摘要:
A pharmaceutical composition comprising a compound of formula (I) wherein X is an electron withdrawing group, Y1 is hydrogen, alkyl, alkenyl, alkynyl, aryl, heterocyclyl, —SO2R4, —CO2R4, —CONHR4 or —COR4, and each of R1, R2 and R4, which may be the same or different, is hydrogen, alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, aryl or heterocyclyl, or a compound of formula (II) wherein each of Y2 and Y3, which may be the same or different, is hydrogen, alkyl, alkenyl, alkynyl, aryl, heterocyclyl, —SO2R9, —CO2R9, —CONHR9 or —COR9, Z is hydrogen, alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, aryl, heterocyclyl, —CH═C(NHR10)CH((CH2)mCO2R11)(C═O)CH3 or —CH2(C═O)CH((CH2)mCO2R11)(C═O)CH3, R8 is —(CH2)nCO2R12, each of R5 to R7 and R9 to R12, which may be the same or different, is hydrogen, alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, aryl or heterocyclyl, and each of m and n, which may be the same or different, is 1 to 6 or a compound of formula (III) wherein each of Y4 to Y6, which may be the same or different, is hydrogen, alkyl, alkenyl, alkynyl, aryl, heterocyclyl, —SO2R19, —CO2R19, —CONHR19 or —COR19, each of R16 and R17, which may be the same or different, is —(CH2)pCO2R20, each of R13 to R15 and R18 to R20, which may be the same or different, is hydrogen, alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, aryl or heterocyclyl, and p is 1 to 6, or other photolabile degradation product of bilirubin or biliverdin or derivative of a photolabile degradation fragment of bilirubin or biliverdin, or a pharmaceutically acceptable salt thereof, together with a pharmaceutically acceptable carrier or diluent.
摘要:
VoIP Routing Registry (VRR) has been created to allow VoIP Service Providers to direct calls properly over their IP networks. In operation, the VRR translates a 10-digit or 6-digit telephone number into a URI that can be used for routing. The VRR must also take into consideration Local Number Portability (LNP).
摘要:
An electronics module assembly for detachably retaining a pair of electronic sub-modules in a single slot of a chassis. A host module of the electronics module assembly is configured to be detachably received and retained in a slot of the chassis. The host module has a height corresponding with a height of the slot of the chassis. A pair of sub-modules are configured to be detachably received and retained in the host module. The combined height of the sub-modules is no greater than the height dimension of the slot of the chassis. Therefore, where there was once only room for one electronics module in a single slot of the chassis, a pair of sub-modules with the host module may now be utilized in the single slot of the chassis.
摘要:
A solid state lighting component comprising a layer having high reflectivity and/or scattering properties, the layer positioned about a solid state lighting component, and manufacturing methods of making same is disclosed. A method of increasing the luminous flux of the solid state lighting component, is also provided.
摘要:
A spinal fusion implant of non-bone construction to be introduced into any variety of spinal target sites. The spinal fusion implant of the present invention includes a top surface, a bottom surface, first and second lateral sides, a proximal (posterior) end and a distal (anterior) end. The spinal fusion implant of the present invention may be used to provide temporary or permanent fixation within an orthopedic target site. To do so, the spinal fusion implant may be introduced into a disc space while locked to a surgical insertion instrument and thereafter employed in the proper orientation and released. Once deposited in the disc space, the spinal fusion implant of the present invention effects spinal fusion over time as the natural healing process integrates and binds the implant.
摘要:
Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
摘要:
In the present technique for power management of a power amplifier, an amplifier bank from a plurality of amplifier banks in a power amplifier that has been switched off for a longest period of time is assessed (826) to provide a lowest amplifier bank. With this lowest amplifier bank, an up-threshold that is associated to the lowest amplifier bank is assessed (828), followed by another assessment (820) of a current power output of the power amplifier. It is next determined (830) whether the current power output corresponds at least in a predetermined way to the up-threshold, and if so, the lowest amplifier bank is accordingly switched on (832).
摘要:
The present invention provides methods for assessing a condition in an individual by analyzing a cerebrospinal fluid sample from the individual, for example, by spectroscopy. Further, the invention provides methods for determining an amount of blood in the cerebrospinal fluid sample; methods for determining concentrations of analytes in the cerebrospinal fluid sample; methods for determining a length of time the blood has been in the cerebrospinal fluid sample; and methods for rapidly obtaining a differential diagnosis between conditions indicated by blood in the cerebral spinal fluid. Moreover, the present invention provides instruments capable of rapidly assessing a condition in and individual by point-of-care analysis of a cerebral fluid sample from an individual.
摘要:
Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.