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1.发明授权Method of mapping a surface using a probe for stylus nanoprofilometry having a non-circular cross-section 有权使用具有非圆形横截面的触笔纳米流变测定法的探针绘制表面的方法公开(公告)号：US06250143B1
公开(公告)日：2001-06-26
申请号：US09386711
申请日：1999-08-31
IPC分类号： G01H2300
CPC分类号： G01Q60/38 , G01Q70/10 , H01L22/12 , Y10S977/878
摘要： The present invention provides an apparatus and a method of manufacturing that apparatus. More specifically, to a method of manufacturing probes for a stylus nanoprofilometer having a non-circular probe tip geometry and a method of measurement of semiconductor wafer features using the same. In one embodiment, the probe comprises an upper portion couplable to the stylus nanoprofilometer and a probative portion coupled to the upper portion. The probative portion has a cross section that is substantially thinner than a cross section of the upper portion. The probative portion further has a terminus distal the upper portion and a reentrant angle from the terminus to the upper portion.
摘要翻译： 本发明提供一种制造该装置的装置和方法。 更具体地，涉及一种制造具有非圆形探针尖端几何形状的触针式纳米探针计探针的探针的方法和使用其的半导体晶片特征的测量方法。 在一个实施例中，探针包括可与触针纳米玻璃体计量器耦合的上部和耦合到上部的识别部分。 证明部分具有比上部的横截面更薄的横截面。 证明部分还具有远离上部的终端和从终端到上部的折返角。
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2.发明授权Probe tip locator having improved marker arrangement for reduced bit encoding error 有权探针尖端定位器具有改进的标记布置以减少位编码误差公开(公告)号：US06425189B1
公开(公告)日：2002-07-30
申请号：US09552892
申请日：2000-04-20
IPC分类号： G01B900
CPC分类号： G01B11/002 , G01Q30/06 , G01Q40/02 , Y10S977/851
摘要： A probe tip locator for, and method of, use in determining a location of a probe tip relative to the probe tip locator comprising sets of discrete location markers in which numbers and positions of the location markers in each of the sets are employable uniquely to identify corresponding specific locations on the probe tip locator, the sets being distributed about the probe tip locator to avoid unbalanced partial encroachments into both sides of a scanpath of the probe tip by location markers in sets normally adjacent the scanpath thereby to prevent an erroneous determination of location caused by unbalanced partial encroachments of the location markers into both sides of the scanpath as the probe tip traverses the scanpath.
摘要翻译： 用于确定探针尖端相对于探针尖端定位器的位置的探针尖端定位器，其包括一组离散位置标记，其中每个组中的位置标记的数量和位置可用于唯一地识别 探针尖端定位器上的对应的特定位置，这些组围绕探针尖端定位器分布，以避免通常位于与扫描路径相邻的组中的位置标记在探针尖端的扫描路径的两侧不平衡的部分侵入，从而防止位置的错误确定 由于探针尖端穿过扫描路径，位置标记不均匀部分侵入扫描路径的两侧。
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公开(公告)号：US06727720B2
公开(公告)日：2004-04-27
申请号：US09941085
申请日：2001-08-28
IPC分类号： G01R3102
CPC分类号： G01R3/00 , B82Y10/00 , G01R1/06755 , Y10S977/876
摘要： A probe comprising a probe body having a body longitudinal axis and a shoulder, and a microstylet mechanically coupled to the shoulder, and a method of manufacturing the same. The microstylet extends from the shoulder and has a microstylet longitudinal axis coincident the body longitudinal axis with the microstylet having a cross section substantially smaller than a cross section of the probe body.
摘要翻译： 一种探针，包括具有身体纵向轴线和肩部的探针体和机械地联接到肩部的微型步骤及其制造方法。 微型电动工具从肩部延伸，并且具有与主体纵向轴线重合的微型电子管纵向轴线，该微型电极具有基本上小于探针主体横截面的横截面。
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公开(公告)号：US06577970B2
公开(公告)日：2003-06-10
申请号：US09801455
申请日：2001-03-08
IPC分类号： G01N3700
CPC分类号： G01N23/225
摘要： The present invention provides a method of determining a crystallographic quality of a material located on a substrate. The method includes determining a set of crystallographic solutions for an unknown crystallographic orientation, and subsequently comparing the set of crystallographic solutions to adjacent known crystallographic orientations to determine the unknown crystallographic orientation. In a preferred embodiment, the set of crystallographic solutions may be a rank of crystallographic solutions which may represent the most probable crystallographic orientations. The rank of crystallographic solutions, in an alternative embodiment, may be represented by a vote, a fit and a confidence index.
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公开(公告)号：US06714892B2
公开(公告)日：2004-03-30
申请号：US09967119
申请日：2001-09-28
IPC分类号： G06F1500
CPC分类号： G03F7/70491 , G03F7/70625 , Y10S977/852
摘要： A system and method of metrology (10) whereby a three dimensional shape profile is defined (16) for a surface feature on a substrate by applying (38) a transform function F(x) to an image intensity map I(x,y) obtained (40) by inspecting the substrate with a scanning electron microscope (12). The transform function F(x) is developed (34) by correlating the image intensity map of a first wafer (18) to a height vector (32) obtained by inspecting the first wafer with a more accurate metrology tool, for example a stylus nanoprofilometer (14). A simple ratio-based transform may be used to develop F(x). An asymmetric multiple parameter characterization of the three dimensional shape profile may be developed (74) by plotting critical space and width dimensions (SL, SR, W1, WR) from a vertical axis (C—C) as a function of height of the feature.
摘要翻译： 一种计量系统和方法（10），其中通过将变换函数F（x）应用于图像强度图I（x，y）（38）来定义（16）用于衬底上的表面特征的三维形状轮廓， 通过用扫描电子显微镜（12）检查基板得到（40）。 通过将第一晶片（18）的图像强度图与通过用更精确的计量工具检查第一晶片获得的高度矢量（32）相关联来开发变换函数F（x），例如，触笔纳米玻璃体计 （14）。 可以使用简单的基于比例的变换来开发F（x）。 可以通过从垂直轴（C-C）绘制关键空间和宽度尺寸（SL，SR，W1，WR）作为特征的高度的函数来开发三维形状轮廓的不对称多参数表征（74）。
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公开(公告)号：US06534851B1
公开(公告)日：2003-03-18
申请号：US09642376
申请日：2000-08-21
IPC分类号： H01L2306
CPC分类号： H01L21/67346 , H01L22/20 , H01L22/34
摘要： A modular substrate-based processing scheme for producing semiconductor devices provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or they may be individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.
摘要翻译： 用于制造半导体器件的基于模块化基板的处理方案提供多个模块化处理单元，其可以被布置在一起以形成各种内聚处理单元中的任何一个，或者可以通过标准半导体处理设备单独或顺序地处理。 整体处理单元被一体处理，提供要同时处理的多个模块化处理单元。 模块化处理单元可以由安装在诸如陶瓷材料的另外的基板上的厚半导体衬底或半导体衬底形成。 模块化处理单元可以各自包含肋，槽，柱或其他特征以帮助处理和放置各个单元。
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公开(公告)号：US5804460A
公开(公告)日：1998-09-08
申请号：US931066
申请日：1997-09-15
申请人： Jeffrey Bruce Bindell , Dennis Earl Schrope , Fred Anthony Stevie , Richard J. Dare , Larry E. Plew
发明人： Jeffrey Bruce Bindell , Dennis Earl Schrope , Fred Anthony Stevie , Richard J. Dare , Larry E. Plew
CPC分类号： H01L22/20 , H01L22/12 , Y10S977/852 , Y10S977/86 , Y10S977/869 , Y10S977/881 , Y10S977/888
摘要： Illustratively, the present invention includes a method of integrated circuit manufacturing which includes forming a raised topological feature upon a first substrate. A portion of the raised feature is removed, thereby exposing a cross sectional view of the raised feature with the substrate remaining substantially undamaged. The cross sectional view has a critical dimension. The critical dimension of the cross sectional view is measured using a first measuring instrument. Then the critical dimension is measured using a second measuring instrument. The measurements of the first and second measuring instruments are correlated. Then, using the second measuring instrument, raised features via plurality of second substrates are measured.
摘要翻译： 说明性地，本发明包括集成电路制造方法，其包括在第一基板上形成凸起的拓扑特征。 升高的部分的一部分被去除，从而暴露凸起特征的横截面图，其中基底保持基本上未损坏。 截面图具有临界尺寸。 使用第一测量仪器测量横截面视图的临界尺寸。 然后使用第二测量仪器测量临界尺寸。 第一和第二测量仪器的测量值相关。 然后，使用第二测量仪器，测量经由多个第二基板的凸起特征。
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公开(公告)号：US06713409B2
公开(公告)日：2004-03-30
申请号：US10303280
申请日：2002-11-25
IPC分类号： H01L2100
CPC分类号： H01L21/67346 , H01L22/20 , H01L22/34
摘要： A manufacturing method using a modular substrate-based processing scheme for producing semiconductor devices, provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.
摘要翻译： 使用基于模块化的基于基板的处理方法来制造半导体器件的制造方法提供了多个模块化处理单元，其可以被布置在一起以形成任何各种内聚处理单元，或者通过标准半导体处理设备单独地或顺序地处理。 整体处理单元被一体处理，提供要同时处理的多个模块化处理单元。 模块化处理单元可以由安装在诸如陶瓷材料的另外的基板上的厚半导体衬底或半导体衬底形成。 模块化处理单元可以各自包含肋，槽，柱或其他特征以帮助处理和放置各个单元。
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公开(公告)号：US06405584B1
公开(公告)日：2002-06-18
申请号：US09412130
申请日：1999-10-05
申请人： Jeffrey Bruce Bindell , Erik Cho Houge , Larry E. Plew , Terri Lynn Shofner , Fred Anthony Stevie
发明人： Jeffrey Bruce Bindell , Erik Cho Houge , Larry E. Plew , Terri Lynn Shofner , Fred Anthony Stevie
IPC分类号： G01B528
CPC分类号： G01Q60/38 , Y10S977/862 , Y10S977/878
摘要： A scanning probe microscope includes a sensor head adjacent a stage for holding a sample, a scanning actuator for positioning the sensor head relative to the sample, and a probe carried by the sensor head. The probe preferably includes a base connected to the sensor head, a shank extending from the base at an angle offset from perpendicular to the base, and a tip connected to a distal end of the shank for contacting the sample. The angle is preferably in a range of 5 to 20°. The tip is preferably laterally offset from the base to permit viewing of the tip without interference from the shank and the base. Thus, the location of the probe tip relative to the sample may be more easily determined.
摘要翻译： 扫描探针显微镜包括与用于保持样品的台相邻的传感器头，用于相对于样品定位传感器头的扫描致动器和由传感器头承载的探针。 探针优选地包括连接到传感器头的基座，从基部延伸的角度与垂直于基部的角度偏离的杆，以及连接到柄的远端以用于接触样本的尖端。 该角度优选在5〜20°的范围内。 顶端优选地从基部侧向偏移以允许观察尖端而不受到柄和基部的干扰。 因此，可以更容易地确定探针尖端相对于样品的位置。
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10.发明授权公开(公告)号：US06246060B1
公开(公告)日：2001-06-12
申请号：US09197351
申请日：1998-11-20
申请人： Michael A. Ackeret , Jeffry B. Bindell , Charles E. Bryson, III , Larry E. Plew , Catherine B. Vartuli , Xiao-Zhong Wu
发明人： Michael A. Ackeret , Jeffry B. Bindell , Charles E. Bryson, III , Larry E. Plew , Catherine B. Vartuli , Xiao-Zhong Wu
IPC分类号： H01J3720
CPC分类号： H01J37/20
摘要： Apparatus for holding and aligning a sample to be examined by a scanning electron microscope or the like includes an alignment device having base structure installable in the scanning electron microscope in a predetermined orientation. The alignment device also includes a holder for the sample which is mounted to the base structure for rotative movement about a rotation axis relative to the base structure. An adjuster is mounted on the base structure and can be manipulated to rotate the sample holder about the rotation axis. This alignment device is installed in a base holder and a video camera captures an image of the sample held by the sample holder. The image is displayed on a video monitor and the adjuster is then manipulated to rotatively align the sample to a desired orientation. The alignment device, including the sample, may then be removed from the base holder and installed in the scanning electron microscope with the sample being properly aligned.
摘要翻译： 用于通过扫描电子显微镜等保持和对准待检查样品的装置包括具有可以预定取向安装在扫描电子显微镜中的基底结构的对准装置。 对准装置还包括用于样品的保持器，其被安装到基部结构，用于相对于基部结构围绕旋转轴线的旋转运动。 调节器安装在基座结构上，并且可以被操纵以使样本保持器围绕旋转轴线旋转。 该对准装置安装在基座中，摄像机捕获由样品架保持的样品的图像。 图像显示在视频监视器上，然后操纵调节器以将样品旋转对准到期望的取向。 然后可以将包括样品的对准装置从基座移除并安装在扫描电子显微镜中，使样品正确对准。
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