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1.发明申请Co-Fired Multi-Layer Antenna for Implantable Medical Devices and Method for Forming the Same 有权用于可植入医疗器械的共同多层天线及其形成方法公开(公告)号：US20100114246A1
公开(公告)日：2010-05-06
申请号：US12347694
申请日：2008-12-31
CPC分类号： A61N1/37223 , A61N1/37229 , A61N1/375 , H01Q1/273 , H01Q9/40 , H01Q11/08 , Y10T29/49016
摘要： An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the plurality of dielectric layers. The antenna includes antenna portions formed within different layers of the monolithic structure with at least one conductive via formed to extend through the dielectric layers in order to provide a conductive pathway between the portions of the antenna formed on different layers, such that an antenna is formed that extends between different vertical layers. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure. The antenna embedded within the monolithic structure can be arranged to have a substantially spiral, helical, fractal, meandering or planer serpentine spiral shape.
摘要翻译： 提供了一种用于可植入医疗装置（IMD）的天线，其包括由多个离散电介质层衍生的单片结构，所述绝缘电介质层具有嵌入在所述多个电介质层内的天线。 天线包括形成在整体结构的不同层内的天线部分，其中至少一个导电通孔形成为延伸穿过电介质层，以便在形成在不同层上的天线的部分之间提供导电通路，从而形成天线 其在不同的垂直层之间延伸。 电介质层可以包括陶瓷材料层，其可与天线一起共烧以形成气密密封的单片天线结构。 嵌入整体结构内的天线可被布置成具有基本螺旋，螺旋，分形，曲折或平面蛇形螺旋形状。
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2.发明授权Co-fired multi-layer antenna for implantable medical devices and method for forming the same 有权用于可植入医疗器械的共烧多层天线及其形成方法公开(公告)号：US08983618B2
公开(公告)日：2015-03-17
申请号：US12347694
申请日：2008-12-31
CPC分类号： A61N1/37223 , A61N1/37229 , A61N1/375 , H01Q1/273 , H01Q9/40 , H01Q11/08 , Y10T29/49016
摘要： An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the plurality of dielectric layers. The antenna includes antenna portions formed within different layers of the monolithic structure with at least one conductive via formed to extend through the dielectric layers in order to provide a conductive pathway between the portions of the antenna formed on different layers, such that an antenna is formed that extends between different vertical layers. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure. The antenna embedded within the monolithic structure can be arranged to have a substantially spiral, helical, fractal, meandering or planer serpentine spiral shape.
摘要翻译： 提供了一种用于可植入医疗装置（IMD）的天线，其包括由多个离散电介质层衍生的单片结构，所述绝缘电介质层具有嵌入在所述多个电介质层内的天线。 天线包括形成在整体结构的不同层内的天线部分，其中至少一个导电通孔形成为延伸穿过电介质层，以便在形成在不同层上的天线的部分之间提供导电通路，从而形成天线 其在不同的垂直层之间延伸。 电介质层可以包括陶瓷材料层，其可与天线一起共烧以形成气密密封的单片天线结构。 嵌入整体结构内的天线可被布置成具有基本螺旋，螺旋，分形，曲折或平面蛇形螺旋形状。
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3.发明授权Co-fired electrical feedthroughs for implantable medical devices having a shielded RF conductive path and impedance matching 有权用于具有屏蔽RF导电路径和阻抗匹配的可植入医疗设备的共同电气馈通公开(公告)号：US08725263B2
公开(公告)日：2014-05-13
申请号：US12533994
申请日：2009-07-31
IPC分类号： A61N1/00
CPC分类号： A61N1/3754 , A61N1/37223
摘要： A co-fired electrical feedthrough for an implantable medical device (IMD) is provided having a shielded radio frequency (RF) conductive path. The feedthrough includes a monolithic structure derived from one or more layers of dielectric material and a conductive pathway extending through the monolithic structure for communicating RF signals into and from the IMD. An internal shield is formed to extend through at least one of the layers of dielectric material so as to surround the conductive pathway (e.g., in a coaxial relationship) and shield the RF conductive pathway from undesirable signals. This shielding of the RF conductive pathway prevents destructive EMI signals from entering into the IMD through the RF conductive pathway. In some embodiments, a monolithic structure containing embedded impedance matching elements is electrically connected to at least one conductive pathway in the feedthrough to perform impedance matching and/or filtering of the conductive pathway to other circuitry.
摘要翻译： 提供了一种用于可植入医疗装置（IMD）的共同燃烧电馈通，其具有屏蔽的射频（RF）导电路径。 馈通包括从一个或多个介电材料层导出的整体结构和延伸穿过整体结构的导电路径，用于将IM信号传送到IMD和从IMD传送RF信号。 内部屏蔽形成为延伸穿过介电材料层中的至少一层以便围绕导电路径（例如，以同轴关系）并且屏蔽RF导电路径免受不期望的信号。 RF导电通路的屏蔽防止了破坏性的EMI信号通过RF导电通路进入IMD。 在一些实施例中，包含嵌入式阻抗匹配元件的单片结构电连接到馈通中的至少一个导电路径，以执行到其它电路的导电路径的阻抗匹配和/或滤波。
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4.发明申请Co-Fired Electrical Feedthroughs for Implantable Medical Devices Having a Shielded RF Conductive Path and Impedance Matching 有权具有屏蔽RF导电路径和阻抗匹配的可植入医疗设备的共同电气馈通公开(公告)号：US20110029036A1
公开(公告)日：2011-02-03
申请号：US12533994
申请日：2009-07-31
IPC分类号： A61N1/378
CPC分类号： A61N1/3754 , A61N1/37223
摘要： A co-fired electrical feedthrough for an implantable medical device (IMD) is provided having a shielded radio frequency (RF) conductive path. The feedthrough includes a monolithic structure derived from one or more layers of dielectric material and a conductive pathway extending through the monolithic structure for communicating RF signals into and from the IMD. An internal shield is formed to extend through at least one of the layers of dielectric material so as to surround the conductive pathway (e.g., in a coaxial relationship) and shield the RF conductive pathway from undesirable signals. This shielding of the RF conductive pathway prevents destructive EMI signals from entering into the IMD through the RF conductive pathway. In some embodiments, a monolithic structure containing embedded impedance matching elements is electrically connected to at least one conductive pathway in the feedthrough to perform impedance matching and/or filtering of the conductive pathway to other circuitry.
摘要翻译： 提供了一种用于可植入医疗装置（IMD）的共同燃烧电馈通，其具有屏蔽的射频（RF）导电路径。 馈通包括从一个或多个介电材料层导出的整体结构和延伸穿过整体结构的导电路径，用于将IM信号传送到IMD和从IMD传送RF信号。 内部屏蔽形成为延伸穿过介电材料层中的至少一层以便围绕导电路径（例如，以同轴关系）并且屏蔽RF导电路径免受不期望的信号。 RF导电通路的屏蔽防止了破坏性的EMI信号通过RF导电通路进入IMD。 在一些实施例中，包含嵌入式阻抗匹配元件的单片结构电连接到馈通中的至少一个导电路径，以执行到其它电路的导电路径的阻抗匹配和/或滤波。
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5.发明申请Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same 审中-公开用于可植入医疗器械的多层微型天线及其形成方法公开(公告)号：US20100109966A1
公开(公告)日：2010-05-06
申请号：US12347597
申请日：2008-12-31
申请人： Duane N. Mateychuk , Joyce K. Yamamoto , Gerard J. Hill , Charles S. Farlow , Robert S. Wentink , Michael William Barror , Charles R. Gordon , Joachim Hossick-Schott , Yanzhu Zhao
发明人： Duane N. Mateychuk , Joyce K. Yamamoto , Gerard J. Hill , Charles S. Farlow , Robert S. Wentink , Michael William Barror , Charles R. Gordon , Joachim Hossick-Schott , Yanzhu Zhao
CPC分类号： A61N1/37229 , A61N1/3752 , H01Q1/38 , H01Q3/24 , H01Q9/42
摘要： An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the monolithic structure. Superstrate dielectric layers formed above the antenna may provide improved matching gradient with the surrounding environment to mitigate energy reflection effects. A outermost biocompatible layer is positioned over the superstrates as an interface with the surrounding environment. A shielding layer is positioned under the antenna to provide electromagnetic shielding for the IMD circuitry. Substrate dielectric layers formed below the antenna may possess higher dielectric values to allow the distance between the antenna and ground shielding layer to be minimized. An electromagnetic bandgap layer may be positioned between the antenna and the shielding layer. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure.
摘要翻译： 提供了一种用于可植入医疗装置（IMD）的天线，其包括从具有嵌入整体结构内的天线的多个离散电介质层导出的单片结构。 形成在天线上方的上层电介质层可以提供与周围环境的改进的匹配梯度以减轻能量反射效应。 最外面的生物相容性层被定位在上层之上，作为与周围环境的界面。 屏蔽层位于天线下方，为IMD电路提供电磁屏蔽。 形成在天线下方的衬底电介质层可具有更高的介电值，以使天线和接地屏蔽层之间的距离最小化。 电磁带隙层可以位于天线和屏蔽层之间。 电介质层可以包括陶瓷材料层，其可与天线一起共烧以形成气密密封的单片天线结构。
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公开(公告)号：US08509899B2
公开(公告)日：2013-08-13
申请号：US13008524
申请日：2011-01-18
申请人： John Louis Sommer , Joseph Michael D'Sa , Joyce K. Yamamoto , Brad C. Tischendorf , James D. Reinke , Andrew J. Thom , Thomas P. Miltich , William John Taylor , Kenneth C. Gardeski , Larry Earl Tyler , Jeffrey O. York , Gordon O. Munns
发明人： John Louis Sommer , Joseph Michael D'Sa , Joyce K. Yamamoto , Brad C. Tischendorf , James D. Reinke , Andrew J. Thom , Thomas P. Miltich , William John Taylor , Kenneth C. Gardeski , Larry Earl Tyler , Jeffrey O. York , Gordon O. Munns
IPC分类号： A61N1/362
摘要： Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
摘要翻译： 例如，包括IC芯片的密封组件被配置为并入可植入医疗电线的连接器端子内，优选地在端子的接触构件内。 组件可以包括焊接到接触构件的任一端的两个馈通子组件，以形成封闭IC芯片的密封胶囊，以及允许内腔沿着端子的长度延伸穿过的管状构件 。 多电极引线可以包括多路复用器电路，优选地是开关矩阵元件和通信，控制和电源元件，其电耦合到接触构件和终端的另一接触构件。 每对开关矩阵开关允许选择任何两个电极，以便通过来自连接器端子连接到的装置/脉冲发生器的刺激脉冲传送刺激矢量。
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公开(公告)号：US08050771B2
公开(公告)日：2011-11-01
申请号：US12344980
申请日：2008-12-29
IPC分类号： A61N1/08
CPC分类号： H01Q1/273 , A61N1/37229 , H01Q3/26
摘要： An antenna structure for an implantable medical device (IMD) is provided that includes an antenna embedded within a structure derived from a plurality of discrete dielectric layers. An array of electrodes are connected to the antenna structure and arranged for applying a bias across selected segments of the dielectric layers for altering the performance characteristics of the antenna. The bias applied by the array of electrodes can be selected to provide desired impedance matching between the antenna and the surrounding environment of the implant location to mitigate energy reflection effects at the transition from the antenna structure to the surrounding environment, to provide beam steering functionality for the antenna, or to alter the gain of the signals received by the antenna. IMD is configured to monitor received signal characteristics (e.g., RSSI, EVM or bit error rate) and alter material properties of the dielectric material through biasing to control antenna performance.
摘要翻译： 提供了一种用于可植入医疗装置（IMD）的天线结构，其包括嵌入在由多个离散电介质层衍生的结构内的天线。 电极阵列连接到天线结构，并布置成用于在电介质层的所选段上施加偏置，以改变天线的性能特征。 可以选择由电极阵列施加的偏置以在天线与植入位置的周围环境之间提供期望的阻抗匹配，以减轻在从天线结构向周围环境的转变时的能量反射效应，以提供用于 天线，或改变由天线接收的信号的增益。 IMD被配置为监视接收的信号特性（例如，RSSI，EVM或误码率），并通过偏置来控制天线性能来改变电介质材料的材料特性。
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8.发明申请公开(公告)号：US20100109958A1
公开(公告)日：2010-05-06
申请号：US12347379
申请日：2008-12-31
CPC分类号： H01Q1/27 , A61B5/0031 , A61N1/37229 , H01Q1/38 , H01Q9/30 , Y10T29/49016
摘要： An antenna structure for an implantable medical device (IMD) is provided including a lower dielectric biocompatible antenna portion positioned on a body side of the structure and a high dielectric portion including at least one dielectric substrate having a high dielectric constant positioned on a device side of the structure. The biocompatible antenna portion is derived from an antenna layer, a biocompatible surface layer, and at least one layer of biocompatible dielectric material (e.g., high temperature cofire ceramic (HTCC) material) that provides a matching gradient between the antenna and the surrounding environment. The high dielectric portion may include at least one layer of low temperature cofire ceramic (LTCC) material. The high dielectric portion may be bonded to the biocompatible antenna portion or cofired with the biocompatible antenna portion to form a single bilayer monolithic antenna structure having a lower dielectric HTCC biocompatible antenna portion and a high dielectric LTCC portion.
摘要翻译： 提供了一种用于植入式医疗装置（IMD）的天线结构，其包括位于该结构体的主体侧的下部电介质生物相容性天线部分和高介电部分，该电介质部分包括至少一个位于器件侧的介电常数的介电基片 结构。 生物相容性天线部分源自天线层，生物相容性表面层，以及提供天线与周围环境之间的匹配梯度的至少一层生物相容介电材料（例如，高温共烧陶瓷（HTCC）材料）。 高电介质部分可以包括至少一层低温烧制陶瓷（LTCC）材料。 高电介质部分可以结合到生物相容性天线部分或与生物相容性天线部分共烧，以形成具有下介电HTCC生物相容性天线部分和高介电LTCC部分的单层双层单片天线结构。
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公开(公告)号：US08626310B2
公开(公告)日：2014-01-07
申请号：US12347540
申请日：2008-12-31
申请人： Michael William Barror , William D. Verhoef , Joyce K. Yamamoto , Robert S. Wentink , Gregory J. Haubrich
发明人： Michael William Barror , William D. Verhoef , Joyce K. Yamamoto , Robert S. Wentink , Gregory J. Haubrich
IPC分类号： A61N1/08
CPC分类号： A61N1/37229 , A61N1/025 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01Q1/273 , H01Q9/27
摘要： An implantable medical device (“IMD”) is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.
摘要翻译： 提供了一种植入式医疗装置（“IMD”），其具有设置在IMD外壳外部的用于远场遥测通信的天线和RF遥测模块，从而可以在外壳的外部执行遥测信号处理。 一个或多个馈通导电路径延伸穿过壳体，以将RF模块通信地耦合到壳体内的电路。 以这种方式，RF模块完全布置在壳体的外部，使得仅需要电力和/或低频数据位信号通过馈通导电路径。 这允许馈通导电路径被滤波以防止不期望的干扰信号（例如，电磁干扰（EMI）信号））通过耦合到RF模块的馈通导电路径进入壳体。 在一些实施例中，天线和RF模块形成为可附接到外壳的外部部分的集成组件。
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10.发明授权公开(公告)号：US07164572B1
公开(公告)日：2007-01-16
申请号：US11227523
申请日：2005-09-15
IPC分类号： H01G4/35
CPC分类号： A61N1/3754 , H01G9/008
摘要： An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) and/or or electrochemical cell. An IMD includes implantable pulse generators, cardioverter-defibrillators, physiologic sensors, drug-delivery systems, etc. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. In some forms of the invention, such assemblies are fabricated by using electrically common, multiply-interconnected electrical pathways including metallized vias and interlayer structures of conductive metallic material within bores and between ceramic layers. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one electrically common embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing electrical communication between internal IMD circuitry and active electrical components and/or circuitry coupled to the exterior of an IMD.
摘要翻译： 根据本发明的电馈通组件可以用作可植入医疗装置（IMD）和/或电化学电池的组件。 IMD包括植入式脉冲发生器，心律转复除颤器，生理传感器，药物递送系统等。这些组件在施加的偏置电流或电压下需要生物相容性和抗降解性。 在本发明的某些形式中，通过使用电通常的，多重互连的电路径制造这种组件，所述电路径包括在孔内和陶瓷层之间的导电金属材料的金属化通孔和层间结构。 这些层堆叠在一起并烧结以形成具有延伸穿过该结构的至少一个电通常的嵌入金属化通路的基本上单片电介质结构。 金属化路径即使暴露于体液和组织也可靠地传导电信号，并提供内部IMD电路与耦合到IMD外部的有源电气部件和/或电路之间的电气通信。
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