公开(公告)号：US20120327625A1

公开(公告)日：2012-12-27

申请号：US13602326

申请日：2012-09-04

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/06

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

摘要翻译： 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部与第二导电段电连接。

公开(公告)号：US08283789B2

公开(公告)日：2012-10-09

申请号：US12348105

申请日：2009-01-02

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01L23/02

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

摘要翻译： 公开了一种包括电感元件，连接导体和第一电子部件的组装电路。 连接导体适于包裹电感元件的第一表面。 第一个电子元件堆叠在电感元件上。 组装电路通过连接导体与载体电连接。

公开(公告)号：US20100301981A1

公开(公告)日：2010-12-02

申请号：US12787893

申请日：2010-05-26

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

IPC分类号： H01F17/00

CPC分类号： H01F27/2885

摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

公开(公告)号：US20090175014A1

公开(公告)日：2009-07-09

申请号：US12348105

申请日：2009-01-02

申请人： JIAN-HONG Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： JIAN-HONG Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

摘要翻译： 公开了一种包括电感元件，连接导体和第一电子部件的组装电路。 连接导体适于包裹电感元件的第一表面。 第一个电子元件堆叠在电感元件上。 组装电路通过连接导体与载体电连接。

公开(公告)号：US20150228400A1

公开(公告)日：2015-08-13

申请号：US14696382

申请日：2015-04-25

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01F27/29 ,  H01F27/28

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.

摘要翻译： 公开了一种电气部件，所述电气部件包括：具有顶表面，底表面的磁体，其中至少一个第一导电通孔从所述磁体的顶表面到底表面形成; 以及设置在所述磁体中的线圈，其中所述线圈的第一端电连接到所述至少一个第一导电通孔中的一个。

公开(公告)号：US08593245B2

公开(公告)日：2013-11-26

申请号：US12787893

申请日：2010-05-26

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

IPC分类号： H01F38/30 ,  H01F27/36 ,  H01F27/32 ,  H01F5/00 ,  H01F27/28

CPC分类号： H01F27/2885

摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

公开(公告)号：US20140085848A1

公开(公告)日：2014-03-27

申请号：US14094811

申请日：2013-12-03

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/02 ,  H01F17/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.

摘要翻译： 公开了组装电路，其中组装电路包括具有顶表面，底表面和侧表面的电感器，其中多个导体中的每一个通过电感器的一个侧表面从顶表面延伸到底表面 其中电路板设置在所述第一电子部件的顶表面上并电连接到所述多个导体，以及设置在所述电感器的底表面上的多个引脚用于连接到另一个电路板。

公开(公告)号：US08624701B2

公开(公告)日：2014-01-07

申请号：US13602326

申请日：2012-09-04

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01F5/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

摘要翻译： 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部电连接到第二导电段。

公开(公告)号：US20100255282A1

公开(公告)日：2010-10-07

申请号：US12754021

申请日：2010-04-05

申请人： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

发明人： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

IPC分类号： H01F27/36 ,  H01F7/00 ,  H01F1/01 ,  C08L83/00 ,  C08L79/08 ,  C08K9/00 ,  C08K3/40

CPC分类号： H01F3/08 ,  H01F1/22 ,  H01F1/36 ,  H01F5/06 ,  H01F17/04 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T428/249922 ,  Y10T428/2933

摘要： A high temperature resistant insulating composition includes an organic polymer and an inorganic binder. The inorganic binder is ranged between 10% and 90% by weight of the high temperature resistant insulating composition. The high temperature resistant insulating composition still possesses strength and insulating property after a high temperature treatment.

摘要翻译： 耐高温绝缘组合物包括有机聚合物和无机粘合剂。 无机粘合剂的范围为耐高温绝缘组合物的10重量％至90重量％。 耐高温绝缘组合物在高温处理后仍然具有强度和绝缘性能。

公开(公告)号：US20220021434A1

公开(公告)日：2022-01-20

申请号：US17356232

申请日：2021-06-23

申请人： Yi Huang ,  Peter Gaal ,  Wei Yang ,  Tingfang Ji ,  Hwan Joon Kwon ,  Krishna Kiran Mukkavilli ,  Wanshi Chen

发明人： Yi Huang ,  Peter Gaal ,  Wei Yang ,  Tingfang Ji ,  Hwan Joon Kwon ,  Krishna Kiran Mukkavilli ,  Wanshi Chen

IPC分类号： H04B7/06 ,  H04B7/0456 ,  H04W72/12 ,  H04L27/26

摘要： Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive a configuration signal indicating a codebook construction configuration for constructing a codebook of sequences for conveying a first type of uplink payload in a resource block that is orthogonal to a second type of uplink payload transmitted from a second UE in the resource block. The UE may construct the codebook of sequences for the first type of uplink payload according to the codebook construction configuration. The UE may generate the first type of uplink payload for transmission using a first sequence from the codebook of sequences. The UE may transmit the first type of uplink payload in the resource block, wherein the first type of uplink payload is multiplexed in the resource block with the second type of uplink payload from the second UE.