically-conductive material (240) that provides at least part of the signal lines (160) at a higher level than the circuit substrate (100). This conductive barrier material (240) is connected to the matrix circuitry within the substrate (100) but is insulated (40) at least at the sides adjacent to the LEDs (25). Preferably, an inter-capacitance guard line (9) is included in the circuit substrate (100) between the signal lines (160) and the circuitry in the substrate (100).
摘要:
Physical barriers (210) are present between neighbouring pixels (200) on a circuit substrate (100) of an active-matrix electroluminescent display device, particularly with LEDs (25) of organic semiconductor materials. The invention forms these barriers (210) with metal or other electrically-conductive material (240) that serves as an interconnection between a first circuit element (21, 4, 5, 6, 140, 150, 160, T1, T2, Tm, Tg, Ch) of the circuit substrate and a second circuit element (400, 400s, 23), for example, a sensor (400s) of a sensor array supported over the pixel array. The conductive barrier material (240) is insulated (40) at the sides of the barriers adjacent to the LEDs and has an un-insulated top connection area (240t) at which the second circuit element is connected to the conductive barrier material (240).
摘要:
An active matrix display device comprises an array of display pixels, with each pixel comprising an EL display element, a light-dependent device for detecting the brightness of the display element and a drive transistor circuit for driving a current through the display element. The drive transistor is controlled in response to the light-dependent device output so that ageing compensation can be implemented. The light-dependent device is located laterally of the area of light emitting material of the EL display element. In this way, the light-dependent device does not cause step coverage problems and can be integrated into the pixel layout without affecting the pixel aperture. Furthermore, the light dependent device can extend alongside the full length of the area of light emitting material so that it receives light input from a large part of the display element area.
摘要:
A method of manufacturing an electronic device comprising a bottom-gate TFT (12) is provided, the method comprising the steps of: forming a doped amorphous silicon gate layer (26′) on a substrate, the gate layer defining a gate (26), forming a gate insulating layer (32) over the gate, forming an amorphous silicon active layer (28′) over the gate insulating layer and overlying at least part of the gate, and annealing the amorphous silicon active layer to form a polysilicon active layer (28). A thinner gate insulating layer can be used giving a TFT having a low threshold voltage.
摘要:
An electronic device (70) comprises a thin film transistor (TFT) (9,59), the TFT including a channel (16) defined in a layer of polycrystalline semiconductor material (10,48). The polycrystalline semiconductor material is produced by crystallising amorphous semiconductor material (2) using metal atoms (6) to promote the crystallisation process. The polycrystalline semiconductor material (10) includes an average concentration of metal atoms in the range 1.3×1018 to 7.5×1018 atoms/cm3. This enables polycrystalline semiconductor TFTs to be formed with leakage properties acceptable for use in active matrix displays using a metal induced crystallisation process of duration significantly less that previously thought necessary. Furthermore, this process duration reduction facilitates the reliable fabrication of poly-Si TFTs having bottom gates formed of metal.
摘要翻译:电子器件(70)包括薄膜晶体管(TFT)(9,59),TFT包括限定在多晶半导体材料层(10,48)中的沟道(16)。 通过使用金属原子(6)使非晶半导体材料(2)结晶以促进结晶过程来生产多晶半导体材料。 多晶半导体材料(10)包括在1.3×10 18至7.5×10 18原子/ cm 3之间的金属原子的平均浓度。 这使得多晶半导体TFT可以形成为可用于有源矩阵显示器中的泄漏特性,其使用的金属诱导结晶过程的持续时间明显少于以前认为必要的时间。 此外,该工艺持续时间缩短有助于可靠地制造具有由金属形成的底部栅极的多晶硅TFT。
摘要:
An active matrix display device comprises an array of display pixels provided over a common substrate (60). Each pixel has an upwardly emitting current-driven light emitting display element (2) comprising a lower electrode (74) and an upper substantially transparent electrode (80a. A light sensitive device (27) for sensing the display element (2) light output is positioned between the substrate (60) and the display element (2), and a drive transistor (22) is controlled in response to the light-sensitive device (27) output. The lower electrode (74) of the display element is partially transmissive to transmit at most 20% of the light incident on the lower electrode, at least a portion of the transmitted light being directed to the underlying light-sensitive device (27).
摘要:
An active plate (2) for an active matrix display device (16), the active plate (2) comprising a substrate (4), a pixel area (6) and an adjacent drive circuit area (8). Both areas include polycrystalline silicon material formed by a process in which a metal is used to enhance the crystallisation process (MIC poly-Si), but only the MIC poly-Si in the drive circuit area (8) is subjected to an irradiation process using an energy beam (10). TFTs are fabricated with MIC poly-Si which have leakage currents in the off state sufficiently low for them to be acceptable for use as switching elements in the pixel area of matrix display devices. As only the drive circuit area (8) need be irradiated to provide poly-Si having the desired mobility, the time taken by the irradiation process can be significantly reduced.
摘要:
A method of manufacturing an electronic device comprising a thin film transistor (42), comprises forming a hydrogen-containing layer (22) over a semiconductor layer (10; 20), irradiating the hydrogen-containing layer so as to hydrogenate the semiconductor layer, and then forming electrodes (24; 26, 28) over the semiconductor layer. A short diffusion length and direct path is provided for the hydrogen thus allowing rapid hydrogenation of the semiconductor layer using relatively few, high-fluence laser pulses. The supporting substrate (12) is not heated significantly making the method particularly useful for TFFs on polymer substrates. Crystallisation and hydrogenation of the semiconductor layer can be executed in the same irradiation step.