Graphene/Nanostructure FET with Self-Aligned Contact and Gate
    3.
    发明申请
    Graphene/Nanostructure FET with Self-Aligned Contact and Gate 有权
    具有自对准接触和栅极的石墨烯/纳米结构FET

    公开(公告)号:US20110309334A1

    公开(公告)日:2011-12-22

    申请号:US12820341

    申请日:2010-06-22

    IPC分类号: H01L29/78 H01L29/76 H01L21/84

    摘要: A method for forming a field effect transistor (FET) includes depositing a channel material on a substrate, the channel material comprising one of graphene or a nanostructure; forming a gate over a first portion of the channel material; forming spacers adjacent to the gate; depositing a contact material over the channel material, gate, and spacers; depositing a dielectric material over the contact material; removing a portion of the dielectric material and a portion of the contact material to expose the top of the gate; recessing the contact material; removing the dielectric material; and patterning the contact material to form a self-aligned contact for the FET, the self-aligned contact being located over a source region and a drain region of the FET, the source region and the drain region comprising a second portion of the channel material.

    摘要翻译: 一种用于形成场效应晶体管(FET)的方法,包括在衬底上沉积沟道材料,所述沟道材料包括石墨烯或纳米结构之一; 在所述通道材料的第一部分上形成栅极; 形成邻近门的间隔物; 在沟道材料,栅极和间隔物上沉积接触材料; 在所述接触材料上沉积介电材料; 去除介电材料的一部分和接触材料的一部分以暴露栅极的顶部; 使接触材料凹陷; 去除介电材料; 以及图案化所述接触材料以形成所述FET的自对准接触,所述自对准接触位于所述FET的源极区域和漏极区域之上,所述源极区域和所述漏极区域包括所述沟道材料的第二部分 。

    Graphene/Nanostructure FET with Self-Aligned Contact and Gate
    4.
    发明申请
    Graphene/Nanostructure FET with Self-Aligned Contact and Gate 审中-公开
    具有自对准接触和栅极的石墨烯/纳米结构FET

    公开(公告)号:US20120298949A1

    公开(公告)日:2012-11-29

    申请号:US13570275

    申请日:2012-08-09

    IPC分类号: H01L29/10

    摘要: A field effect transistor (FET) includes a substrate; a channel material located on the substrate, the channel material comprising one of graphene or a nanostructure; a gate located on a first portion of the channel material; and a contact aligned to the gate, the contact comprising one of a metal silicide, a metal carbide, and a metal, the contact being located over a source region and a drain region of the FET, the source region and the drain region comprising a second portion of the channel material.

    摘要翻译: 场效应晶体管(FET)包括衬底; 位于所述基板上的通道材料,所述通道材料包括石墨烯或纳米结构之一; 位于所述通道材料的第一部分上的门; 以及与栅极对准的触点,所述触点包括金属硅化物,金属碳化物和金属之一,所述触点位于所述FET的源极区域和漏极区域之上,所述源极区域和所述漏极区域包括 通道材料的第二部分。

    Graphene/nanostructure FET with self-aligned contact and gate
    5.
    发明授权
    Graphene/nanostructure FET with self-aligned contact and gate 有权
    具有自对准接触和栅极的石墨烯/纳米结构FET

    公开(公告)号:US09368599B2

    公开(公告)日:2016-06-14

    申请号:US12820341

    申请日:2010-06-22

    摘要: A method for forming a field effect transistor (FET) includes depositing a channel material on a substrate, the channel material comprising one of graphene or a nanostructure; forming a gate over a first portion of the channel material; forming spacers adjacent to the gate; depositing a contact material over the channel material, gate, and spacers; depositing a dielectric material over the contact material; removing a portion of the dielectric material and a portion of the contact material to expose the top of the gate; recessing the contact material; removing the dielectric material; and patterning the contact material to form a self-aligned contact for the FET, the self-aligned contact being located over a source region and a drain region of the FET, the source region and the drain region comprising a second portion of the channel material.

    摘要翻译: 一种用于形成场效应晶体管(FET)的方法,包括在衬底上沉积沟道材料,所述沟道材料包括石墨烯或纳米结构之一; 在所述通道材料的第一部分上形成栅极; 形成邻近门的间隔物; 在沟道材料,栅极和间隔物上沉积接触材料; 在所述接触材料上沉积介电材料; 去除介电材料的一部分和接触材料的一部分以暴露栅极的顶部; 使接触材料凹陷; 去除介电材料; 以及图案化所述接触材料以形成所述FET的自对准接触,所述自对准接触位于所述FET的源极区域和漏极区域之上,所述源极区域和所述漏极区域包括所述沟道材料的第二部分 。

    High Performance Devices and High Density Devices on Single Chip
    9.
    发明申请
    High Performance Devices and High Density Devices on Single Chip 失效
    单芯片高性能器件和高密度器件

    公开(公告)号:US20120299107A1

    公开(公告)日:2012-11-29

    申请号:US13571734

    申请日:2012-08-10

    IPC分类号: H01L27/12

    CPC分类号: H01L21/823807 H01L29/7847

    摘要: A CMOS chip comprising a high performance device region and a high density device region includes a plurality of high performance devices comprising n-type field effect transistors (NFETs) and p-type field effect transistors (PFETs) in the high performance device region, wherein the high performance devices have a high performance pitch; and a plurality of high density devices comprising NFETs and PFETs in the high density device region, wherein the high density devices have a high density pitch, and wherein the high performance pitch is about 2 to 3 times the high density pitch; wherein the high performance device region comprises doped source and drain regions, NFET gate regions having an elevated stress induced using stress memorization technique (SMT), gate silicide and source/drain silicide regions, and a dual stressed liner, and wherein the high density device region comprises doped source and drain regions, gate silicide regions, and a neutral stressed liner.

    摘要翻译: 包括高性能器件区域和高密度器件区域的CMOS芯片包括在高性能器件区域中包括n型场效应晶体管(NFET)和p型场效应晶体管(PFET)的多个高性能器件,其中 高性能器件具有高性能间距; 以及在高密度器件区域中包括NFET和PFET的多个高密度器件,其中高密度器件具有高密度间距,并且其中高性能间距是高密度间距的约2至3倍; 其中所述高性能器件区域包括掺杂源极和漏极区域,具有使用应力记忆技术(SMT),栅极硅化物和源极/漏极硅化物区域引起的升高的应力的NFET栅极区域和双重应力衬里,并且其中所述高密度器件 区域包括掺杂源极和漏极区,栅极硅化物区域和中性应力衬里。