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公开(公告)号：US20140318895A1
公开(公告)日：2014-10-30
申请号：US13872995
申请日：2013-04-29
申请人： John Birk
发明人： John Birk
IPC分类号： E04G3/22
摘要： A scaffolding system for an attic area has a plurality of board members. An attachment device is sued for securing a first board member to an adjoining board member, wherein the attachment device comprises a pair of removable attachment devices formed on a pair of opposing sides of each board member.
摘要翻译： 用于阁楼区域的脚手架系统具有多个板构件。 用于将第一板构件固定到相邻的板构件上的附接装置，其中，附接装置包括形成在每个板构件的一对相对侧上的一对可拆卸附接装置。
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2.发明授权System for sensing and forming objects such as leads of electronic components 失效用于感测和形成诸如电子部件的引线的物体的系统
公开(公告)号：US4705081A
公开(公告)日：1987-11-10
申请号：US832481
申请日：1986-02-21
CPC分类号： H05K13/023 , H05K13/0421 , H05K13/043 , H05K13/08 , Y10T29/49139 , Y10T29/53183
摘要： An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
摘要翻译： 公开了一种自动引线感测和精细成形系统，用于制备电子元件的引线，使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置，以确定是否需要弯曲引线。 然后，这些引线被弯曲，并且在该过程期间感测和记录引线上的力及其位移。 然后记录的数据用于随后的弯曲，在必要时，用于将引线弯曲到目标位置，使得所有引线同时并入孔中。 为了简化图像处理，引线尖端由来自基本上各向同性方向的光照射，该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置，使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
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3.发明授权System for sensing and forming objects such as leads of electronic components 失效用于感测和形成诸如电子部件的引线的物体的系统
公开(公告)号：US4813255A
公开(公告)日：1989-03-21
申请号：US89719
申请日：1987-08-26
CPC分类号： H05K13/0421 , H05K13/023 , H05K13/043 , H05K13/08 , Y10S72/702
摘要： An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
摘要翻译： 公开了一种用于制备电子元件引线的自动引线感测和精细成形系统，使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置，以确定是否需要弯曲引线。 然后，这些引线被弯曲，并且在该过程期间感测和记录引线上的力及其位移。 然后记录的数据用于随后的弯曲，在必要时，用于将引线弯曲到目标位置，使得所有引线同时并入孔中。 为了简化图像处理，引线尖端由来自基本上各向同性方向的光照射，该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置，使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
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公开(公告)号：US20130313046A1
公开(公告)日：2013-11-28
申请号：US13480396
申请日：2012-05-24
申请人： John Birk
发明人： John Birk
IPC分类号： E04G3/24
CPC分类号： E04G3/26
摘要： A scaffolding system for an attic area has a plurality of board members. An attachment device is provided for securing a first board member to an adjoining board member.
摘要翻译： 用于阁楼区域的脚手架系统具有多个板构件。 提供一种附接装置，用于将第一板构件固定到邻接的板构件。
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公开(公告)号：US07014546B1
公开(公告)日：2006-03-21
申请号：US10975574
申请日：2004-10-28
申请人： John Birk
发明人： John Birk
IPC分类号： B24B23/00
摘要： A remote powered extendable sander has a sanding unit having a sanding surface. A drive system is coupled to the sanding unit. The drive system is used to move the sanding surface. A drive transfer unit is provided for transferring rotational motion from a small motorized construction tool to the drive system for powering the sanding unit. A housing is coupled to the sanding unit. An extension member is removably coupled to the housing for raising the remote powered extendable sander.
摘要翻译： 远程动力可延伸打磨机具有具有打磨表面的打磨单元。 驱动系统联接到打磨单元。 驱动系统用于移动砂光表面。 提供驱动传递单元，用于将旋转运动从小型电动施工工具传递到驱动系统，以为打磨单元供电。 壳体联接到打磨单元。 延伸构件可移除地联接到壳体以用于升高远程动力可延伸打磨机。
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6.发明授权Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates 失效机械同时将多针表面贴装组件对准到基板上的位置
公开(公告)号：US5034802A
公开(公告)日：1991-07-23
申请号：US448495
申请日：1989-12-11
申请人： Sidney Liebes, Jr. , John Birk
发明人： Sidney Liebes, Jr. , John Birk
CPC分类号： H05K13/046 , H05K13/0417 , H05K3/303 , H05K1/0284 , H05K2201/09036 , H05K2201/09045 , H05K2201/10537 , H05K2201/10568 , H05K2201/10689 , H05K2201/10924 , H05K2203/0173 , H05K2203/167 , H05K2203/168 , Y02P70/613 , Y10S269/903 , Y10T29/4913 , Y10T29/49133
摘要： A method and structure are provided for aligning SMDs to a substrate. The body of an SMD and that portion of a substrate encircled by the electrical interconnect pads each have a mating physical structure such that the SMD may be quickly placed in the general vicinity of its proper location and the mating physical features cause a precise alignment. In one embodiment, the physical features are nonsymmetrical, thereby preventing accidental placement of the SMD in an undesired rotation. In another embodiment, the physical features vary among device types, thereby ensuring that an improper device is not placed in a particular location on the substrate. In another embodiment, a component carrier is provided which includes depressions for the placement of the SMDs. A vacuum is applied to the carrier which holds each of the SMDs in place. The carrier is then placed in a desired physical relationship with the substrate such that each of the devices held in the carrier is properly aligned with the substrate. In another embodiment, a standard substrate is used without the requirement of physical mating features. Those physical mating features are provided by the use of a grid structure which is placed with proper registration on the substrate such that the physical pattern of the grid ensures proper placement of components with respect to the pads on the substrate.
摘要翻译： 提供了一种用于将SMD与衬底对准的方法和结构。 SMD的主体和由电互连焊盘包围的基板的那部分各自具有匹配的物理结构，使得SMD可以快速地放置在其适当位置的附近，并且配合的物理特征导致精确的对准。 在一个实施例中，物理特征是非对称的，从而防止SMD在意外旋转中的意外放置。 在另一个实施例中，物理特征在设备类型之间变化，从而确保不正确的设备不被放置在基板上的特定位置。 在另一个实施例中，提供了一种分量载体，其包括用于放置SMD的凹陷。 将真空施加到将每个SMD保持在适当位置的载体上。 然后将载体与衬底放置成所需的物理关系，使得保持在载体中的每个装置与衬底正确对准。 在另一个实施例中，使用标准衬底而不需要物理匹配特征。 这些物理配合特征通过使用栅格结构来提供，栅格结构被放置在基板上的适当对准，使得栅格的物理图案确保了相对于衬底上的焊盘的部件的适当放置。
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7.发明授权System for sensing and forming objects such as leads of electronic components 失效用于感测和形成诸如电子部件的引线的物体的系统
公开(公告)号：US4821157A
公开(公告)日：1989-04-11
申请号：US89651
申请日：1987-08-26
CPC分类号： H05K13/043 , H05K13/023 , H05K13/0421 , H05K13/08
摘要： An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded in then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
摘要翻译： 公开了一种用于制备电子元件引线的自动引线感测和精细成形系统，使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置，以确定是否需要弯曲引线。 然后，这些引线被弯曲，并且在该过程期间感测和记录引线上的力及其位移。 所记录的数据随后用于随后的弯曲，必要时用于将引线弯曲到目标位置，使得所有引线同时并入孔中。 为了简化图像处理，引线尖端由来自基本上各向同性方向的光照射，该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置，使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
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