公开(公告)号：US08593245B2

公开(公告)日：2013-11-26

申请号：US12787893

申请日：2010-05-26

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

IPC分类号： H01F38/30 ,  H01F27/36 ,  H01F27/32 ,  H01F5/00 ,  H01F27/28

CPC分类号： H01F27/2885

摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

公开(公告)号：US20100301981A1

公开(公告)日：2010-12-02

申请号：US12787893

申请日：2010-05-26

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

IPC分类号： H01F17/00

CPC分类号： H01F27/2885

摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

公开(公告)号：US20140085848A1

公开(公告)日：2014-03-27

申请号：US14094811

申请日：2013-12-03

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/02 ,  H01F17/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.

摘要翻译： 公开了组装电路，其中组装电路包括具有顶表面，底表面和侧表面的电感器，其中多个导体中的每一个通过电感器的一个侧表面从顶表面延伸到底表面 其中电路板设置在所述第一电子部件的顶表面上并电连接到所述多个导体，以及设置在所述电感器的底表面上的多个引脚用于连接到另一个电路板。

公开(公告)号：US08624701B2

公开(公告)日：2014-01-07

申请号：US13602326

申请日：2012-09-04

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01F5/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

摘要翻译： 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部电连接到第二导电段。

公开(公告)号：US20100255282A1

公开(公告)日：2010-10-07

申请号：US12754021

申请日：2010-04-05

申请人： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

发明人： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

IPC分类号： H01F27/36 ,  H01F7/00 ,  H01F1/01 ,  C08L83/00 ,  C08L79/08 ,  C08K9/00 ,  C08K3/40

CPC分类号： H01F3/08 ,  H01F1/22 ,  H01F1/36 ,  H01F5/06 ,  H01F17/04 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T428/249922 ,  Y10T428/2933

摘要： A high temperature resistant insulating composition includes an organic polymer and an inorganic binder. The inorganic binder is ranged between 10% and 90% by weight of the high temperature resistant insulating composition. The high temperature resistant insulating composition still possesses strength and insulating property after a high temperature treatment.

摘要翻译： 耐高温绝缘组合物包括有机聚合物和无机粘合剂。 无机粘合剂的范围为耐高温绝缘组合物的10重量％至90重量％。 耐高温绝缘组合物在高温处理后仍然具有强度和绝缘性能。

公开(公告)号：US20120327625A1

公开(公告)日：2012-12-27

申请号：US13602326

申请日：2012-09-04

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/06

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

摘要翻译： 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部与第二导电段电连接。

公开(公告)号：US20150228400A1

公开(公告)日：2015-08-13

申请号：US14696382

申请日：2015-04-25

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01F27/29 ,  H01F27/28

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.

摘要翻译： 公开了一种电气部件，所述电气部件包括：具有顶表面，底表面的磁体，其中至少一个第一导电通孔从所述磁体的顶表面到底表面形成; 以及设置在所述磁体中的线圈，其中所述线圈的第一端电连接到所述至少一个第一导电通孔中的一个。

公开(公告)号：US08283789B2

公开(公告)日：2012-10-09

申请号：US12348105

申请日：2009-01-02

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01L23/02

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

摘要翻译： 公开了一种包括电感元件，连接导体和第一电子部件的组装电路。 连接导体适于包裹电感元件的第一表面。 第一个电子元件堆叠在电感元件上。 组装电路通过连接导体与载体电连接。

公开(公告)号：US20090175014A1

公开(公告)日：2009-07-09

申请号：US12348105

申请日：2009-01-02

申请人： JIAN-HONG Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： JIAN-HONG Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

摘要翻译： 公开了一种包括电感元件，连接导体和第一电子部件的组装电路。 连接导体适于包裹电感元件的第一表面。 第一个电子元件堆叠在电感元件上。 组装电路通过连接导体与载体电连接。

公开(公告)号：US20080238374A1

公开(公告)日：2008-10-02

申请号：US12044392

申请日：2008-03-07

申请人： Jian-Ping Ying ,  Ai-Bin Qiu ,  Jian-Hong Zeng ,  Zi-Ying Zhou

发明人： Jian-Ping Ying ,  Ai-Bin Qiu ,  Jian-Hong Zeng ,  Zi-Ying Zhou

IPC分类号： G05F1/70

CPC分类号： H02M3/157 ,  H02M2001/0009 ,  H02M2001/0012

摘要： A sampling method with adjusting duty ratios is provided and includes the following steps. A first working pulse signal which has a pulse-width duty ratio D in a switching period Ts is provided. A first adjusting period comprising first N successive switching periods of the first working pulse signal is set, wherein N is a natural number larger than 1. A second working pulse signal which has second N successive switching periods with their corresponding pulse-width duty ratio D1, D2, . . . , DN to drive the switch in the converter circuit is provided and the measured signal is generated, wherein the sum of D1, D2, . . . , DN substantially equals to N·D and the second N successive switching periods constitute a second adjusting period.

摘要翻译： 提供了具有调节占空比的采样方法，包括以下步骤。 提供在开关周期T S中具有脉冲宽度占空比D的第一工作脉冲信号。 设置包括第一工作脉冲信号的第一N个连续切换周期的第一调整周期，其中N是大于1的自然数。具有第二N个连续切换周期的第二工作脉冲信号，其相应的脉冲宽度占空比D 1 ，D 2 。 。 。 提供用于驱动转换器电路中的开关的D N N，并且产生测量信号，其中D 1，D 2，N 2， ，。 。 。 D N基本上等于N.D，第二N个连续切换周期构成第二调整周期。