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    Handheld Medical Devices Including Microwave Amplifier Unit At Device Handle
    4.
    发明申请
    Handheld Medical Devices Including Microwave Amplifier Unit At Device Handle 有权
    手持式医疗设备包括微波放大器单元在设备手柄

    公开(公告)号：US20130072921A1

    公开(公告)日：2013-03-21

    申请号：US13237068

    申请日：2011-09-20

    申请人： Robert J. Behnke, II ,  Jeffrey L. Jensen ,  Scott E. M. Frushour ,  Wayne L. Moul

    发明人： Robert J. Behnke, II ,  Jeffrey L. Jensen ,  Scott E. M. Frushour ,  Wayne L. Moul

    IPC分类号： A61B18/18

    CPC分类号： A61B18/1815 ,  A61B2018/00922 ,  A61B2018/1823 ,  A61B2090/0807

    摘要： A medical device includes a handle assembly and a probe-and-amplifier assembly. The handle assembly includes a handle body defining a chamber therein. The probe-and-amplifier assembly includes a probe and a microwave amplifier unit. The probe extends distally from the distal end of the handle assembly. The microwave amplifier unit is disposed within the chamber. The microwave amplifier unit and the probe are mechanically coupled to one another to form a unitary body. The probe-and-amplifier assembly is selectively removable from the handle assembly.

    摘要翻译： 医疗设备包括手柄组件和探针和放大器组件。 手柄组件包括在其中限定室的手柄主体。 探头和放大器组件包括探针和微波放大器单元。 探头从手柄组件的远端向远端延伸。 微波放大器单元设置在室内。 微波放大器单元和探头彼此机械耦合以形成整体。 探头和放大器组件可选择性地从手柄组件移除。

    Vessel sealing using microwave energy
    6.
    发明授权
    Vessel sealing using microwave energy 有权
    船用密封用微波能量

    公开(公告)号：US09259268B2

    公开(公告)日：2016-02-16

    申请号：US13312172

    申请日：2011-12-06

    申请人： Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen ,  Wayne L. Moul

    发明人： Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen ,  Wayne L. Moul

    IPC分类号： A61B18/18 ,  A61B18/00 ,  A61B17/29

    CPC分类号： A61B18/1815 ,  A61B17/29 ,  A61B2018/0016 ,  A61B2018/00404 ,  A61B2018/00559 ,  A61B2018/0063 ,  A61B2018/00791 ,  A61B2018/00875 ,  A61B2018/183

    摘要： An end effector assembly includes a pair of opposing jaw members movable from a first position in spaced relation relative to one another to at least one subsequent position wherein the jaw members cooperate to grasp tissue therebetween. Each of the jaw members includes a microwave antenna assembly and a shielding member including a metallic plate coupled to ground and a dielectric material. The end effector assembly also includes a splitter configured to receive an active signal from a source of microwave energy and split the active signal into a first signal transmitted to the microwave antenna assembly in one of the jaw members and a second signal transmitted in the microwave antenna assembly in the other jaw member.

    摘要翻译： 端部执行器组件包括一对相对的钳口构件，其可以从第一位置相对于彼此间隔开地移动到至少一个随后的位置，其中钳口构件协作以在其间抓握组织。 每个钳口构件包括微波天线组件和包括耦合到地面的金属板和介电材料的屏蔽构件。 末端执行器组件还包括分配器，其被配置为从微波能量源接收有源信号，并将有源信号分解成在其中一个钳口构件中传送到微波天线组件的第一信号和在微波天线中传输的第二信号 组装在另一个颚构件中。

    Printed circuit boards including strip-line circuitry and methods of manufacturing same
    8.
    发明授权
    Printed circuit boards including strip-line circuitry and methods of manufacturing same 失效
    印刷电路板包括带状线路电路及其制造方法

    公开(公告)号：US08766104B2

    公开(公告)日：2014-07-01

    申请号：US13352909

    申请日：2012-01-18

    申请人： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    发明人： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    IPC分类号： H05K1/16 ,  H05K1/18 ,  H05K3/46

    CPC分类号： H05K1/183 ,  H01P3/088 ,  H01P11/003 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/4694 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0969 ,  H05K2203/063 ,  Y10T29/49124

    摘要： A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough. The multi-layer printed circuit board further includes a first signal layer disposed in association with the first electrically-insulating layer of the first layer stack or the third electrically-insulating layer of the second layer stack, a second signal layer disposed in association with the second electrically-insulating layer of the first layer stack, and a device at least partially disposed within the cut-out area and electrically-coupled to the first and second signal layers.

    摘要翻译： 多层印刷电路板包括第一层堆叠和耦合到第一层堆叠的第二层堆叠。 第一层堆叠包括第一电绝缘层，第二电绝缘层和设置在第一和第二电绝缘层之间的第一导电层。 第二层包括第三电绝缘层和第二导电层。 第一层堆叠和/或第二层堆叠包括限定从其延伸的空隙的切口区域。 多层印刷电路板还包括与第一层堆叠的第一电绝缘层或第二层堆叠的第三电绝缘层相关联地设置的第一信号层，与第二层堆叠相关联地布置的第二信号层 第一层堆叠的第二电绝缘层，以及至少部分地设置在切除区域内并电耦合到第一和第二信号层的器件。

    Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same
    9.
    发明申请
    Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same 有权
    包括剥线电路的印刷电路板及其制造方法相同

    公开(公告)号：US20130180105A1

    公开(公告)日：2013-07-18

    申请号：US13353019

    申请日：2012-01-18

    申请人： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    发明人： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    IPC分类号： H05K3/10

    CPC分类号： H05K1/0253 ,  H01P11/003 ,  H05K1/0203 ,  H05K1/023 ,  H05K1/024 ,  H05K1/186 ,  H05K2201/0187 ,  H05K2201/1056 ,  Y10T29/49155

    摘要： A method of manufacturing a printed circuit board includes the steps of providing a first layer stack including a first electrically-conductive layer and a first electrically-insulating layer and providing a second layer stack including a second electrically-insulating layer. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second electrically-insulating layer includes one or more electrically-conductive traces disposed on a first surface thereof. The method also includes mounting a device on the first surface of the second electrically-insulating layer such that the device is electrically-coupled to at least one of the one or more electrically-conductive traces, and providing the first layer stack with a cut-out area defining a void that extends from the second surface of the first electrically-insulating layer to the first surface of the first electrically-conductive layer. The cut-out area is configured to receive at least a portion of the device therein.

    摘要翻译： 制造印刷电路板的方法包括以下步骤：提供包括第一导电层和第一电绝缘层的第一层堆叠，并提供包括第二电绝缘层的第二层堆叠。 第一导电层设置在第一电绝缘层的第一表面上。 第二电绝缘层包括设置在其第一表面上的一个或多个导电迹线。 该方法还包括将装置安装在第二电绝缘层的第一表面上，使得该装置与一个或多个导电迹线中的至少一个电耦合，并且提供第一层叠层， 该区域限定从第一电绝缘层的第二表面延伸到第一导电层的第一表面的空隙。 切除区域被配置为在其中接收设备的至少一部分。