利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.024 秒)

    Coil assembly and magnetic element with shielding function
    2.
    发明授权
    Coil assembly and magnetic element with shielding function 有权
    线圈组件和磁性元件具有屏蔽功能

    公开(公告)号：US08593245B2

    公开(公告)日：2013-11-26

    申请号：US12787893

    申请日：2010-05-26

    申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

    发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

    IPC分类号： H01F38/30 ,  H01F27/36 ,  H01F27/32 ,  H01F5/00 ,  H01F27/28

    CPC分类号： H01F27/2885

    摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

    摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

    COIL ASSEMBLY AND MAGNETIC ELEMENT WITH SHIELDING FUNCTION
    5.
    发明申请
    COIL ASSEMBLY AND MAGNETIC ELEMENT WITH SHIELDING FUNCTION 有权
    线圈组件和具有屏蔽功能的磁体元件

    公开(公告)号：US20100301981A1

    公开(公告)日：2010-12-02

    申请号：US12787893

    申请日：2010-05-26

    申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

    发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

    IPC分类号： H01F17/00

    CPC分类号： H01F27/2885

    摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

    摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

    POWER SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    POWER SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    功率半导体封装结构及其制造方法

    公开(公告)号：US20120181706A1

    公开(公告)日：2012-07-19

    申请号：US13084292

    申请日：2011-04-11

    申请人： Jian-Hong ZENG ,  Shou-Yu Hong

    发明人： Jian-Hong ZENG ,  Shou-Yu Hong

    IPC分类号： H01L23/538 ,  H01L21/50

    CPC分类号： H01L23/49524 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/73 ,  H01L25/071 ,  H01L25/074 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： A power semiconductor package structure includes a carrier, a first power chip, a second power chip, a first conductive sheet, a second conductive sheet and a third conductive sheet. The first power chip has a first surface and a second surface opposing to the first surface. A first control electrode and a first main power electrode are disposed on the first surface, and a second main power electrode is disposed on the second surface. The second surface is disposed on the carrier, and electrically connected to the carrier through the second main power electrode. The second power chip has a third surface and a fourth surface opposing to the third surface. A third main power electrode is disposed on the third surface, and a fourth main power electrode is disposed on the fourth surface. The fourth surface is disposed on the first power chip. The first conductive sheet is electrically connected to the first main power electrode and the fourth main power electrode. The second conductive sheet is electrically connected to the third main power electrode. The third conductive sheet is electrically connected to the first control electrode. At least a part of the first control electrode is non-covered by the second power chip along a projection direction, which is perpendicular to the carrier.

    摘要翻译： 功率半导体封装结构包括载体，第一功率芯片，第二功率芯片，第一导电薄片，第二导电薄片和第三导电薄片。 第一功率芯片具有与第一表面相对的第一表面和第二表面。 第一控制电极和第一主电极设置在第一表面上，第二主电极设置在第二表面上。 第二表面设置在载体上，并通过第二主电极与载体电连接。 第二功率芯片具有与第三表面相对的第三表面和第四表面。 第三主电源电极设置在第三表面上，第四主电源设置在第四表面上。 第四表面设置在第一功率芯片上。 第一导电片电连接到第一主电源电极和第四主电源电极。 第二导电片与第三主电极电连接。 第三导电片与第一控制电极电连接。 第一控制电极的至少一部分沿着垂直于载体的投影方向被第二功率芯片未被覆盖。