摘要:
Systems and methods are provided for identifying an atomic element in proximity to an integrated circuit. Trace amounts of a contaminant are identifiable. The atomic element is exposed to neutron radiation to convert a portion of the atomic element into a radioactive isotope of the atomic element. Upsets are measured for the binary states of the memory cells of the integrated circuit during a time period following the exposure to the neutron radiation. The atomic element is identified from the upsets of the binary states of the memory cells of the integrated circuit.
摘要:
Methods and systems are provided for determining a characteristic of an atomic particle affecting a programmable logic device (PLD). The PLD is configured to generate a value at one or more outputs. A source generates a packet of atomic particles. The departure from the source is indicated for the packet of the atomic particles. The PLD is impacted with the packet of the atomic particles. A change is detected in the value of one or more outputs of the PLD. The change in the value of the output or outputs is a result of the impact of the PLD by one of the atomic particles from the packet. A time interval is determined between the departure of the packet of the atomic particles from the source and the change in the value of the output or outputs.
摘要:
SEU-hardening series resistances loads are formed within the gate structures of cross-coupled inverters of a latch. For some embodiments, the gate contact for the input of each cross-coupled inverter has a sufficiently high resistance to provide the SEU-hardening series resistance. For other embodiments, a conductive trace layer coupled to the input of each cross-coupled inverter includes a high-resistivity portion that provides the SEU-hardening series resistance.
摘要:
SEU-hardening series resistances loads are formed within the gate structures of cross-coupled inverters of a latch. For some embodiments, the gate contact for the input of each cross-coupled inverter has a sufficiently high resistance to provide the SEU-hardening series resistance. For other embodiments, a conductive trace layer coupled to the input of each cross-coupled inverter includes a high-resistivity portion that provides the SEU-hardening series resistance.
摘要:
An integrated circuit fabricated in a multiple oxide process can be used to provide a temperature-insensitive circuit. The temperature-insensitive circuit can be a ring oscillator; this ring oscillator can be used as a low-cost integrated reference frequency to monitor and to modify the behavior of the integrated to produce the desired results. In some embodiments, the reference oscillator output can be compared to second oscillator output where the second oscillator performance is temperature-sensitive. The comparison result can be monitored and processed to power down the integrated circuit.
摘要:
A method of and apparatus for generating a spread spectrum clock signal on an integrated circuit are provided. A target frequency generated by a ring oscillator can be modulated by varying a supply voltage to the ring oscillator, thereby changing the target frequency. In one embodiment, the supply voltage is generated by an analog multiplexer that can be digitally controlled. A fixed voltage source can provide an input signal to the analog multiplexer. In one embodiment, the fixed voltage source can be implemented with a unity gain amplifier.
摘要:
A method of implementing a design on a programmable logic device (PLD) includes generating a database that identifies correspondence between resources and programming frames of the PLD. A first PLD design is compiled, wherein the first design uses a first set of resources in a first manner. Costs associated with using the first set of resources of the first design in the first manner are reduced. A second PLD design is then compiled, applying the reduced costs associated with using the first set of resources. A second set of resources required to compile the second design is identified, wherein the second set of resources is not used in the same manner as the first set of resources. A set of programming frames associated with the second set of resources is identified. Costs associated with using a third set of resources associated with the set of programming frames are increased.
摘要:
Method and apparatus are described for duty cycle determination and adjustment. More particularly, an output signal is sampled and provided to duty cycle check circuitry which characterizes the duty cycle of the sampled output signal. This characterization may be provided to a wafer prober or integrated circuit tester to determine whether duty cycle is within an acceptance range. Alternatively, the duty cycle indicator signal may be provided to drive adjustment circuitry. In response to duty cycle not being within an acceptance range, drive adjust circuitry provides a drive adjustment signal to adjust duty cycle at an output buffer by turning on one or more p-channel drive transistors, one or more n-channel drive transistors, or a combination of both. Moreover, wells may be biased responsive to a detected duty cycle in order to correct the duty cycle.
摘要:
A die having a bypass capacitor is stacked on another die having an active circuit. The active circuit draws a spike of current, for example, during a switching period of a voltage on its output lead from one digital logic level to another digital logic level. The bypass capacitor provides a portion of the spike of current through a conductive plug that extends from a plate of the bypass capacitor to a power lead of the active circuit. The length of the conductive plug is reduced by extending the conductive plug from the bypass capacitor to the active circuit orthogonally to the planar orientation of the dice. Reducing the length of the conductive plug reduces the resistance and inductance of the conductive plug and, in turn, reduces the drop in voltage between the voltage on the bypass capacitor and the voltage on the power lead of the active circuit.
摘要:
Method and apparatus are described for providing memory cells enhanced for resistance to single event upsets. In one embodiment, transistors are coupled between cross coupled inverters of a latch, thus in a small area providing both single-event-upset resistivity most of the time, and high speed during writing to the memory cell. Alternatively, inductors coupled between inverters of a latch may be used.