摘要:
Grooves are etched in a glass substrate, using a metallic mask, after which the substrate is coated with a layer of glass having a refractive index which is higher than that of the substrate, the groove being filled completely. Excess glass is removed, the metallic mask being used as a stop layer and a protective layer being provided at the location of the filled grooves. Excess glass is removed at the location of the grooves by means of polishing so that a high accuracy as regards depth can be obtained.
摘要:
A new type of glass, for example for use as a TL-envelope glass which as regards phosphor poisoning and Hg penetration has better properties than the present TL-envelope glasses. Phosphor poisoning occurs in particular upon fusing electrodes and bending and severing and bridging, respectively, during the manufacture of SL and PL lamps. Phosphor poisoning is controlled by incorporating little or no Na.sub.2 O in the glass. In order to nevertheless reach good processing properties, a combination of Li.sub.2 O and K.sub.2 O is used in the glass. The addition of only Li.sub.2 O or only K.sub.2 O does not result in a suitable glass. Hg penetration is controlled by the presence of a large quantity of alkaline earth metal oxides in the glass. The glass according to the invention has a good light transmission. A lamp comprising a lamp envelope of a glass according to the invention shows only a small luminous decline during operation of the lamp.
摘要:
An optical device is manufactured by providing a disc-shaped body of a light-conducting material on a plane surface of a disc-shaped carrier body, grinding the light-conducting material mechanically to a thickness which exceeds the desired ultimate layer thickness by at least 50 .mu.m, subjecting the light-conducting material to alternate tribochemical and mechanical polishing treatments until a thickness is obtained which exceeds the desired ultimate layer thickness by approximately 10 .mu.m, and subsequently polishing the light-conductor body tribochemically until the desired layer thickness is obtained.
摘要:
Method of preparing an aluminum oxide containing quartz glass activated by bivalent europium and comprising as glass matrix oxides mainly SiO.sub.2 and furthermore per mol of SiO.sub.2 up to at most 0.15 mol of at least one of the oxides, Al.sub.2 O.sub.3, B.sub.2 O.sub.3, P.sub.2 O.sub.5, ZrO.sub.2, Scf.sub.2 O.sub.3, Y.sub.2 O.sub.3, La.sub.2 O.sub.3, Gd.sub.2 O.sub.3, Lu.sub.2 O.sub.3, the alkali metal oxides and the alkaline earth metal oxides. A mixture is made of the composite oxides or of compounds which yield these oxides. The mixture comprises europium in the form of an aluminum containing compound of bivalent europium. The mixture is melted at a high temperature in a reducing atmosphere and is then cooled. The luminescent quartz glasses obtained are used in luminescent screens of, for example, low-pressure mercury vapor discharge lamps.
摘要:
The method of intimately joining a hard magnetic part to a soft magnetic part in the manufacture of an electrical machine comprising polishing the joining surfaces such that the surface roughness hight is about less than or equal to two nanometers and joining the parts by direct bonding.
摘要:
An electrical machine comprises a stationary first section (1) and a second section (5) which is movable relative to the stationary section. At least one of the sections comprises a soft-magnetic part (7) and a hard-magnetic part (9). A surface (7a) of the soft-magnetic part and a surface (9a) of the hard-magnetic part are fixed intimately to one another by direct bonding.
摘要:
A component includes a substrate layer (1) of glass or Al.sub.2 O.sub.3, an anti-reaction layer (2) or a levelling layer (2), two electrode layers (3, 5) and a dielectric layer (4) as well as such a capacitor. Manufacture a component which provides for cost-effective, surface-mountable (SMD). The anti-reaction layer (2) on the glass substrate (1) or the levelling layer (2) on the Al.sub.2 O.sub.3 -substrate (1) is made of at least one specific material. An anti-reaction layer or a levelling layer (2) of one of the above-mentioned substances or a combination of several substances, enables a dielectric layer (4) to be provided by means of which a high capacitance value is achieved.
摘要翻译:组分包括玻璃或Al 2 O 3的基底层(1),抗反应层(2)或调平层(2),两个电极层(3,5)和介电层(4) 电容器。 制造成本低廉,表面贴装(SMD)的组件。 玻璃基板(1)上的抗反应层(2)或Al2O3基板(1)上的调平层(2)由至少一种特定材料制成。 上述物质之一的抗反应层或调平层(2)或几种物质的组合使得能够提供实现高电容值的介电层(4)。
摘要:
Method of providing a pattern of apertures and/or cavities in, for example, a glass duct plate of a plasma-addressed liquid crystal display, in which first a mechanical treatment is performed (for example, by means of powder blasting) and then a wet-chemical etching treatment is performed to render the walls of the ducts microscopically less rough so that the optical disturbance is reduced and the glass becomes clearer again.
摘要:
A method of manufacturing a silicon-on-insulator semiconductor body is characterized by the steps consisting in that a carrier body is temporarily connected to a supporting body with accurately flat and parallel major surfaces and having a thickness of at least 1/8 of the largest dimension of the carrier body, in that the free major surface of the carrier body is mechanically polished to a precision of at least 1/2 .mu.m flatness, in that the carrier body is detached from the supporting body and the polished major surface is temporarily connected to the supporting body and the other major surface of the carrier body is mechanically polished to a precision of at least 1/2 .mu.m flatness and a parallelism between the major surfaces of at least 1/2 .mu.m whereupon a semiconductor body is connected through a major surface permanently to a major surface of the carrier body, in that then the semiconductor body is mechanically ground to a thickness of at least 50 .mu.m larger than the desired ultimate layer thickness and is then alternately polished tribochemically and mechanically to a thickness of about 10 .mu.m larger than the ultimately desired layer thickness, and in that there is ultimately polished tribochemically until the desired layer thickness of the semiconductor body is attained.
摘要:
The glass composition in accordance with the invention is characterized by the absence of alkali metal oxides and by the presence of at least 10% by weight of barium oxide.The glass composition in accordance with the invention has favorable working properties (melting temperature below 1500.degree. C., working range in excess of 200 Celsius degrees, it is very corrosion resistant (also in a strong electric field), it is resistant to metal vapors including mercury vapor, it does not attack a phosphor and it is not subject to blackening.The glass composition in accordance with the invention is extremely suitable for use in fluorescent lamps (TL-, SL- and PL-lamps) and in projection-television face plates.