摘要:
An array of Surface Emitting Laser (SEL) elements can be used to efficiently pump a disk or rod of solid-state laser glass or crystal, or harmonic-generating crystal. Placing the laser array chip against or near the surface of this solid-state material provides very high and uniform optical power density without the need for lenses or fiber-optics to conduct the light from typical edge-emitting lasers, usually formed in a stack of bars. The lasers can operate in multi-mode output for highest output powers. Photolithography allows for an infinite variety of connection patterns of sub-groups of lasers within the array, allowing for spatial contouring of the optical pumping power across the face of the solid-state material. The solid-state material may be pumped either within (intra-cavity) or externally (extra-cavity) to the SEL laser array.
摘要:
This invention relates to a method of improving the fabrication of etched semiconductor devices by using a patterned adhesion promoter layer over a hydrocarbon planarization material. More specifically, the present invention improves the bonding of a metal interconnect layer to a hydrocarbon planarization material, such as polyimide, by inserting an adhesion promotion layer, such as silicon nitride, between the hydrocarbon planarization material and the metal interconnect layer. A process for improving the fabrication of etched semiconductor devices, comprises the steps of: (1) depositing a hydrocarbon planarization material over a substrate; (2) depositing an adhesion promoter over the hydrocarbon planarization material; (3) defining a first mask and etching back the adhesion promoter so as to form an adhesion promoter pad over a portion of the hydrocarbon planarization material; and (4) depositing a first metal over the adhesion promoter pad.
摘要:
High power, high speed VCSEL arrays are employed in unique configurations of arrays and sub-arrays. Placement of a VCSEL array behind a lens allows spatial separation and directivity. Diffusion may be employed to increase alignment tolerance. Intensity modulation may be performed by operating groups of VCSEL emitters at maximum bias. Optical communications networks with high bandwidth may employ angular, spatial, and/or wavelength multiplexing. A variety of network topologies and bandwidths suitable for the data center may be implemented. Eye safe networks may employ VCSEL emitters may be paired with optical elements to reduce optical power density to eye safe levels.
摘要:
One or more combiner elements are disclosed for optically combining multiple laser beam bundles, either extra-cavity or intra-cavity to the laser generating array chips, to form higher density bundles of parallel laser beams. The combiner elements can be shared between two or more array chips and include a form of a pellicle combiner, a polarizing beam splitter cube combiner, or some combination of the two devices.