摘要:
A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
摘要:
A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
摘要:
A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species. The system also includes a hardener mixture that has an amino hydrogen equivalent weight of from 35 to 90 and contains at least 90% by weight of a mixture of (i) from 5 to 75% of the combined weight of (i), (ii) and (iii) of one or more compounds that have at least two primary and/or secondary aliphatic amino groups and which have no phenolic groups; (ii) from 10 to 95% of the combined weight of (i), (ii) and (iii) of one or more aminophenol compounds that contain one or more primary and/or secondary aliphatic amino groups and at least one phenolic group and (iii) from 0 to 50% of the combined weight of (i), (ii) and (iii) of one or more phenolic compounds that contain two or more phenolic groups and do not contain primary or secondary amino groups. The epoxy resin component and hardener mixture are present in amounts sufficient to provide from 1.05 to 1.35 equivalents of aliphatic amine hydrogens per equivalent of epoxide groups provided by the epoxy resin component. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.
摘要:
A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species. The system also includes a hardener mixture that has an amino hydrogen equivalent weight of from 35 to 90 and contains at least 90% by weight of a mixture of (i) from 5 to 75% of the combined weight of (i), (ii) and (iii) of one or more compounds that have at least two primary and/or secondary aliphatic amino groups and which have no phenolic groups; (ii) from 10 to 95% of the combined weight of (i), (ii) and (iii) of one or more aminophenol compounds that contain one or more primary and/or secondary aliphatic amino groups and at least one phenolic group and (iii) from 0 to 50% of the combined weight of (i), (ii) and (iii) of one or more phenolic compounds that contain two or more phenolic groups and do not contain primary or secondary amino groups. The epoxy resin component and hardener mixture are present in amounts sufficient to provide from 1.05 to 1.35 equivalents of aliphatic amine hydrogens per equivalent of epoxide groups provided by the epoxy resin component. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.
摘要:
A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
摘要翻译:具有降低结晶倾向的液体环氧树脂组合物,其包含至少一种具有以下通用化学结构(I)的液体环氧树脂:其中n为0或1或更大的整数; 并且其中n = 0在约1重量%至约90重量%之间的范围内; 其中; n = 1在约7重量%至约20重量%的范围内; n = 2在约0.8重量%和约3重量%之间的范围内; n = 3以上,在约0重量%〜约2重量%的范围内。
摘要:
The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the ‘Inversion Installation Method,’ or the ‘Pull-in Installation Method’. The invention also relates to a cured-in-place pipe that is prepared by this process.
摘要:
A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
摘要:
A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) polyol toughening agent; and a process for preparing the curable epoxy resin composition.
摘要:
The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the ‘Inversion Installation Method,’ or the ‘Pull-in Installation Method’. The invention also relates to a cured-in-place pipe that is prepared by this process.