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1.发明授权公开(公告)号：US07032828B2
公开(公告)日：2006-04-25
申请号：US10983000
申请日：2004-11-08
申请人： Johannes Krul , Wilhelm Bernardus de Hesse , Marco Matters , Cornelis Maria Hart , Dagobert Michel De Leeuw
发明人： Johannes Krul , Wilhelm Bernardus de Hesse , Marco Matters , Cornelis Maria Hart , Dagobert Michel De Leeuw
IPC分类号： G06K19/06
CPC分类号： D21H21/48 , G06K19/02 , G06K19/07743
摘要： The invention relates to a substrate which is made from paper and is provided with at least one integrated circuit which is produced from a semiconductive organic polymer. A semiconductive organic polymer of this nature, when used as the base material for the integrated circuit, leads to the possibility of directly producing the substrate in the required thickness, to the need for support layers and/or protective layers being eliminated, and to the possibility of reducing the cost price of the substrate compared to substrates which comprise an integrated circuit of the silicon type.
摘要翻译： 本发明涉及由纸制成并具有由半导体有机聚合物制成的至少一个集成电路的基板。 这种性质的半导体有机聚合物当用作集成电路的基底材料时，导致直接生产所需厚度的衬底，消除对支撑层和/或保护层的需要的可能性，以及 与包括硅类型的集成电路的衬底相比，降低衬底的成本价格的可能性。
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2.发明授权公开(公告)号：US06830192B1
公开(公告)日：2004-12-14
申请号：US09692371
申请日：2000-10-20
申请人： Johannes Krul , Cornelius Maria Hart , Dagobert Michel de Leeuw , Wilhelm Bernardus de Hesse , Marco Matters
发明人： Johannes Krul , Cornelius Maria Hart , Dagobert Michel de Leeuw , Wilhelm Bernardus de Hesse , Marco Matters
IPC分类号： G06K1906
CPC分类号： D21H21/48 , G06K19/02 , G06K19/07743
摘要： The invention relates to a substrate which is made from paper and is provided with at least one integrated circuit which is produced from a semiconductive organic polymer. A semiconductive organic polymer of this nature, when used as the base material for the integrated circuit, leads to the possibility of directly producing the substrate in the required thickness, to the need for support layers and/or protective layers being eliminated, and to the possibility of reducing the cost price of the substrate compared to substrates which comprise an integrated circuit of the silicon type.
摘要翻译： 本发明涉及由纸制成并具有由半导体有机聚合物制成的至少一个集成电路的基板。 这种性质的半导体有机聚合物当用作集成电路的基底材料时，导致直接生产所需厚度的衬底，消除对支撑层和/或保护层的需要的可能性，以及 与包括硅类型的集成电路的衬底相比，降低衬底的成本价格的可能性。
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3.发明授权Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects 有权在薄膜微电子器件和包括这种垂直互连的产品之间产生垂直互连的方法公开(公告)号：US06635406B1
公开(公告)日：2003-10-21
申请号：US09704519
申请日：2000-11-02
IPC分类号： H01L2100
CPC分类号： H01L51/052 , H01L21/76877 , H01L23/5328 , H01L51/0014 , H01L51/0015 , H01L51/0021 , H01L51/0034 , H01L51/0035 , H01L51/0036 , H01L51/0037 , H01L51/0052 , H01L51/0545 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention provides a method of photochemically producing a vertical interconnect between a first and a second thin-film microelectronic device in an vertical interconnect area which comprises an overlap of a stack of a first electrically conducting area, optionally an organic electrically semiconducting area, an organic electrically insulating area comprising adapted photoresist material and a second organic electrically conducting area, wherein the organic electrically insulating area is removed within the overlapping area and substituted by an electrically conducting area which is extended from at least said first or said second electrically conducting area. The method is useful in the manufacture of electronic devices, preferably integrated circuits, consisting substantially of organic materials.
摘要翻译： 本发明提供了一种在垂直互连区域中光电化生产第一和第二薄膜微电子器件之间的垂直互连的方法，其包括第一导电区域，任选的有机电半导体区域， 有机电绝缘区域包括适应的光致抗蚀剂材料和第二有机导电区域，其中所述有机电绝缘区域在所述重叠区域内被移除并被从至少所述第一或所述第二导电区域延伸的导电区域代替。 该方法可用于制造基本上由有机材料组成的电子器件，优选集成电路。
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4.发明申请公开(公告)号：US20050109851A1
公开(公告)日：2005-05-26
申请号：US10983000
申请日：2004-11-08
CPC分类号： D21H21/48 , G06K19/02 , G06K19/07743
摘要： The invention relates to a substrate which is made from paper and is provided with at least one integrated circuit which is produced from a semiconductive organic polymer. A semiconductive organic polymer of this nature, when used as the base material for the integrated circuit, leads to the possibility of directly producing the substrate in the required thickness, to the need for support layers and/or protective layers being eliminated, and to the possibility of reducing the cost price of the substrate compared to substrates which comprise an integrated circuit of the silicon type.
摘要翻译： 本发明涉及由纸制成并具有由半导体有机聚合物制成的至少一个集成电路的基板。 这种性质的半导体有机聚合物当用作集成电路的基底材料时，导致直接生产所需厚度的衬底，消除对支撑层和/或保护层的需要的可能性，以及 与包括硅类型的集成电路的衬底相比，降低衬底的成本价格的可能性。
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公开(公告)号：US07187250B2
公开(公告)日：2007-03-06
申请号：US10498757
申请日：2002-12-05
CPC分类号： H03H7/48
摘要： A coupler (10) having a first line (1) and a second line (2) also comprises a resonant structure (3) including a capacitor (5) and an inductor (4). The coupler (10) thus delivers a coupling signal S31 that is substantially frequency independent over a frequency domain above the resonance frequency of the resonant structure (3). Also, the signal S31 has a high degree of directivity. The coupler (10) can be provided as part of an integrated electronic component, such as a multilayer substrate, a thin-film module or an IC. It can be applied in an electronic device (100) between a power amplifier (101) and an antenna (103). The coupling signal S31 will thus be provided to a controlling circuit (102).
摘要翻译： 具有第一线（1）和第二线（2）的耦合器（10）还包括包括电容器（5）和电感器（4）的谐振结构（3）。 因此，耦合器（10）传送在谐振结构（3）的谐振频率之上的频域上基本上是频率独立的耦合信号S 31。 此外，信号S31具有高度的方向性。 耦合器（10）可以作为集成电子部件的一部分提供，例如多层基板，薄膜模块或IC。 它可以应用于功率放大器（101）和天线（103）之间的电子设备（100）中。 因此，耦合信号S31将被提供给控制电路（102）。
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公开(公告)号：US6133835A
公开(公告)日：2000-10-17
申请号：US204179
申请日：1998-12-03
CPC分类号： G01S13/758 , G01S13/767 , G01S13/82 , G06K19/0723 , G06K19/07749
摘要： An identification transponder comprising an identification code generator (10) embodied as an integrated circuit predominantly comprising organic materials. The integrated circuit may be provided on an anti-theft sticker (5) accommodating an LC resonant circuit (3, 4).
摘要翻译： 一种识别应答器，包括识别码发生器（10），其被实现为主要包含有机材料的集成电路。 集成电路可以设置在容纳LC谐振电路（3,4）的防盗贴纸（5）上。
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7.发明申请公开(公告)号：US20060050350A1
公开(公告)日：2006-03-09
申请号：US10537591
申请日：2003-12-01
IPC分类号： G02B26/08
CPC分类号： H01H59/0009 , H01G5/18 , H01G5/40
摘要： Method for driving an array of micro-electro mechanical system (MEMS) devices, said array providing a plurality of logical or memory states at it output, wherein the MEMS devices are given a characteristic hysteresis curve differing from one MEMS device to another MEMS device, and wherein a single control voltage applied to all the MEMS devices while the various states of the array are to be obtained by varying the single control voltage.
摘要翻译： 用于驱动微电子机械系统（MEMS）装置阵列的方法，所述阵列在其输出端提供多个逻辑或存储器状态，其中给予MEMS装置具有不同于一个MEMS装置到另一个MEMS装置的特征滞后曲线， 并且其中通过改变单个控制电压来获得施加到所有MEMS器件的单个控制电压，同时阵列的各种状态将被获得。
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公开(公告)号：US06433357B1
公开(公告)日：2002-08-13
申请号：US09643484
申请日：2000-08-22
IPC分类号： H01L3524
CPC分类号： H01L51/0504 , G02F1/133305 , G02F1/1368 , H01L27/28
摘要： Display device in which switching elements (5) are realized in an organic semiconductor layer. Mutual insulation of the elements and pixels is obtained either electrically by applying depletion via voltages to a guard line (4) or physically by making parts of the organic semiconductor layer insulating.
摘要翻译： 在有机半导体层中实现开关元件（5）的显示装置。 元件和像素的相互绝缘通过将电压耗尽施加到保护线（4）或物理地通过使部分有机半导体层绝缘而获得。
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