-
公开(公告)号：US20080270405A1
公开(公告)日：2008-10-30
申请号：US11609213
申请日：2006-12-11
IPC分类号： G06F17/30
CPC分类号： G06F17/30171 , Y10S707/99948
摘要： File systems which provide several different and improved locking capabilities. An application on a client workstation communicates through a client driver to a server which interfaces with a metadata database, which contains locking information about the files. Applications perform as normal. The client driver provides lock and unlock requests to the server when a write lock or a read with intent to write lock is required. If only a read lock is considered appropriate, the client driver does not provide a lock request. The server transparently performs read operations and read locking using the metadata database without specific requests from the client driver. When a read with intent to write or write lock is required, the lock ownership is placed with a given expiration time. When the time expires the lock is not automatically released but remains with the particular requesting client driver until another client driver requests it.
摘要翻译： 提供几种不同和改进的锁定功能的文件系统。 客户端工作站上的应用程序通过客户端驱动程序与连接到元数据数据库的服务器通信，该元数据数据库包含有关文件的锁定信息。 应用程序正常运行。 当需要写入锁定或写入锁定的读取时，客户端驱动程序向服务器提供锁定和解锁请求。 如果只有一个读锁被认为是适当的，则客户端驱动程序不提供锁定请求。 服务器透明地执行读取操作并使用元数据数据库读取锁定，而客户端驱动程序没有特定请求。 当需要写入或写入锁定的读取时，锁定所有权将以给定的到期时间放置。 当时间到期时，锁定不会自动释放，但保留在特定请求客户端驱动程序，直到另一个客户端驱动程序请求。
-
公开(公告)号：US06579430B2
公开(公告)日：2003-06-17
申请号：US10012081
申请日：2001-11-02
申请人： Greg Davis , Alex Moffatt , D. Morgan Tench , John T. White
发明人： Greg Davis , Alex Moffatt , D. Morgan Tench , John T. White
IPC分类号： C25B900
CPC分类号： C25D17/06 , H01L21/2885
摘要： A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.
摘要翻译： 用于半导体晶片电镀的阴极组件使用在金属结构环上的聚合物涂层来提供要被电镀的晶片表面的周边的低轮廓密封。 聚合物涂层还使金属电绝缘，使得其可以与电镀液接触并且仍然是电接触系统的一部分，从而不需要保护性塑料外壳。 本发明允许阴极组件的尺寸最小化。 具有在晶片镀覆表面上方具有最小突起的紧凑型阴极组件能够修改电镀槽和搅拌系统，从而在晶片表面上提供更均匀的铜沉积物，并且有助于晶圆电镀工艺的自动化。
-
公开(公告)号：US5027876A
公开(公告)日：1991-07-02
申请号：US434664
申请日：1989-11-13
申请人： Dennis S. Chrobak , John T. White
发明人： Dennis S. Chrobak , John T. White
CPC分类号： B60C11/032 , B60C13/003 , B60C3/04
摘要： A low pressure radial ply tire (20) for light off-the-road use has tow radial carcass plies (22) oriented at a cord angle (CA) with respect to the Equatorial Plane (EP) from 65 to 85.degree.. The tire is not reinforced by a belt reinforcing structure to allow the carcass (22) to compensate within the footprint of the tire under varying conditions. The tread (26) is provided with a number of holes (38) having a very shallow depth and spaced uniformly across the tread surface to increase flotation and wherein the net-to-gross is in the range of 0.63 to 0.77.
摘要翻译： 用于轻型越野用途的低压径向帘布层轮胎（20）具有相对于赤道平面（EP）从65°至85°以帘线角度（CA）定向的径向胎体帘布层（22）。 轮胎没有被带加强结构加固，以允许胎体（22）在变化的条件下在轮胎的占地面积内补偿。 胎面（26）设置有许多孔（38），其具有非常浅的深度并且在胎面表面上均匀分布以增加浮选，并且其中净重与总重在0.63至0.77的范围内。
-
公开(公告)号：US06709564B1
公开(公告)日：2004-03-23
申请号：US09410250
申请日：1999-09-30
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/123 , H01L21/2885 , H01L21/4846 , H01L21/76877
摘要： The acid copper sulfate solutions used for electroplating copper circuitry in trenches and vias in IC dielectric material in the Damascene process are replaced with a type of plating system based on the use of highly complexing anions (e.g., pyrophosphate, cyanide, sulfamate, etc.) to provide an inherently high overvoltage that effectively suppresses runaway copper deposition. Such systems, requiring only one easily-controlled organic additive species to provide outstanding leveling, are more efficacous for bottom-up filling of Damascene trenches and vias than acid copper sulfate baths, which require a minimum of two organic additive species. The highly complexed baths produce fine-grained copper deposits that are typically much harder than large-grained acid sulfate copper deposits, and which exhibit stable mechanical properties that do not change with time, thereby minimizing “dishing” and giving more consistent CMP results. The mechanical properties and texture of the fine-grained deposits are also much less substrate dependent, which minimizes the effects of variations and flaws in the barrier and seed layers. The resistivity of pyrophosphate and annealed acid sulfate copper deposits are approximately equivalent.
摘要翻译： 用于电镀铜电路的酸性硫酸铜溶液用于在马赛克（Damascene）工艺中的IC电介质材料的沟槽和通孔中电镀铜电路，该电镀系统基于使用高度络合的阴离子（如焦磷酸盐，氰化物，氨基磺酸盐等） 以提供有效抑制失控的铜沉积的固有的高过电压。 与需要至少两种有机添加物种的酸性硫酸铜浴相比，仅需要一种容易控制的有机添加剂来提供优异的流平性的这种系统对于自底向上填充大马士革沟槽和通孔更有效。 高度复杂的浴槽产生细粒度的铜沉积物，其通常比大粒度的硫酸硫酸铜沉积物更硬，并且其表现出不会随时间变化的稳定的机械性能，从而最小化“凹陷”并提供更一致的CMP结果。 细颗粒沉积物的机械性能和质地也要小得多，从而使屏障和种子层的变化和缺陷的影响最小化。 焦磷酸盐和退火的硫酸硫酸铜沉积物的电阻率大致相当。
-
公开(公告)号：US4252027A
公开(公告)日：1981-02-24
申请号：US76058
申请日：1979-09-17
申请人： Cameron A. Ogden , Dennis M. Tench , John T. White
发明人： Cameron A. Ogden , Dennis M. Tench , John T. White
CPC分类号： G01N3/08
摘要： A band of material is formed by plating the material onto a cylindrical cathode sandwiched between a pair of insulating end pieces and is supported in a plating bath spaced a short distance from an anode. The cathode is rotated about its axis to provide uniform, reproducible mass transport to the plating surface. In order to determine the tensile properties of the plated material, the band is removed from the cathode and pulled apart in a tensile machine. During tensile testing, the band is held using a pair of pins and clevis, or it is formed into a strip and gripped in a standard fixture. In order to determine the stress condition of the plated material, the band is cut open and its change in diameter measured.
摘要翻译： 通过将材料镀覆在夹在一对绝缘端片之间的圆柱形阴极上并且被支撑在与阳极间隔很短距离的电镀浴中来形成材料带。 阴极围绕其轴线旋转以提供均匀的，可再现的质量传输到电镀表面。 为了确定电镀材料的拉伸性能，将带从阴极移除并在拉伸机中拉开。 在拉伸试验期间，使用一对销和U形夹保持带，或者将其形成为带状并夹在标准夹具中。 为了确定电镀材料的应力条件，将带截断并测量其直径变化。
-
公开(公告)号：US4060333A
公开(公告)日：1977-11-29
申请号：US705093
申请日：1976-07-14
申请人： John T. White
发明人： John T. White
CPC分类号： B23B47/287 , Y10T408/563 , Y10T408/895 , Y10T408/97 , Y10T83/75
摘要： Disk cutting apparatus embodying a pair of detachable clamping elements having flat surfaces facing each other for clamping a stack of sheets of material therebetween from which the disks are cut. At least one opening is provided through a clamping element and is of a size corresponding to the size of the disk to be cut. A cutter extends through the opening and has inner and outer cylindrical surfaces with the outer surface being of a size corresponding to the size of the opening. The inner surface at one end of the cutter is beveled to provide an outwardly flaring annular surface which terminates in an annular cutting edge.
摘要翻译： 圆盘切割装置具有一对可拆卸夹紧元件，该夹紧元件具有彼此面对的平坦表面，用于夹紧其间切割的盘片材料堆。 通过夹紧元件提供至少一个开口，并且具有与要切割的盘的尺寸对应的尺寸。 切割器延伸穿过开口并且具有内圆柱形表面和外圆柱形表面，其外表面的尺寸对应于开口的尺寸。 切割器一端的内表面是斜面的，以提供一个向外扩张的环形表面，其终止于环形切割边缘。
-
公开(公告)号：US06503343B1
公开(公告)日：2003-01-07
申请号：US09658643
申请日：2000-09-11
IPC分类号： C23C2282
CPC分类号： H01L21/288 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C18/42 , C23C18/54 , H01L24/11 , H01L2224/13099 , H01L2224/45144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/30107 , H01L2924/00
摘要： A direct displacement plating process provides a uniform, adherent coating of a relatively stable metal (e.g., nickel) on a highly reactive metal (e.g., aluminum) that is normally covered with a recalcitrant oxide layer. The displacement reaction proceeds, preferably in a nonaqueous solvent, as the oxide layer is dissolved by a fluoride activator. Halide anions are used to provide high solubility, to serve as an anhydrous source of stable metal ions, and to control the rate of the displacement reaction. A low concentration of activator species and little or no solution agitation are used to cause depletion of the activator species within pores in the surface oxide so that attack of the reactive metal substrate is minimized. Used in conjunction with electroless nickel deposition to thicken the displacement coating, this process can be used to render aluminum pads on IC chips solderable without the need for expensive masks and vacuum deposition operations. Such coatings can also be used to preserve or restore wire bondability, or for corrosion protection of aluminum and other reactive structural metals and alloys. A thin layer of immersion gold can be used to protect the thickened coating from oxidation. The solderable aluminum IC chip pads provide the basis for a maskless bumping process for flip chip attachment.
摘要翻译： 直接移位电镀方法提供了在通常被顽固氧化物层覆盖的高反应性金属（例如铝）上的相对稳定的金属（例如镍）的均匀涂层。 随着氧化物层被氟化物活化剂溶解，置换反应优选在非水溶剂中进行。 卤化阴离子用于提供高溶解度，用作稳定金属离子的无水源，并控制置换反应的速率。 使用低浓度的活化剂物质和很少或不用溶液搅拌来引起表面氧化物中的孔隙内的活化剂物质的耗尽，从而使反应性金属底物的侵蚀最小化。 与无电镍沉积结合使用以增加位移涂层，该工艺可用于使IC芯片上的铝焊盘可焊接，而无需昂贵的掩模和真空沉积操作。 这种涂层也可用于保护或恢复线焊接性，或用于铝及其他反应性结构金属和合金的腐蚀保护。 浸金的薄层可用于保护增厚涂层免受氧化。 可焊接铝IC芯片焊盘为倒装芯片安装的无掩模凸块工艺提供了基础。
-
公开(公告)号：US4497170A
公开(公告)日：1985-02-05
申请号：US400578
申请日：1982-07-22
申请人： Harry A. Elliott , John T. White
发明人： Harry A. Elliott , John T. White
CPC分类号： F23R3/26
摘要： An annular, variable geometry combustor is provided with an actuation system operable to inversely vary air inflow to the combustor liner through axially spaced inlet openings formed therein.
摘要翻译： 环形可变几何形状燃烧器设置有致动系统，其可操作以通过形成在其中的轴向间隔开的入口反向地改变通向燃烧器衬套的空气流入。
-
公开(公告)号：US4032928A
公开(公告)日：1977-06-28
申请号：US713763
申请日：1976-08-12
申请人： John T. White , Kenneth T. Lovelady
发明人： John T. White , Kenneth T. Lovelady
CPC分类号： G01D15/18 , B41J2/025 , Y10T29/49401
摘要： A modulator for ink jet printers is provided for operation over a wide bandwidth of high frequency drop rates. The longitudinal dimensions of each part of the modulator are made small compared to the wavelength of the shortest standing longitudinal acoustic wave that may be produced in a structure of the same material as the part in question. A piezoelectric crystal is seated within a mount acoustically decoupled at the edges therof. An electrode is axially aligned with the crystal and placed in contact with the crystal. A short hollow cylinder forms an ink chamber axially aligned with the crystal. The end of the ink chamber opposite the crystal is closed by a front plate having a nozzle axially located therein.Plural nozzles may be utilized to produce parallel ink streams which break into droplets at substantially the same time and at a near uniform distance from the nozzles.
-
公开(公告)号：US06989084B2
公开(公告)日：2006-01-24
申请号：US10012079
申请日：2001-11-02
申请人： D. Morgan Tench , John T. White
发明人： D. Morgan Tench , John T. White
CPC分类号： H01L21/2885 , C25D5/08 , C25D7/12 , C25D17/001 , H01L2924/0002 , H01L2924/00
摘要： A new cell assembly for semiconductor wafer electroplating in the plated-side-up configuration utilizes a narrow passageway around the perimeter of the wafer through which solution is forced so as to provide the laminar flow needed for effective Damascene copper plating. In addition, use of a cylindrical insulating cell wall whose inside diameter matches that of the wafer area being plated avoids overplating of the wafer periphery. Anode isolation in a compartment separated via a solution transport barrier prevents introduction of particulates and holds anolyte in place during wafer changes. This cell assembly is readily amendable to automated wafer plating.
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.069 秒)
