Protective covering for swim platform located on a boat
    4.
    发明授权
    Protective covering for swim platform located on a boat 失效
    位于船上的游泳池的防护罩

    公开(公告)号:US5698288A

    公开(公告)日:1997-12-16

    申请号:US726692

    申请日:1996-10-07

    申请人: Jeff Barnes

    发明人: Jeff Barnes

    IPC分类号: B63B17/02 B32B9/00

    摘要: A protective covering for a swim platform located on a boat is provided. The protective covering may be detachably attached over the top of a swim platform, such as those platforms which are located about the rear of boats or other marine craft. Use of the protective covering will prevent waterfowl or other animals from defecating, loitering or nesting on the swim platform. The covering includes a generally rectangular portion located intermediate a right wing portion and a left wing portion. A plurality of apertures designed to secure the covering to the swim platform are provided on the rectangular portion, right wing portion and left wing portion. Both the right wing and the left wing fold forming a right sidewall and a left sidewall. The sidewalls and rectangular portion form a hollow, generally triangular structure which is placed atop and resides in the area immediately atop the swim platform. The covering is securely attached to the swim platform by any of a variety of attachment means. This prevents any other objects from occupying the swim platform. By extending the length of the rectangular portion, the protective covering may also have application in preventing birds from defecating, loitering or nesting on building ledges.

    摘要翻译: 提供了一种位于船上的游泳平台的防护罩。 保护性覆盖物可以可拆卸地附接在游泳平台的顶部上,例如位于船或其他海洋工艺的后部的那些平台。 使用防护罩可防止水禽或其他动物在游泳池上排便,游荡或嵌套。 覆盖物包括位于右翼部分和左翼部分之间的大致矩形的部分。 在矩形部分,右翼部分和左翼部分上设置有多个设计用于将覆盖物固定到游泳平台的孔。 右翼和左翼折叠都形成右侧壁和左侧壁。 侧壁和矩形部分形成中空的,大致三角形的结构,其被放置在顶部并且位于紧邻游泳平台顶部的区域中。 覆盖物通过各种附接装置中的任何一个牢固地附接到游泳平台。 这可以防止任何其他物体占据游泳平台。 通过延长矩形部分的长度,防护罩也可以用于防止鸟类在建筑物突起上排便,游荡或嵌套。

    Compositions for processing of semiconductor substrates
    6.
    发明授权
    Compositions for processing of semiconductor substrates 有权
    用于处理半导体衬底的组合物

    公开(公告)号:US07923423B2

    公开(公告)日:2011-04-12

    申请号:US11046262

    申请日:2005-01-27

    IPC分类号: C11D7/50

    摘要: Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

    摘要翻译: 可用于半导体制造用于诸如半导体器件前体结构的晶片衬底的表面制备和/或清洁的组合物。 组合物可用于处理具有或将要进一步加工以包括铜金属化的晶片,例如在诸如表面处理,预镀清洗,后蚀刻清洁和后化学机械抛光 清洁半导体晶圆。 组合物包含(i)链烷醇胺,(ii)季铵氢氧化物和(iii)络合剂,并且是储存稳定的,以及在暴露于氧气时不变暗和降解。

    Compositions for processing of semiconductor substrates
    7.
    发明申请
    Compositions for processing of semiconductor substrates 有权
    用于处理半导体衬底的组合物

    公开(公告)号:US20060166847A1

    公开(公告)日:2006-07-27

    申请号:US11046262

    申请日:2005-01-27

    IPC分类号: C11D7/32

    摘要: Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

    摘要翻译: 可用于半导体制造用于诸如半导体器件前体结构的晶片衬底的表面制备和/或清洁的组合物。 组合物可用于处理具有或将要进一步加工以包括铜金属化的晶片,例如在诸如表面处理,预镀清洗,后蚀刻清洁和后化学机械抛光 清洁半导体晶圆。 组合物包含(i)链烷醇胺,(ii)季铵氢氧化物和(iii)络合剂,并且是储存稳定的,以及在暴露于氧气时不变暗和降解。