Drop generator
    4.
    发明申请
    Drop generator 审中-公开
    掉落发电机

    公开(公告)号:US20070120896A1

    公开(公告)日:2007-05-31

    申请号:US11289889

    申请日:2005-11-30

    IPC分类号: B41J2/045

    CPC分类号: B41J2/14233

    摘要: A drop generator including a pressure chamber defined by a chamber wall structure, a diaphragm plate disposed on the chamber wall structure and covering the pressure chamber, a piezoelectric transducer attached to the diaphragm plate, and a recess formed in the diaphragm plate and underlying an associated peripheral portion of the piezoelectric transducer such that the associated peripheral portion overhangs the recess.

    摘要翻译: 一种液滴发生器,包括由腔室壁结构限定的压力室,设置在室壁结构上并覆盖压力室的隔膜板,附接到隔膜板的压电换能器,以及形成在隔膜板中的凹槽, 压电换能器的周边部分,使得相关联的周边部分突出于凹部。

    High density probe head for chip testing
    5.
    依法登记的发明
    High density probe head for chip testing 失效
    高密度探头用于芯片测试

    公开(公告)号:USH663H

    公开(公告)日:1989-08-01

    申请号:US143511

    申请日:1988-01-13

    申请人: Dan Massopust

    发明人: Dan Massopust

    IPC分类号: G01R1/073

    CPC分类号: G01R1/07321

    摘要: A probe head of substantially rectangular construction for use in the testing of chips. The probe head has a body disposed about the perimeter of a substantially transparent fused silica window, probe points extending in a high-density fixed configuration through the fused silica window, and probe leads at one end of which the probe points are formed. The probe leads are disposed in a plurality of layers, such that interior surface, as well as perimeter, probing and testing of chips is facilitated. The probe head also includes a depth-limit plate extending over the edge of the fused silica window and connecting to the probe head body.

    High density disposable printed circuit inter-board connector
    6.
    发明授权
    High density disposable printed circuit inter-board connector 失效
    高密度一次性印刷电路板间连接器

    公开(公告)号:US4813128A

    公开(公告)日:1989-03-21

    申请号:US143572

    申请日:1988-01-13

    申请人: Dan Massopust

    发明人: Dan Massopust

    摘要: A connector frame for use in the connection of electrical circuit assemblies having pins integrally connected therewith. The connector frame is a body of electrically non-conductive, thermally conductive material having one or more apertures bored through the body, said apertures being through-plated with an electrically-conductive material having a lower melting point than any of the surrounding materials. Said body also includes at least one separate aperture in which is disposed an electrically-conductive, heat-generating wire, said wire having the capacity to generate sufficient heat to melt the electrically-conductive material disposed in the apertures to form a strong electrical and mechanical bond between the pins of the electrical circuit assemblies.

    摘要翻译: 用于连接具有与其整体连接的销的电路组件的连接器框架。 连接器框架是具有穿过本体的一个或多个孔的非导电导热材料的主体,所述孔通过具有比任何周围材料低的熔点的导电材料进行镀覆。 所述主体还包括至少一个单独的孔,其中设置有导电的发热线,所述线具有产生足够的热量以熔化设置在孔中的导电材料以形成强电和机械的能力 电路组件的引脚之间的接合。