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公开(公告)号：US20100285628A1
公开(公告)日：2010-11-11
申请号：US12804213
申请日：2010-07-16
申请人： John R. Martin , Timothy J. Brosnihan , Craig Core , Thomas Kieran Nunan , Jason Weigold , Xin Zhang
发明人： John R. Martin , Timothy J. Brosnihan , Craig Core , Thomas Kieran Nunan , Jason Weigold , Xin Zhang
CPC分类号： H04R3/00 , B81B2201/0235 , B81B2201/0257 , B81C1/00182 , H01L2224/48137 , H01L2224/49109 , H01L2224/73265 , H01L2924/15151 , H04R19/005 , H04R2499/11
摘要： A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.
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公开(公告)号：US07825484B2
公开(公告)日：2010-11-02
申请号：US11113925
申请日：2005-04-25
申请人： John R. Martin , Timothy J. Brosnihan , Craig Core , Thomas Kieran Nunan , Jason Weigold , Xin Zhang
发明人： John R. Martin , Timothy J. Brosnihan , Craig Core , Thomas Kieran Nunan , Jason Weigold , Xin Zhang
IPC分类号： H01L29/82
CPC分类号： H04R3/00 , B81B2201/0235 , B81B2201/0257 , B81C1/00182 , H01L2224/48137 , H01L2224/49109 , H01L2224/73265 , H01L2924/15151 , H04R19/005 , H04R2499/11
摘要： A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.
摘要翻译： 微机械麦克风由硅或绝缘体上硅（SOI）晶片形成。 用于麦克风的固定感测电极由晶片的顶部硅层形成。 通过沉积形成结构的至少一个氧化物层，然后通过形成的沟槽从顶部硅层的背面去除结构物下面的氧化物的一部分，形成在顶部硅层前侧上的各种多晶硅麦克风结构 通过顶层硅层。 沟槽允许声波从顶部硅层的背面到达隔膜。 在SOI晶片中，通过底部硅层和中间氧化物层形成空腔，以露出沟槽，以去除氧化物并允许声波到达隔膜。 惯性传感器可以形成在相同的晶片上，其中各种惯性传感器结构基本上在同一时间形成并且使用与对应的麦克风结构基本上相同的过程。
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公开(公告)号：US08100012B2
公开(公告)日：2012-01-24
申请号：US12013208
申请日：2008-01-11
申请人： John R. Martin , Xin Zhang
发明人： John R. Martin , Xin Zhang
IPC分类号： G01P15/125 , G01P1/02
CPC分类号： B81C1/00269 , B81B7/0077 , B81B2203/053 , B81C99/0045 , Y10T29/49002
摘要： A MEMS sensor includes a substrate having a MEMS structure movably attached to the substrate, a cap attached to the substrate and encapsulating the MEMS structure, and an electrode formed on the cap that senses movement of the MEMS structure.
摘要翻译： MEMS传感器包括具有可移动地附接到衬底的MEMS结构的衬底，附接到衬底并封装MEMS结构的帽以及形成在盖上的电极，其感测MEMS结构的运动。
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公开(公告)号：US08389314B2
公开(公告)日：2013-03-05
申请号：US11538281
申请日：2006-10-03
申请人： John R. Martin , Thomas D. Chen , Jinbo Kuang , Thomas Kieran Nunan , Xin Zhang
发明人： John R. Martin , Thomas D. Chen , Jinbo Kuang , Thomas Kieran Nunan , Xin Zhang
IPC分类号： H01L21/00
CPC分类号： B81B3/001 , B81B2201/0257 , B81C2201/115
摘要： A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced from the first layer, and an insulator layer between the first layer and second layer. The first layer has a top surface, while the second layer has a bottom surface facing the top surface. After providing the MEMS apparatus, the method increases the roughness of at least the top surface of the first layer or the bottom surface of the second layer.
摘要翻译： 制造MEMS器件的方法提供了具有释放结构的MEMS装置。 MEMS器件至少部分地由具有第一层，与第一层隔开的第二层和在第一层和第二层之间的绝缘体层的SOI晶片形成。 第一层具有顶表面，而第二层具有面向顶表面的底表面。 在提供MEMS装置之后，该方法增加了至少第一层的顶表面或第二层的底表面的粗糙度。
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公开(公告)号：US08129803B2
公开(公告)日：2012-03-06
申请号：US12804213
申请日：2010-07-16
申请人： John R. Martin , Timothy J. Brosnihan , Craig Core , Thomas Kieran Nunan , Jason Weigold , Xin Zhang
发明人： John R. Martin , Timothy J. Brosnihan , Craig Core , Thomas Kieran Nunan , Jason Weigold , Xin Zhang
CPC分类号： H04R3/00 , B81B2201/0235 , B81B2201/0257 , B81C1/00182 , H01L2224/48137 , H01L2224/49109 , H01L2224/73265 , H01L2924/15151 , H04R19/005 , H04R2499/11
摘要： A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.
摘要翻译： 微机械麦克风由硅或绝缘体上硅（SOI）晶片形成。 用于麦克风的固定感测电极由晶片的顶部硅层形成。 通过沉积形成结构的至少一个氧化物层，然后通过形成的沟槽从顶部硅层的背面去除结构物下面的氧化物的一部分，形成在顶部硅层前侧上的各种多晶硅麦克风结构 通过顶层硅层。 沟槽允许声波从顶部硅层的背面到达隔膜。 在SOI晶片中，通过底部硅层和中间氧化物层形成空腔，以露出沟槽，以去除氧化物并允许声波到达隔膜。 惯性传感器可以形成在相同的晶片上，其中各种惯性传感器结构基本上在同一时间形成并且使用与对应的麦克风结构基本上相同的过程。
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公开(公告)号：US07821084B2
公开(公告)日：2010-10-26
申请号：US11952404
申请日：2007-12-07
IPC分类号： H01L29/84
CPC分类号： B60C23/0408 , B81B3/0018 , H01G5/18 , H01G5/40 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： Rather than increasing the mass of the structure, the structure in a sensor system suspends its substrate from some mechanical ground. Motion of the substrate relative to the mechanical ground thus provides the movement information. To those ends, the sensor system includes a base, a substrate, and a flexible member suspended from at least a portion of the substrate. At least a portion of the flexible member is capable of moving relative to at least a portion of the substrate. In addition, the flexible member is secured to the base, thus causing the substrate to be movable relative to the base. Moreover, the mass of the substrate is greater than the mass of the flexible member. The substrate and flexible member are configured to interact to produce a motion signal identifying movement of the base.
摘要翻译： 传感器系统中的结构不是增加结构的质量，而是将其基板从某些机械接地处悬挂下来。 因此，基板相对于机械地面的运动提供运动信息。 为此，传感器系统包括基底，基底和从基底的至少一部分悬挂的柔性构件。 柔性构件的至少一部分能够相对于衬底的至少一部分移动。 此外，柔性构件被固定到基部，从而使得基板相对于基座移动。 此外，衬底的质量大于柔性构件的质量。 衬底和柔性构件被配置为相互作用以产生识别基部的移动的运动信号。
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公开(公告)号：US20080168838A1
公开(公告)日：2008-07-17
申请号：US12013208
申请日：2008-01-11
申请人： John R. Martin , Xin Zhang
发明人： John R. Martin , Xin Zhang
IPC分类号： G01P15/125 , H04R31/00
CPC分类号： B81C1/00269 , B81B7/0077 , B81B2203/053 , B81C99/0045 , Y10T29/49002
摘要： A MEMS sensor includes a substrate having a MEMS structure movably attached to the substrate, a cap attached to the substrate and encapsulating the MEMS structure, and an electrode formed on the cap that senses movement of the MEMS structure.
摘要翻译： MEMS传感器包括具有可移动地附接到衬底的MEMS结构的衬底，附接到衬底并封装MEMS结构的帽以及形成在盖上的电极，其感测MEMS结构的运动。
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公开(公告)号：US20080081391A1
公开(公告)日：2008-04-03
申请号：US11538281
申请日：2006-10-03
申请人： John R. Martin , Thomas D. Chen , Jinbo Kuang , Thomas Kieran Nunan , Xin Zhang
发明人： John R. Martin , Thomas D. Chen , Jinbo Kuang , Thomas Kieran Nunan , Xin Zhang
IPC分类号： H01L21/00
CPC分类号： B81B3/001 , B81B2201/0257 , B81C2201/115
摘要： A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced from the first layer, and an insulator layer between the first layer and second layer. The first layer has a top surface, while the second layer has a bottom surface facing the top surface. After providing the MEMS apparatus, the method increases the roughness of at least the top surface of the first layer or the bottom surface of the second layer.
摘要翻译： 制造MEMS器件的方法提供了具有释放结构的MEMS装置。 MEMS器件至少部分地由具有第一层，与第一层隔开的第二层和在第一层和第二层之间的绝缘体层的SOI晶片形成。 第一层具有顶表面，而第二层具有面向顶表面的底表面。 在提供MEMS装置之后，该方法增加了至少第一层的顶表面或第二层的底表面的粗糙度。
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公开(公告)号：US07327003B2
公开(公告)日：2008-02-05
申请号：US11058483
申请日：2005-02-15
IPC分类号： H01L29/84
CPC分类号： B60C23/0408 , B81B3/0018 , H01G5/18 , H01G5/40 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： Rather than increasing the mass of the structure, the structure in a sensor system suspends its substrate from some mechanical ground. Motion of the substrate relative to the mechanical ground thus provides the movement information. To those ends, the sensor system includes a base, a substrate, and a flexible member suspended from at least a portion of the substrate. At least a portion of the flexible member is capable of moving relative to at least a portion of the substrate. In addition, the flexible member is secured to the base, thus causing the substrate to be movable relative to the base. Moreover, the mass of the substrate is greater than the mass of the flexible member. The substrate and flexible member are configured to interact to produce a motion signal identifying movement of the base.
摘要翻译： 传感器系统中的结构不是增加结构的质量，而是将其基板从某些机械接地处悬挂下来。 因此，基板相对于机械地面的运动提供运动信息。 为此，传感器系统包括基底，基底和从基底的至少一部分悬挂的柔性构件。 柔性构件的至少一部分能够相对于衬底的至少一部分移动。 此外，柔性构件被固定到基部，从而使得基板相对于基座移动。 此外，衬底的质量大于柔性构件的质量。 衬底和柔性构件被配置为相互作用以产生识别基部的移动的运动信号。
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公开(公告)号：USD1021429S1
公开(公告)日：2024-04-09
申请号：US29910924
申请日：2023-08-25
申请人： Xin Zhang
设计人： Xin Zhang
摘要： FIG. 1 is a front, top perspective view of a frame for sofa bed, showing my new design;
FIG. 2 is a rear, bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is an enlarged view of the portion marked “9” in FIG. 1;
FIG. 10 is an enlarged view of the portion marked “10” in FIG. 2;
FIG. 11 is an enlarged view of the portion marked “11” in FIG. 3;
FIG. 12 is an enlarged view of the portion marked “12” in FIG. 4;
FIG. 13 is an enlarged view of the portion marked “13” in FIG. 5;
FIG. 14 is a front, top perspective view of the frame for sofa bed shown partially extended; and,
FIG. 15 is a front, top perspective view of the frame for sofa bed shown fully extended.
The broken lines encircling portions of the frame for sofa bed show the boundaries of the enlarged views and form no part of the claimed design.
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