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    APPARATUS AND METHOD FOR ATTACHING HEATSINKS
    3.
    发明申请
    APPARATUS AND METHOD FOR ATTACHING HEATSINKS 审中-公开
    装置和连接热源的方法

    公开(公告)号：US20090034198A1

    公开(公告)日：2009-02-05

    申请号：US11831135

    申请日：2007-07-31

    申请人： John L. Colbert ,  John S. Corbin, Jr. ,  Jason R. Eagle ,  Arvind K. Sinha ,  Christopher L. Tuma

    发明人： John L. Colbert ,  John S. Corbin, Jr. ,  Jason R. Eagle ,  Arvind K. Sinha ,  Christopher L. Tuma

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.

    摘要翻译： 一种用于将散热器附接到安装在电路卡组件上的电子模块的装置包括负载框架; 负载臂具有可枢转地联接到负载框架的一端的第一端和构造成容纳至少一部分负载螺钉的第二端; 弹簧板，设置在所述负载框架的一端的相对端，并且构造成螺纹地接收所述负载螺钉，所述弹簧板的相对端被保持，而螺纹接收所述负载螺钉的至少一部分的中间部分是 允许向上朝向负载臂的相对端的底部向上弯曲; 以及设置在模块上的散热器。 当负载螺钉与弹簧板螺纹接合时，与模块的中心区域对准的负载臂的中间部分将散热器朝向模块偏置。

    Heatsink apparatus for applying a specified compressive force to an integrated circuit device
    4.
    发明授权
    Heatsink apparatus for applying a specified compressive force to an integrated circuit device 有权
    用于向集成电路装置施加规定的压缩力的散热装置

    公开(公告)号：US07777329B2

    公开(公告)日：2010-08-17

    申请号：US11460334

    申请日：2006-07-27

    申请人： John L. Colbert ,  John S. Corbin, Jr. ,  Jason R. Eagle ,  Roger Duane Hamilton ,  Amanda E. Mikhail ,  Arvind K. Sinha ,  Terry L. Sobotta

    发明人： John L. Colbert ,  John S. Corbin, Jr. ,  Jason R. Eagle ,  Roger Duane Hamilton ,  Amanda E. Mikhail ,  Arvind K. Sinha ,  Terry L. Sobotta

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.

    摘要翻译： 提供一种装置，其具有布置在印刷电路板上的集成电路装置和集成电路装置上的散热装置。 通过拧紧致动螺钉，弹簧板中的致动螺钉被推靠在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，提供了一种方法，其中致动螺钉被紧固，但是防止超过机械约束被紧固。

    Land grid array socket actuation hardware for MCM applications
    6.
    发明授权
    Land grid array socket actuation hardware for MCM applications 有权
    用于MCM应用的Land Grid阵列插座致动硬件

    公开(公告)号：US06475011B1

    公开(公告)日：2002-11-05

    申请号：US09948195

    申请日：2001-09-07

    申请人： Arvind K. Sinha ,  Roger D. Hamilton ,  John L. Colbert ,  John S. Corbin, Jr. ,  Danny E. Massey

    发明人： Arvind K. Sinha ,  Roger D. Hamilton ,  John L. Colbert ,  John S. Corbin, Jr. ,  Danny E. Massey

    IPC分类号： H01R1362

    CPC分类号： H05K3/325 ,  H01R43/205

    摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

    摘要翻译： 一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧 执行器。 负载柱固定在多芯片模块上并通过印刷电路板。 载荷传递板具有第一刚度。 弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。 背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。 弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。

    Topside installation apparatus for land grid array modules
    7.
    发明授权
    Topside installation apparatus for land grid array modules 失效
    地面栅格阵列模块的顶部安装装置

    公开(公告)号：US06802733B2

    公开(公告)日：2004-10-12

    申请号：US09931299

    申请日：2001-08-16

    申请人： John L. Colbert ,  John S. Corbin, Jr. ,  Roger D. Hamilton ,  Danny E. Massey ,  Arvind K. Sinha

    发明人： John L. Colbert ,  John S. Corbin, Jr. ,  Roger D. Hamilton ,  Danny E. Massey ,  Arvind K. Sinha

    IPC分类号： H01R1362

    CPC分类号： H05K3/325 ,  H05K7/1061

    摘要： An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

    摘要翻译： 提供了一种用于致动陆地网格阵列模块到印刷线路板的电连接的安装装置和方法。 具有负载柱的背面加强件连接到印刷线路板。 负载板，模块，多个负载柱和弹簧板可操作地连接到负载柱。 可操作地连接到弹簧板的致动螺钉被旋转，向模块施加致动力。 背面加强件包括局部加强件，其中当施加致动力时，局部加强件引起印刷线路板中的挠曲与模块的偏转互补。

    Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device
    9.
    发明申请
    Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device 有权
    用于将特定压缩力应用于集成电路装置的散热装置

    公开(公告)号：US20080024991A1

    公开(公告)日：2008-01-31

    申请号：US11460334

    申请日：2006-07-27

    申请人： John L. Colbert ,  John S. Corbin ,  Jason R. Eagle ,  Roger Duane Hamilton ,  Amanda E. Mikhail ,  Arvind K. Sinha ,  Terry L. Sobotta

    发明人： John L. Colbert ,  John S. Corbin ,  Jason R. Eagle ,  Roger Duane Hamilton ,  Amanda E. Mikhail ,  Arvind K. Sinha ,  Terry L. Sobotta

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

    摘要翻译： 给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。 该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

    Motherboard Assembly for Interconnecting and Distributing Signals and Power
    10.
    发明申请
    Motherboard Assembly for Interconnecting and Distributing Signals and Power 审中-公开
    用于互连和分配信号和电源的主板组件

    公开(公告)号：US20130055192A1

    公开(公告)日：2013-02-28

    申请号：US13611609

    申请日：2012-09-12

    申请人： John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

    发明人： John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

    IPC分类号： G06F17/50

    CPC分类号： H05K1/144 ,  G11C5/025 ,  H05K1/113 ,  H05K1/114 ,  H05K1/141 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/044 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2009

    摘要： Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB.

    摘要翻译： 提供了在PCB之间互连和分配信号和电源的机制。 提供了具有地面栅格阵列（LGAs）的第一PCB和为第一PCB上的互连部件设计的第一布线层以及用于将部件连接到第二PCB的第二布线层。 第二PCB具有相对的平行的第一和第二表面，第一表面具有LGA。 设置用于互连第二PCB上的组件的布线层和用于将第二PCB上的组件与第一PCB上的组件互连的层。 第一插入器耦合到第一PCB的第一表面的LGA并将部件连接到第一PCB。 第二插入件夹在第一PCB的第二表面的LGA和第二PCB的第一表面的LGA之间并耦合到第二PCB的第二表面的LGA。