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公开(公告)号：US20140291786A1
公开(公告)日：2014-10-02
申请号：US14233969
申请日：2012-07-20
申请人： Jochen Zoellin , Franz Laermer , Christoph Schelling , Mike Daley
发明人： Jochen Zoellin , Franz Laermer , Christoph Schelling , Mike Daley
CPC分类号： H04R7/06 , B81B3/0051 , B81B2201/0257 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： Substrate-side overload protection for the diaphragm structure of a microphone component having a micromechanical microphone structure which impairs the damping properties of the microphone structure as little as possible, in which the microphone structure includes a diaphragm structure having at least one acoustically active diaphragm which is formed in a diaphragm layer above a semiconductor substrate. The diaphragm structure spans at least one sound opening in the rear side of the substrate. A stationary, acoustically permeable counter element is formed in the layer structure of the component above the diaphragm layer. According to the invention, at least projections are formed at the outer edge area of the diaphragm structure which protrude beyond the edge area of the sound opening, so that the edge area of the sound opening acts as a substrate-side stop for the diaphragm structure.
摘要翻译： 用于具有微机械麦克风结构的麦克风部件的隔膜结构的基板侧过载保护，其尽可能少地损害麦克风结构的阻尼特性，其中麦克风结构包括具有至少一个声学活动隔膜的隔膜结构， 形成在半导体衬底上的隔膜层中。 隔膜结构跨越基板后侧的至少一个声音开口。 在隔膜层上方的部件的层结构中形成固定的，声学可渗透的计数元件。 根据本发明，至少在隔膜结构的外边缘区域形成突起，突出超过声音开口的边缘区域，使得声音开口的边缘区域用作隔膜结构的基板侧挡块 。
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公开(公告)号：US08929584B2
公开(公告)日：2015-01-06
申请号：US14071227
申请日：2013-11-04
IPC分类号： H04R25/00
摘要： Measures for dynamically regulating the microphone sensitivity of a MEMS microphone component at low frequencies by way of variable roll-off behavior are proposed. The micromechanical microphone structure of the component, which is implemented in a layer structure on a semiconductor substrate, encompasses an acoustically active diaphragm having leakage openings which spans a sound opening in the substrate back side, and a stationary acoustically permeable counterelement having through openings which is disposed in the layer structure above/below the diaphragm. The component furthermore encompasses a capacitor assemblage for signal sensing, having at least one deflectable electrode on the diaphragm and at least one stationary electrode on the counterelement, and an arrangement for implementing a relative motion between the diaphragm and counterelement parallel to the layer planes.
摘要翻译： 提出了通过可变滚降行为动态调节MEMS麦克风组件在低频下的麦克风灵敏度的措施。 在半导体衬底上以层结构实现的部件的微机械式麦克风结构包括具有跨越衬底背侧中的声音开口的泄漏开口的声学活动隔膜，以及具有通孔的固定声透射反调器， 设置在隔膜的上方/下方的层结构中。 该组件还包括用于信号感测的电容器组件，其具有在隔膜上的至少一个可偏转电极和在该反射体上的至少一个固定电极，以及用于实现平行于层平面的隔膜和反射体之间的相对运动的装置。
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3.发明授权MEMS device having a microphone structure, and method for the production thereof 有权具有麦克风结构的MEMS器件及其制造方法公开(公告)号：US09403670B2
公开(公告)日：2016-08-02
申请号：US14327180
申请日：2014-07-09
CPC分类号： B81B3/0059 , B81B3/0072 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , B81C1/00666 , H04R19/005 , H04R2201/003
摘要： A microphone structure of an MEMS device has a layer construction including: a base substrate; a deflectable microphone diaphragm at least partly spanning a through-opening in the substrate; a deflectable electrode of a microphone condenser system; a stationary counter-element having ventilation openings situated in the layer construction over the microphone diaphragm and acting as a bearer for a stationary electrode of the microphone condenser system. The diaphragm is bonded into the layer construction on the substrate via a flexible beam. The otherwise free edge region of the diaphragm is curved in a pan shape, so that it extends both vertically and also in some regions laterally beyond the edge region of the through-opening, and the edge region of the through-opening forms a lower stop for the diaphragm movement.
摘要翻译： MEMS器件的麦克风结构具有层结构，包括：基底; 至少部分跨越所述基板中的通孔的可偏转传声器隔膜; 麦克风冷凝器系统的可偏转电极; 一个固定的相对元件，其具有位于麦克风隔膜上的层结构中的通气开口，并且用作麦克风电容器系统的固定电极的载体。 隔膜通过柔性梁结合到基板上的层结构中。 隔膜的另外的自由边缘区域以平盘形状弯曲，使得其在垂直方向上以及在一些区域中横向延伸超过通孔的边缘区域，并且通孔的边缘区域形成下部停止 用于隔膜运动。
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公开(公告)号：US09131319B2
公开(公告)日：2015-09-08
申请号：US14046587
申请日：2013-10-04
申请人： Jochen Zoellin , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
发明人： Jochen Zoellin , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
CPC分类号： H04R23/00 , H04R7/14 , H04R19/005 , H04R19/04 , H04R2410/03
摘要： A capacitive MEMS microphone structure is provided, which micromechanical microphone structure of component is realized in a layer construction and includes: a diaphragm structure sensitive to sound pressure, which is deflectable in a direction perpendicular to the layer planes of the layer construction; an acoustically penetrable counter-element which has through holes and is formed above or below the diaphragm structure in the layer construction; and a capacitor system for detecting the excursions of the diaphragm structure. The diaphragm structure includes a structural element in the middle area of the diaphragm structure, which structural element projects perpendicularly from the diaphragm plane and which, depending on the degree of excursion of the diaphragm structure, variably extends into a correspondingly formed and positioned through hole in the counter-element.
摘要翻译： 提供一种电容式MEMS麦克风结构，该组件的微机械麦克风结构以层结构实现，包括：对垂直于层结构的层平面垂直的方向可偏转的声压的隔膜结构; 具有通孔并形成在层结构中的隔膜结构的上方或下方的声学可穿透的相对元件; 以及用于检测隔膜结构的偏移的电容器系统。 隔膜结构包括在隔膜结构的中间区域中的结构元件，该结构元件从隔膜平面垂直伸出，并且根据隔膜结构的偏移程度可变地延伸到相应形成和定位的通孔中 反元素。
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公开(公告)号：US09162873B2
公开(公告)日：2015-10-20
申请号：US14074877
申请日：2013-11-08
申请人： Jochen Zoellin , Ricardo Ehrenpfordt , Christoph Schelling , Juergen Graf , Frederik Ante , Michael Curcic
发明人： Jochen Zoellin , Ricardo Ehrenpfordt , Christoph Schelling , Juergen Graf , Frederik Ante , Michael Curcic
CPC分类号： B81B7/007 , B81B3/00 , B81B3/0021 , B81B3/0027 , B81B3/0032 , B81B7/0032 , B81B7/0058 , B81B7/0061 , B81B2201/0257 , B81B2207/092 , B81B2207/096 , B81C1/00158 , H01L41/053 , H01L41/0533 , H01L41/31 , H01L2224/04105 , H01L2224/20 , H04R7/04 , H04R7/045 , H04R19/04
摘要： A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity.
摘要翻译： 提供了一种用于MEMS部件的封装概念，其具有形成在部件的前侧中的至少一个光阑结构，根据该MEMS部件，MEMS部件安装在至少横向限定邻接隔膜结构的腔的支撑件上。 此外，在支撑件中形成至少一个电馈通，其允许MEMS组件通过支撑件的电接触。 为了实现用于给定芯片表面积的用于MEMS部件的膜结构的尽可能最大的后部体积，并且还简化了支撑件的处理，根据本发明，电馈通件集成到邻近隔膜的空腔的壁中 结构，其中这种馈通的至少一个部分以空腔的侧壁部分的导电涂层的形式实现。
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公开(公告)号：US08816454B2
公开(公告)日：2014-08-26
申请号：US13938582
申请日：2013-07-10
申请人： Jochen Zoellin , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
发明人： Jochen Zoellin , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
IPC分类号： H01L29/84
CPC分类号： B81B3/0021 , H04R19/005 , H04R19/016
摘要： A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor system, and (iii) a stationary acoustically penetrable counterelement having through holes, which counterelement is situated in the layer construction over the diaphragm and functions as the carrier for at least one immovable electrode of the microphone capacitor system. The diaphragm is tied in to the semiconductor substrate in a middle area, and the diaphragm has a corrugated sheet metal type of corrugation, at least in regions.
摘要翻译： 麦克风组件具有微机械式麦克风图案，其以半导体衬底上的层结构实现，并且包括（i）至少部分地跨越衬底背面的声音开口的声学活动隔膜，（ii）至少一个可移动 麦克风电容器系统的电极，以及（iii）具有通孔的固定声学可穿透的反应体，所述通孔位于隔膜上的层结构中，并且用作麦克风电容器系统的至少一个不可移动电极的载体。 膜片在中间区域连接到半导体衬底，并且至少在区域中，隔膜具有波纹状金属板状波纹。
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公开(公告)号：US09139418B2
公开(公告)日：2015-09-22
申请号：US14157344
申请日：2014-01-16
CPC分类号： B81B3/0021 , B81B3/00 , B81B3/0035 , B81B3/0072 , B81B7/02 , B81B2201/0257 , H04R1/00 , H04R19/00 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003
摘要： An MEMS component includes at least one metal-ceramic multilayer stack as a mechanical functional layer in the layered structure of the MEMS component. The metal-ceramic multilayer stack functions as a mechanical functional layer in which at least one component of the micromechanical structure of the MEMS component is configured.
摘要翻译： MEMS部件在MEMS部件的分层结构中包括至少一个金属 - 陶瓷多层堆叠作为机械功能层。 金属 - 陶瓷多层叠层用作机械功能层，其中构成MEMS部件的微机械结构的至少一个部件。
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公开(公告)号：US20140105428A1
公开(公告)日：2014-04-17
申请号：US14046587
申请日：2013-10-04
申请人： Jochen ZOELLIN , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
发明人： Jochen ZOELLIN , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
IPC分类号： H04R23/00
CPC分类号： H04R23/00 , H04R7/14 , H04R19/005 , H04R19/04 , H04R2410/03
摘要： A capacitive MEMS microphone structure is provided, which micromechanical microphone structure of component is realized in a layer construction and includes: a diaphragm structure sensitive to sound pressure, which is deflectable in a direction perpendicular to the layer planes of the layer construction; an acoustically penetrable counter-element which has through holes and is formed above or below the diaphragm structure in the layer construction; and a capacitor system for detecting the excursions of the diaphragm structure. The diaphragm structure includes a structural element in the middle area of the diaphragm structure, which structural element projects perpendicularly from the diaphragm plane and which, depending on the degree of excursion of the diaphragm structure, variably extends into a correspondingly formed and positioned through hole in the counter-element.
摘要翻译： 提供一种电容式MEMS麦克风结构，该组件的微机械麦克风结构以层结构实现，包括：对垂直于层结构的层平面垂直的方向可偏转的声压的隔膜结构; 具有通孔并形成在层结构中的隔膜结构的上方或下方的声学可穿透的相对元件; 以及用于检测隔膜结构的偏移的电容器系统。 隔膜结构包括在隔膜结构的中间区域中的结构元件，该结构元件从隔膜平面垂直伸出，并且根据隔膜结构的偏移程度可变地延伸到相应形成和定位的通孔中 反元素。
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公开(公告)号：US09335203B2
公开(公告)日：2016-05-10
申请号：US14012804
申请日：2013-08-28
申请人： Jochen Zoellin , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
发明人： Jochen Zoellin , Ricardo Ehrenpfordt , Juergen Graf , Christoph Schelling , Frederik Ante , Michael Curcic
CPC分类号： G01H11/06 , B81B2201/0264 , G01H13/00 , G01L9/0019
摘要： A new signal acquisition concept is provided for MEMS components having a pressure-sensitive diaphragm element, which at least partially spans a pressure connection opening. This signal acquisition concept is distinguished by an especially high sensitivity. For this purpose, the MEMS component includes a resonant vibrator device having a vibrating element, which is suspended, capable of vibrating, within a closed cavity and is equipped with at least one drive electrode and at least one sensing electrode. The vibrating element of the resonant vibrator device is coupled mechanically to the diaphragm element, so that the vibrating element is deformed in the case of a diaphragm deflection.
摘要翻译： 为具有至少部分跨越压力连接开口的压敏膜元件的MEMS部件提供了新的信号采集概念。 该信号采集概念由特别高的灵敏度区分。 为此，MEMS部件包括具有振动元件的谐振振动器装置，所述振动元件悬置在振动元件内，该振动元件能够在封闭空腔内振动并配备有至少一个驱动电极和至少一个感测电极。 共振振子装置的振动元件机械耦合到隔膜元件，使得在隔膜偏转的情况下振动元件变形。
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10.发明授权Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure 失效半导体结构的制造方法以及相应的半导体结构公开(公告)号：US08148234B2
公开(公告)日：2012-04-03
申请号：US12282842
申请日：2007-03-09
申请人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
发明人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
IPC分类号： H01L21/76
CPC分类号： H01L21/228 , H01L21/02378 , H01L21/02381 , H01L21/02532 , H01L21/02658 , H01L21/02667 , H01L21/223 , H01L21/225 , H01L21/324
摘要： A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.
摘要翻译： 提供了一种制造半导体结构的方法，其包括以下操作：提供晶体半导体衬底，提供与半导体衬底的表面相邻的多孔区域，从表面引入掺杂剂到多孔区域中，并将多孔 区域形成半导体衬底的掺杂类型和/或掺杂浓度和/或掺杂分布/不同于半导体衬底或/或掺杂分布的晶体掺杂区域。 同样提供相应的半导体结构。
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