公开(公告)号：US5504026A

公开(公告)日：1996-04-02

申请号：US422036

申请日：1995-04-14

Applicant: Joseph T. Kung

Inventor： Joseph T. Kung

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G01P1/02 ,  G01P15/08 ,  H01L21/784

CPC classification number: G01P15/0802 ,  B81C1/00611 ,  G01P1/023 ,  B81C2201/0119 ,  G01P2015/0828

Abstract: A method for fabricating a micromechanical device and a semiconductor circuit on a substrate includes the steps of forming the micromechanical device on a device area of the substrate, the micromechanical device being embedded in a sacrificial material, selectively depositing a planarization layer on the substrate in a circuit area thereof, forming the semiconductor circuit on the planarization layer in the circuit area and removing the sacrificial material from the embedded micromechanical device. In a preferred embodiment, the planarization layer is an epitaxial silicon layer. A protective cap may be formed over the micromechanical device, so that it is completely encapsulated and is thereby protected against particulate contamination.

Abstract translation: 在衬底上制造微机械器件和半导体电路的方法包括以下步骤：在衬底的器件区域上形成微机械器件，微机械器件嵌入牺牲材料中，在衬底上选择性地沉积平坦化层 在电路区域的平坦化层上形成半导体电路，并从嵌入式微机械器件中除去牺牲材料。 在优选实施例中，平坦化层是外延硅层。 可以在微机械装置上形成保护帽，使得其完全被包封并由此被保护免受颗粒污染。

公开(公告)号：US07750462B1

公开(公告)日：2010-07-06

申请号：US11929115

申请日：2007-10-30

Applicant: Michael Bennett Cohn ,  Joseph T. Kung

Inventor： Michael Bennett Cohn ,  Joseph T. Kung

IPC: H01L23/12 ,  H01L21/46 ,  B23K31/02

CPC classification number: B81C1/00238 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05553 ,  H01L2224/13111 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/75 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.

Abstract translation: 公开了改进的微机电系统（MEMS），使用热压接的工艺和装置。 例如，公开了方法实施例，其中利用晶片尺度以及管芯尺寸的热压粘合来封装MEMS和/或提供与MEMS的电互连。 装置实施例包括用于执行根据方法实施例制造的热压接和粘合的混合结构的装置。 具有各种基板结合和/或密封结构的装置各不相同地提供了减小尺寸，更高的制造成本，降低的成本，改进的可靠性，改进的与现有半导体制造工艺的兼容性和/或更大的多功能性应用的优点。

公开(公告)号：US06853067B1

公开(公告)日：2005-02-08

申请号：US10377999

申请日：2003-02-28

Applicant: Michael B. Cohn ,  Joseph T. Kung

Inventor： Michael B. Cohn ,  Joseph T. Kung

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/60 ,  H01L23/10 ,  H01L23/12

CPC classification number: B81C1/00238 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05553 ,  H01L2224/13111 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/75 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.

Abstract translation: 公开了改进的微机电系统（MEMS），使用热压接的工艺和装置。 例如，公开了方法实施例，其中利用晶片尺度以及管芯尺寸的热压粘合来封装MEMS和/或提供与MEMS的电互连。 装置实施例包括用于执行根据方法实施例制造的热压接和粘合的混合结构的装置。 具有各种基板结合和/或密封结构的装置各不相同地提供了减小尺寸，更高的制造成本，降低的成本，改进的可靠性，改进的与现有半导体制造工艺的兼容性和/或更大的多功能性应用的优点。

公开(公告)号：US07276789B1

公开(公告)日：2007-10-02

申请号：US10851751

申请日：2004-05-20

Applicant: Michael B. Cohn ,  Joseph T. Kung

Inventor： Michael B. Cohn ,  Joseph T. Kung

IPC: H01L23/12

CPC classification number: B81C1/00238 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05553 ,  H01L2224/13111 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/75 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.

Abstract translation: 公开了改进的微机电系统（MEMS），使用热压接的工艺和装置。 例如，公开了方法实施例，其中利用晶片尺度以及管芯尺寸的热压粘合来封装MEMS和/或提供与MEMS的电互连。 装置实施例包括用于执行根据方法实施例制造的热压接和粘合的混合结构的装置。 具有各种基板结合和/或密封结构的装置各不相同地提供了减小尺寸，更高的制造成本，降低的成本，改进的可靠性，改进的与现有半导体制造工艺的兼容性和/或更大的多功能性应用的优点。

公开(公告)号：US4860232A

公开(公告)日：1989-08-22

申请号：US41773

申请日：1987-04-22

Applicant: Hae-Seung Lee ,  Roger T. Howe ,  Joseph T. Kung

Inventor： Hae-Seung Lee ,  Roger T. Howe ,  Joseph T. Kung

IPC: G01D5/241 ,  G01L9/12 ,  G01R17/06 ,  G01R27/26

CPC classification number: G01D5/2415 ,  G01L9/125 ,  G01R17/06 ,  G01R27/2605

Abstract: The present invention comprises a circuit for measuring the capacitive differences of small capacitors. The circuit comprises a reference capacitor and a sensor capacitor. Connected to one of the plates of each capacitor is a switch which connects the capacitors to one of two reference voltages. The other plate of the capacitors are connected to an input terminal of a voltage comparator. The comparator compares the input voltage with a third reference voltage. Differences in voltages detected by the comparator are applied to a feedback loop for generating an offset voltage at the input terminal. The offset voltage applied at the input terminal is proportional to the capacitive difference between the reference capacitor and the sensor capacitor. The feedback loop comprises a successive approximation register for digitizing the offset voltages and a digital to analog converter for converting the digitized voltages into analog voltages which are applied at the input terminal. Digitized offset voltages can be measured at the output of the successive approximation register.

Abstract translation: 本发明包括用于测量小电容器的电容差的电路。 该电路包括参考电容器和传感器电容器。 连接到每个电容器的一个板的是将电容器连接到两个参考电压之一的开关。 电容器的另一个电极连接到电压比较器的输入端。 比较器将输入电压与第三参考电压进行比较。 由比较器检测的电压的差异被施加到用于在输入端产生偏移电压的反馈回路。 施加在输入端子的偏移电压与参考电容器和传感器电容器之间的电容差成正比。 反馈回路包括用于数字化偏移电压的逐次逼近寄存器和用于将数字化电压转换成在输入端施加的模拟电压的数模转换器。 可以在逐次逼近寄存器的输出端测量数字化偏移电压。

公开(公告)号：US3989984A

公开(公告)日：1976-11-02

申请号：US595047

申请日：1975-07-11

Applicant: Myron P. Amason ,  Joseph T. Kung

Inventor： Myron P. Amason ,  Joseph T. Kung

IPC: B64D45/02 ,  F16B33/00 ,  H05F1/02

CPC classification number: B29C70/885 ,  B64D45/02 ,  F16B33/004 ,  B29L2031/3076

Abstract: Lightning protection means for aircraft structural components includes thin, perforated, dielectric and metallic layers applied to the ordinarily lightning-accessible surfaces of composite structures. Where the outer metallic layer of the lightning protection means is formed from sprayed metal, ground connection means to the metallic layer preferably comprises a section of wire screen fused with the sprayed metal on the dielectric layer, a thin metal plate brazed to the wire screen, and a metal attachment connecting the metal plate to adjacent ground structure. Composite-to-metal or composite-to-composite structural joints are protected by making the entire bonded and bolted interface areas conductive for transfer of lightning current, or by isolating the bonded interface area to control the transfer path of the lightning current through the bolted interface area only.

Abstract translation: 用于飞机结构部件的防雷装置包括施加到复合结构的通常可闪电接触表面的薄的，穿孔的，电介质的和金属的层。 在防雷装置的外金属层由喷涂的金属形成的地方，金属层的接地连接装置优选地包括与电介质层上的喷涂金属熔合的一段金属丝网，钎焊到丝网的薄金属板， 以及将金属板连接到相邻的地面结构的金属附件。 通过使整个接合和螺栓接口区域导电以传递雷电电流，或通过隔离接合界面区域来控制雷电电流通过螺栓连接的传输路径来保护复合 - 金属或复合 - 复合结构接头 界面区域。