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Patent Agency Ranking
公开(公告)号：US20120231155A1
公开(公告)日：2012-09-13
申请号：US13477407
申请日：2012-05-22
Applicant: Jin Yong AN , Jae Joon LEE
Inventor： Jin Yong AN , Jae Joon LEE
IPC: H05K3/46
CPC classification number: H05K3/4007 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L2221/68345 , H01L2924/0002 , H05K3/108 , H05K3/205 , H05K3/4682 , H05K2201/0367 , H05K2203/0228 , H05K2203/0376 , H05K2203/054 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
Abstract: A method of manufacturing a printed circuit board, including: applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps; forming an upper circuit layer including metal bumps charged in the holes and connection pads on the dry film; forming an insulation layer on the dry film; forming a build-up layer including a lower circuit layer on the insulation layer; removing the carrier; and removing the dry film.
Abstract translation: 一种制造印刷电路板的方法，包括：在载体上涂覆干膜，然后对干膜图案形成用于形成金属凸块的孔; 形成包含填充在孔中的金属凸块和干膜上的连接焊盘的上电路层; 在干膜上形成绝缘层; 在所述绝缘层上形成包括下电路层的堆积层; 移除载体; 并除去干膜。
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公开(公告)号：US20110000083A1
公开(公告)日：2011-01-06
申请号：US12552957
申请日：2009-09-02
Applicant: Jin Yong AN , Seok Kyu Lee
Inventor： Jin Yong AN , Seok Kyu Lee
IPC: H05K3/00
CPC classification number: H05K3/4007 , H05K3/0097 , H05K3/4682 , H05K2201/0367 , Y10T29/49126 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , Y10T29/49213 , Y10T428/24917
Abstract: Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.
Abstract translation: 这里公开了具有均匀直径并以细间距形成的金属凸块的印刷电路板，以及制造印刷电路板的方法。
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公开(公告)号：US20120211464A1
公开(公告)日：2012-08-23
申请号：US13457792
申请日：2012-04-27
Applicant: Jin Yong AN , Ki Hwan Kim
Inventor： Jin Yong AN , Ki Hwan Kim
CPC classification number: H05K3/4007 , H01L2224/16225 , H01L2224/81192 , H05K3/061 , H05K3/243 , H05K3/4644 , H05K3/4682 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/096 , H05K2203/054 , H05K2203/1536
Abstract: A method of manufacturing a printed circuit board, including: providing a metal layer; forming an insulation layer on the metal layer and then forming via holes for exposing the metal layer in the insulation layer; forming vias charged in the via holes and a circuit layer on the insulation layer; and forming metal bumps at ends of the vias.
Abstract translation: 一种制造印刷电路板的方法，包括：提供金属层; 在金属层上形成绝缘层，然后形成用于暴露绝缘层中的金属层的通孔; 形成通孔中的通孔和绝缘层上的电路层; 并在通孔的端部形成金属凸块。
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公开(公告)号：US20120210576A1
公开(公告)日：2012-08-23
申请号：US13461694
申请日：2012-05-01
Applicant: Jin Yong AN , Suk Hyeon CHO , Ji Hong JO
Inventor： Jin Yong AN , Suk Hyeon CHO , Ji Hong JO
CPC classification number: H05K3/4658 , H05K1/113 , H05K3/20 , H05K3/4682 , H05K2201/0352 , H05K2201/096 , Y10T29/49128
Abstract: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及一种印刷电路板及其制造方法，其中印刷电路板的最外层包括精细电路，并且印刷电路板的制造成本降低。
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公开(公告)号：US20110005824A1
公开(公告)日：2011-01-13
申请号：US12544100
申请日：2009-08-19
Applicant: Jin Yong AN , Suk Hyeon Cho , Ji Hong Jo
Inventor： Jin Yong AN , Suk Hyeon Cho , Ji Hong Jo
CPC classification number: H05K3/4658 , H05K1/113 , H05K3/20 , H05K3/4682 , H05K2201/0352 , H05K2201/096 , Y10T29/49128
Abstract: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及一种印刷电路板及其制造方法，其中印刷电路板的最外层包括精细电路，并且印刷电路板的制造成本降低。
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