公开(公告)号：US08554340B2

公开(公告)日：2013-10-08

申请号：US13364973

申请日：2012-02-02

申请人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, Jr. ,  Leland Joseph Spangler

发明人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, Jr. ,  Leland Joseph Spangler

IPC分类号： A61N1/00

CPC分类号： A61N1/05 ,  A61N1/0553 ,  A61N1/08 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H05K1/118 ,  H05K1/185 ,  H01L2924/00

摘要： An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.

摘要翻译： 一种可植入电极阵列（40,310），其包括多个间隔开的电极（42,316），电流可单独地来源和沉没。 阵列包括支撑电极的载体（80,312）。 将来自电极的电流源电流吸入电流的一个或多个控制模块设置在载体内的窗口（81,404）中。

公开(公告)号：US20120310316A1

公开(公告)日：2012-12-06

申请号：US13364973

申请日：2012-02-02

申请人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, JR. ,  Leland Joseph Spangler

发明人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, JR. ,  Leland Joseph Spangler

IPC分类号： A61N1/05

CPC分类号： A61N1/05 ,  A61N1/0553 ,  A61N1/08 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H05K1/118 ,  H05K1/185 ,  H01L2924/00

摘要： An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.

摘要翻译： 一种可植入电极阵列（40,310），其包括多个间隔开的电极（42,316），电流可单独地来源和沉没。 阵列包括支撑电极的载体（80,312）。 将来自电极的电流源电流吸入电流的一个或多个控制模块设置在载体内的窗口（81,404）中。

公开(公告)号：US20120330393A1

公开(公告)日：2012-12-27

申请号：US13491777

申请日：2012-06-08

申请人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, JR. ,  Leland Joseph Spangler

发明人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, JR. ,  Leland Joseph Spangler

IPC分类号： A61N1/04

CPC分类号： A61N1/0551 ,  A61N1/0553 ,  H01L23/3121 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

摘要翻译： 一种具有柔性阵列基板的电极阵列，其上设置有多个间隔开的电极。 集成电路设置在阵列基板中。 集成电路安装到封装衬底。 封装衬底比阵列衬底更刚性。 每个封装衬底的内部是至少一个电导体。 电导体至少部分地通过封装衬底从与集成电路集成的焊盘延伸。 电导体用作在集成电路与集成电路所连接的电极之间延伸的导电构件。

公开(公告)号：US10046158B2

公开(公告)日：2018-08-14

申请号：US13491777

申请日：2012-06-08

申请人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, Jr. ,  Leland Joseph Spangler

发明人： John Janik ,  Rob Brindley ,  Edward Chia-Ning Tang ,  James Bernard Dunlop, Jr. ,  Leland Joseph Spangler

IPC分类号： A61N1/04 ,  A61N1/05 ,  H01L23/31 ,  H01L23/538

摘要： An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

公开(公告)号：US08781600B2

公开(公告)日：2014-07-15

申请号：US12535717

申请日：2009-08-05

申请人： John Janik ,  Rob Brindley ,  Rakesh Babu Katragadda ,  Edward Chia-Ning Tang

发明人： John Janik ,  Rob Brindley ,  Rakesh Babu Katragadda ,  Edward Chia-Ning Tang

IPC分类号： A61N1/00

CPC分类号： A61N1/05 ,  A61N1/0553 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2924/00

摘要： An implantable electrode array that includes multiple spaced apart electrodes to which current can be individually sourced and sunk. The array includes a carrier that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in recesses within the carrier. A sheet of material more flexible than the carrier is disposed between, on one side, the carrier and the control modules and, on the other side, the electrodes. Conductors over which instructions and power are applied to the control modules and conductors that extend between the control modules are the electrodes are embedded in and extend through the sheet of flexible material.

摘要翻译： 可植入电极阵列，其包括多个间隔开的电极，电流可以单独地来源并沉没到该电极阵列。 阵列包括支撑电极的载体。 将来自电极的电流或电流吸收的一个或多个控制模块设置在载体内的凹槽中。 比载体更柔性的材料片布置在载体和控制模块之间，另一侧上设置有电极。 在控制模块和控制模块之间延伸的控制模块和导体上施加指令和功率的导体是电极嵌入并延伸穿过柔性材料片。

公开(公告)号：US20110034977A1

公开(公告)日：2011-02-10

申请号：US12535717

申请日：2009-08-05

申请人： John Janik ,  Rob Brindley ,  Rakesh Babu Katragadda ,  Edward Chia-Ning Tang

发明人： John Janik ,  Rob Brindley ,  Rakesh Babu Katragadda ,  Edward Chia-Ning Tang

IPC分类号： A61N1/05 ,  H05K3/30

CPC分类号： A61N1/05 ,  A61N1/0553 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2924/00

摘要： An implantable electrode array that includes multiple spaced apart electrodes to which current can be individually sourced and sunk. The array includes a carrier that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in recesses within the carrier. A sheet of material more flexible than the carrier is disposed between, on one side, the carrier and the control modules and, on the other side, the electrodes. Conductors over which instructions and power are applied to the control modules and conductors that extend between the control modules are the electrodes are embedded in and extend through the sheet of flexible material.

摘要翻译： 可植入电极阵列，其包括多个间隔开的电极，电流可以单独地来源并沉没到该电极阵列。 阵列包括支撑电极的载体。 将来自电极的电流或电流吸收的一个或多个控制模块设置在载体内的凹槽中。 比载体更柔性的材料片布置在载体和控制模块之间，另一侧上设置有电极。 在控制模块和控制模块之间延伸的控制模块和导体上施加指令和功率的导体是电极嵌入并延伸穿过柔性材料片。