公开(公告)号：US20110175240A1

公开(公告)日：2011-07-21

申请号：US13076947

申请日：2011-03-31

Applicant: Jian-Cheng CHEN

Inventor： Jian-Cheng CHEN

IPC: H01L23/48

CPC classification number: H01L23/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a plurality of passive units is assembled on the substrate in the style of encircling the chip. Then, a first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. Then, a second glue structure is filled in the encircled area so that the chip is covered by the second glue structure.

Abstract translation: 提供了芯片模块及其制造方法。 首先，提供基板。 接下来，将芯片组装在基板上并与基板电连接。 之后，以围绕芯片的方式将多个无源单元组装在基板上。 然后，在被动单元之间填充第一胶结构，使得由第一胶结构和被动单元限定环绕的区域。 然后，在包围的区域填充第二胶结构，使得芯片被第二胶结构覆盖。

公开(公告)号：US20100001389A1

公开(公告)日：2010-01-07

申请号：US12478434

申请日：2009-06-04

Applicant: Jian-Cheng CHEN

Inventor： Jian-Cheng CHEN

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L23/5383 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure for radio frequency module and a manufacturing method thereof are provided. The package structure includes a multi-layer substrate, a first chip, a second chip, a number of solder bumps, a first molding compound and a second molding compound. The substrate includes a metallic middle layer and has a first and a second surfaces. The first and the second chips respectively disposed on the first and the second surfaces are electrically connected to the substrate. The first molding compound is disposed on the first surface and covers the first chip. The solder bumps disposed on the second surface are respectively electrically connected to the first and the second chips via the substrate. The second molding compound disposed on the second surface covers the second chip and encircles the sidewalls of the solder bumps, and the connection surfaces of solder bumps are exposed outside the second molding compound.

Abstract translation: 提供射频模块的封装结构及其制造方法。 封装结构包括多层基板，第一芯片，第二芯片，多个焊料凸块，第一模塑料和第二模塑料。 基板包括金属中间层并且具有第一表面和第二表面。 分别设置在第一和第二表面上的第一和第二芯片电连接到基板。 第一模塑料置于第一表面上并覆盖第一芯片。 设置在第二表面上的焊料凸块经由衬底分别电连接到第一和第二芯片。 设置在第二表面上的第二模塑料覆盖第二芯片并且环绕焊料凸块的侧壁，并且焊料凸块的连接表面暴露在第二模塑料外部。

公开(公告)号：US20120086893A1

公开(公告)日：2012-04-12

申请号：US13031230

申请日：2011-02-20

Applicant: Yao-Jen OU ,  Hang-Lian LEE ,  Jian-Cheng CHEN ,  Bo-Chin TSUEI

Inventor： Yao-Jen OU ,  Hang-Lian LEE ,  Jian-Cheng CHEN ,  Bo-Chin TSUEI

IPC: G02F1/1337 ,  B29C67/00 ,  G02F1/1335

CPC classification number: G02F1/133788

Abstract: A photo alignment process and a liquid crystal display using the same are provided. The photo alignment process includes the following steps. A photo alignment material layer is formed on a substrate. The photo alignment material layer is irradiated by a linearly polarized light. A surface of the photo alignment material layer is a first plane. A wave vector of the linearly polarized light is a K vector. A second plane is constructed from a normal vector of the first plane and the K vector. A polarization direction of the linearly polarized light is neither perpendicular nor parallel to the second plane.

Abstract translation: 提供光取向处理和使用其的液晶显示器。 照片对准过程包括以下步骤。 在基片上形成光取向材料层。 光线取向材料层被线偏振光照射。 光取向材料层的表面是第一平面。 线偏振光的波矢是K矢量。 第二平面由第一平面和K向量的法向量构成。 线偏振光的偏振方向既不垂直也不平行于第二平面。

公开(公告)号：US20120057114A1

公开(公告)日：2012-03-08

申请号：US13084799

申请日：2011-04-12

Applicant: Jian-Cheng CHEN ,  Chih-Yung HSIEH ,  Bo-Chin TSUEI

Inventor： Jian-Cheng CHEN ,  Chih-Yung HSIEH ,  Bo-Chin TSUEI

IPC: G02F1/1337

CPC classification number: G02F1/133707 ,  G02F1/133753 ,  G02F1/134309

Abstract: A liquid crystal display (LCD) structure is provided. A first alignment layer and a first electrode layer are disposed on a liquid crystal layer. A second electrode layer and a second alignment layer disposed under the liquid crystal layer. The first alignment layer and the second alignment layer respectively have a plurality of alignment areas with different aligning directions. At least one of the first electrode layer and the second electrode layer includes a substrate material and a plurality of openings, and at least includes a plurality of electrode areas. The boundaries of the electrode areas correspond to the boundaries of the alignment areas. The directions of the openings in the electrode areas are between the aligning directions of the corresponding alignment areas of the first alignment layer and the second alignment layer.

Abstract translation: 提供了液晶显示（LCD）结构。 第一取向层和第一电极层设置在液晶层上。 设置在液晶层下方的第二电极层和第二取向层。 第一取向层和第二取向膜分别具有不同的取向方向的多个取向区域。 第一电极层和第二电极层中的至少一个包括基板材料和多个开口，并且至少包括多个电极区域。 电极区域的边界对应于对准区域的边界。 电极区域中的开口方向位于第一取向层和第二取向层的对应取向区域的​​对准方向之间。

公开(公告)号：US20110157537A1

公开(公告)日：2011-06-30

申请号：US12980738

申请日：2010-12-29

Applicant: Jian-Cheng CHEN ,  Chien-Hong CHEN ,  Chih-Yung HSIEH ,  Wei LO ,  Chun-Hsu LIN ,  Ching-Che YANG ,  Jia-Lun CHEN

Inventor： Jian-Cheng CHEN ,  Chien-Hong CHEN ,  Chih-Yung HSIEH ,  Wei LO ,  Chun-Hsu LIN ,  Ching-Che YANG ,  Jia-Lun CHEN

IPC: G02F1/1333

CPC classification number: G02F1/134336 ,  G02F1/133707 ,  G02F1/133753 ,  G02F1/1393 ,  G02F2001/133796

Abstract: A substrate with a multi-domain vertical alignment pixel structure is provided. The substrate is opposite to a counter substrate with a common electrode, and a liquid crystal layer is disposed between the substrate and the counter substrate. The substrate includes a scan line and a data line, an active device, first and second patterned pixel electrodes and a voltage drop layer. Wherein, the first patterned pixel electrode provides a first electrical field to the liquid crystal layer, and the second patterned pixel electrode provides a second electrical field to the liquid crystal layer. The voltage drop layer makes the first electrical field smaller than the second electrical field.

Abstract translation: 提供具有多域垂直对准像素结构的衬底。 基板与具有公共电极的对置基板相对，并且液晶层设置在基板和对置基板之间。 衬底包括扫描线和数据线，有源器件，第一和第二图案化像素电极和电压降层。 其中，第一图案化像素电极向液晶层提供第一电场，第二图案化像素电极为液晶层提供第二电场。 电压降层使得第一电场小于第二电场。