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    Methods of fabricating semiconductor device including phase change layer
    1.
    发明授权
    Methods of fabricating semiconductor device including phase change layer 有权
    制造包括相变层的半导体器件的方法

    公开(公告)号：US07838326B2

    公开(公告)日：2010-11-23

    申请号：US12405408

    申请日：2009-03-17

    申请人： Jin-Il Lee ,  Sung-Lae Cho ,  Ik-Soo Kim ,  Hye-Young Park ,  Do-Hyung Kim ,  Dong-Hyun Im

    发明人： Jin-Il Lee ,  Sung-Lae Cho ,  Ik-Soo Kim ,  Hye-Young Park ,  Do-Hyung Kim ,  Dong-Hyun Im

    IPC分类号： H01L21/00

    CPC分类号： H01L45/1683 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/143 ,  H01L45/144 ,  H01L45/1616

    摘要： Provided are methods of fabricating a semiconductor device including a phase change layer. Methods may include forming a dielectric layer on a substrate, forming an opening in the dielectric layer and depositing, on the substrate having the opening, a phase change layer that contains an element that lowers a process temperature of a thermal treatment process to a temperature that is lower than a melting point of the phase change layer. Methods may include migrating a portion of the phase change layer from outside the opening, into the opening by the thermal treatment process that includes the process temperature that is lower than the melting point of the phase change layer.

    摘要翻译： 提供制造包括相变层的半导体器件的方法。 方法可以包括在衬底上形成电介质层，在电介质层中形成开口，并在具有开口的衬底上沉积相变层，该相变层含有将热处理工艺的工艺温度降低到 低于相变层的熔点。 方法可以包括通过包括低于相变层的熔点的工艺温度的热处理工艺将一部分相变层从开口外部迁移到开口中。

    Methods of Fabricating Semiconductor Device Including Phase Change Layer
    2.
    发明申请
    Methods of Fabricating Semiconductor Device Including Phase Change Layer 有权
    制造包括相变层的半导体器件的方法

    公开(公告)号：US20090233421A1

    公开(公告)日：2009-09-17

    申请号：US12405408

    申请日：2009-03-17

    申请人： Jin-Il Lee ,  Sung-Lae Cho ,  Ik-Soo Kim ,  Hye-Young Park ,  Do-Hyung Kim ,  Dong-Hyun Im

    发明人： Jin-Il Lee ,  Sung-Lae Cho ,  Ik-Soo Kim ,  Hye-Young Park ,  Do-Hyung Kim ,  Dong-Hyun Im

    IPC分类号： H01L21/20

    CPC分类号： H01L45/1683 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/143 ,  H01L45/144 ,  H01L45/1616

    摘要： Provided are methods of fabricating a semiconductor device including a phase change layer. Methods may include forming a dielectric layer on a substrate, forming an opening in the dielectric layer and depositing, on the substrate having the opening, a phase change layer that contains an element that lowers a process temperature of a thermal treatment process to a temperature that is lower than a melting point of the phase change layer. Methods may include migrating a portion of the phase change layer from outside the opening, into the opening by the thermal treatment process that includes the process temperature that is lower than the melting point of the phase change layer.

    摘要翻译： 提供制造包括相变层的半导体器件的方法。 方法可以包括在衬底上形成电介质层，在电介质层中形成开口，并在具有开口的衬底上沉积相变层，该相变层含有将热处理工艺的工艺温度降低到 低于相变层的熔点。 方法可以包括通过包括低于相变层的熔点的工艺温度的热处理工艺将一部分相变层从开口外部迁移到开口中。

    PHASE CHANGE MEMORY DEVICE AND METHOD FOR FORMING THE SAME
    9.
    发明申请
    PHASE CHANGE MEMORY DEVICE AND METHOD FOR FORMING THE SAME 审中-公开
    相变存储器件及其形成方法

    公开(公告)号：US20080272355A1

    公开(公告)日：2008-11-06

    申请号：US12110206

    申请日：2008-04-25

    申请人： Sung-Lae Cho ,  Byoung-Jae Bae ,  Jin-Il Lee ,  Hye-Young Park ,  Young-Lim Park ,  Rak-Hwan Kim

    发明人： Sung-Lae Cho ,  Byoung-Jae Bae ,  Jin-Il Lee ,  Hye-Young Park ,  Young-Lim Park ,  Rak-Hwan Kim

    IPC分类号： H01L47/00 ,  H01L21/00

    CPC分类号： H01L45/1683 ,  H01L27/2409 ,  H01L45/06 ,  H01L45/124 ,  H01L45/126 ,  H01L45/143 ,  H01L45/144

    摘要： A memory device using a phase change material and a method for forming the same are disclosed. One embodiment of a memory device includes a first insulating layer provided on a substrate and defining an opening; a first conductor including a first portion and a second portion, the first portion provided on a bottom of the opening, the second portion being continuously provided along a sidewall of the opening; a variable resistor connected to the second portion of the first conductor and provided along the sidewall of the opening; and a second conductor provided on the variable resistor.

    摘要翻译： 公开了使用相变材料的记忆装置及其形成方法。 存储器件的一个实施例包括设置在衬底上并限定开口的第一绝缘层; 包括第一部分和第二部分的第一导体，所述第一部分设置在所述开口的底部上，所述第二部分沿着所述开口的侧壁连续设置; 连接到第一导体的第二部分并沿着开口的侧壁设置的可变电阻器; 以及设置在可变电阻器上的第二导体。