Implementing loading and heat removal for hub module assembly
    1.
    发明授权
    Implementing loading and heat removal for hub module assembly 失效
    实现轮毂模块组装的加载和除热

    公开(公告)号:US08363404B2

    公开(公告)日:2013-01-29

    申请号:US12967854

    申请日:2010-12-14

    IPC分类号: H05K7/20 F28F7/00 H01L23/34

    摘要: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.

    摘要翻译: 提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。 集线器模块组件包括集线器芯片和多个光学模块,其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金(TSM)LGA上的焊盘网阵列(LGA)组件连接。 陶瓷基板通过底表面冶金(BSM)LGA组件连接到电路板。 基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。 一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐,保持并使光学模块与集线器芯片之间的电连接。

    IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY
    2.
    发明申请
    IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY 失效
    实现加载和散热用于集体模块组装

    公开(公告)号:US20120147563A1

    公开(公告)日:2012-06-14

    申请号:US12967854

    申请日:2010-12-14

    IPC分类号: H05K7/20

    摘要: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.

    摘要翻译: 提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。 集线器模块组件包括集线器芯片和多个光学模块,其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金(TSM)LGA上的焊盘网阵列(LGA)组件连接。 陶瓷基板通过底表面冶金(BSM)LGA组件连接到电路板。 基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。 一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐,保持并使光学模块与集线器芯片之间的电连接。