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公开(公告)号：US09127349B2
公开(公告)日：2015-09-08
申请号：US12342969
申请日：2008-12-23
CPC分类号： C23C14/24 , C23C14/12 , C23C14/225 , C30B23/02 , H01L51/0008 , H01L51/001 , H01L51/56
摘要： The present invention refers to a method as well as an apparatus for depositing a layer at a substrate, the layer containing at least two components co-deposited by at least two evaporation sources, wherein the mixture of the components regarding the content of the components is set by tilting the evaporation sources to predetermined angle and/or by positioning the evaporation sources at a predetermined distance with respect to the substrate and/or wherein evaporation plumes of the evaporation sources are arranged such that the maxima of the evaporation plumes are separated locally with respect to the substrate.
摘要翻译： 本发明涉及一种方法以及用于在衬底上沉积层的装置，所述层包含由至少两个蒸发源共沉积的至少两个组分，其中组分的混合物关于组分的含量是 通过将蒸发源倾斜到预定角度和/或通过将蒸发源相对于基底定位在预定距离和/或其中蒸发源的蒸发羽流被布置成使蒸发羽流的最大值局部地与 相对于底物。
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公开(公告)号：US20100159125A1
公开(公告)日：2010-06-24
申请号：US12342969
申请日：2008-12-23
CPC分类号： C23C14/24 , C23C14/12 , C23C14/225 , C30B23/02 , H01L51/0008 , H01L51/001 , H01L51/56
摘要： The present invention refers to a method as well as an apparatus for depositing a layer at a substrate, the layer containing at least two components co-deposited by at least two evaporation sources, wherein the mixture of the components regarding the content of the components is set by tilting the evaporation sources to predetermined angle and/or by positioning the evaporation sources at a predetermined distance with respect to the substrate and/or wherein evaporation plumes of the evaporation sources are arranged such that the maxima of the evaporation plumes are separated locally with respect to the substrate.
摘要翻译： 本发明涉及一种方法以及用于在衬底上沉积层的装置，所述层包含由至少两个蒸发源共沉积的至少两个组分，其中组分的混合物关于组分的含量是 通过将蒸发源倾斜到预定角度和/或通过将蒸发源相对于基底定位在预定距离和/或其中蒸发源的蒸发羽流被布置成使蒸发羽流的最大值局部地与 相对于底物。
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公开(公告)号：US07518142B2
公开(公告)日：2009-04-14
申请号：US11761770
申请日：2007-06-12
IPC分类号： H01L35/24
CPC分类号： H01L51/5253 , H01L2251/558
摘要： The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.
摘要翻译： 本发明涉及一种具有有机物质的电子器件的薄膜封装结构，特别是OLED或其它有机光电子器件以及相应的部件，以及用于生产具有主要无机阻挡层（5）的方法，其直接布置 在要封装的设备或表面上; 布置在初级无机阻挡层上的平坦化层（6），所述平坦化层的厚度被选择为比主要阻挡层的表面的最高峰和最深谷之间的距离的简单值 主要阻挡层或待封装表面下的器件表面，以及布置在平坦化层上的次级阻挡层（14）。
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公开(公告)号：US08192548B2
公开(公告)日：2012-06-05
申请号：US11254425
申请日：2005-10-20
摘要： The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.
摘要翻译： 本发明涉及一种用于涂覆基底的布置，其包括蒸发源和蒸发源与基底之间的蒸汽屏障。 蒸汽屏障保持在至少等于或高于要蒸发的材料的蒸发温度的温度。 蒸汽屏障被实施为石英阀，其包括与可动杆连接的球形封闭部件。 在第一位置，该球形封闭部分封闭与蒸发源连接的蒸气导管，并且在第二位置，球形封闭部分邻接密封石英管的球形电缆。
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5.发明申请METHOD OF CLEANING A PATTERNING DEVICE, METHOD OF DEPOSITING A LAYER SYSTEM ON A SUBSTRATE, SYSTEM FOR CLEANING A PATTERNING DEVICE, AND COATING SYSTEM FOR DEPOSITING A LAYER SYSTEM ON A SUBSTRATE 有权清洁图案装置的方法，在基板上沉积层系统的方法，用于清洁图案装置的系统和用于在基板上沉积层系统的涂层系统公开(公告)号：US20090317927A1
公开(公告)日：2009-12-24
申请号：US12109067
申请日：2008-04-24
IPC分类号： H01L51/56 , H01L21/306 , B05C11/00
CPC分类号： H01L51/0011 , C23C14/042 , C23C14/12 , H01L51/56
摘要： A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, comprises the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 μm/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently.
摘要翻译： 一种清洁图案形成装置的方法，至少具有沉积在其上的有机涂层材料（OLED材料）的图案形成装置包括提供清洁等离子体的步骤，其通过等离子体蚀刻工艺从图案形成装置中去除涂层材料。 在从图案形成装置去除涂料的步骤中，图案形成装置的温度不超过引起图案形成装置损坏的临界温度，同时保持等离子体蚀刻速率至少为0.2mum / min。 为了产生脉冲清洁等离子体，提供脉冲能量。 该方法可以在直接等离子体蚀刻工艺中或在远程等离子体蚀刻工艺中进行。 可以随后组合或执行不同的蚀刻工艺。
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6.发明申请METHOD OF PROVIDING AN ENCAPSULATION LAYER STACK, COATING DEVICE AND COATING SYSTEM 审中-公开提供封装层堆叠，涂层器件和涂层系统的方法公开(公告)号：US20090098293A1
公开(公告)日：2009-04-16
申请号：US11872545
申请日：2007-10-15
CPC分类号： H01L21/67207 , H01L21/56 , H01L21/6715 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/00
摘要： A coating system or encapsulation module 1 is coupled with a substrate handling module 2, wherein substrates 3a to be encapsulated and substrates 3b that already have an encapsulation layer stack deposited thereon are handled in a nitrogen atmosphere. The substrate handling module 2 comprises a magazine 4 for storing substrates 3a to be coated and encapsulated substrates 3b. A handling device 5 unloads the substrates 3a to be coated from the magazine 4 and loads encapsulated substrates 3b into the magazine 4. The encapsulation module 1 has a first ink-jet coating chamber 10a. In said first ink-jet coating chamber 10a a photoresist layer is deposited on the substrate 3a by means of an ink-jet printing method. The ink-jet printing method is carried out in an atmosphere of about 10 mbar. Then the substrate 3a is transported into a first CVD (chemical vapor deposition) coating chamber 11a. In the CVD coating chamber 11a a first silicon nitride layer is deposited on the substrate 3a, i.e. on the photoresist layer, by using a CVD coating method at a pressure of about 10−2 mbar to 10−3 mbar. This process is repeated in second and third ink-jet coating chambers 10b, 10c and second and third CVD coating chambers 11b, 11c, respectively.
摘要翻译： 涂覆系统或封装模块1与衬底处理模块2耦合，其中待封装的衬底3a和已经具有沉积在其上的封装层堆叠的衬底3b在氮气气氛中处理。 基板处理模块2包括用于存储待涂覆的基板3a和封装的基板3b的盒4。 处理装置5将要被涂布的基板3a从盒体4卸载，并将封装的基板3b装载到盒体4中。封装模块1具有第一喷墨涂布室10a。 在所述第一喷墨涂布室10a中，通过喷墨打印方法将光致抗蚀剂层沉积在基板3a上。 喷墨打印方法在约10毫巴的气氛中进行。 然后将基板3a输送到第一CVD（化学气相沉积）涂覆室11a中。 在CVD涂覆室11a中，通过在大约10-2毫巴至10-3毫巴的压力下使用CVD涂覆法，在衬底3a上，即在光致抗蚀剂层上沉积第一氮化硅层。 在第二和第三喷墨涂布室10b，10c和第二和第三CVD涂层室11b，11c中分别重复该过程。
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公开(公告)号：US20080261409A1
公开(公告)日：2008-10-23
申请号：US12056934
申请日：2008-03-27
IPC分类号： H01L21/31
CPC分类号： H01L51/56 , C23C14/12 , C23C14/564 , C23C14/568 , H01L51/5253
摘要： A processing device for producing a layer system including at least one layer of an organic light emitting semiconductor material (OLED), comprises (1) a configuration of one or more treatment stations for processing the substrate in the treatment stations and (2) a first encapsulation module for providing an encapsulation element on the layer system deposited on the substrate. Furthermore, the processing device comprises at least a second encapsulation module, and is configured to provide the encapsulation element on the coated substrate in the first or second encapsulation module alternatively. By providing two encapsulation modules, the second module may be cleaned during a continuous operation of the processing device, while the first encapsulation module is generating an encapsulation on a coated substrate. In this way, a continuous operation of a coating device for depositing an OLED coating and an encapsulation element on the OLED coating is provided.
摘要翻译： 一种用于生产包括至少一层有机发光半导体材料（OLED）的层系统的处理装置，包括（1）用于处理处理站中的衬底的一个或多个处理站的配置，以及（2） 封装模块，用于在沉积在基板上的层系统上提供封装元件。 此外，处理装置至少包括第二封装模块，并且被配置为可替换地在第一封装模块或第二封装模块中的涂覆基板上提供封装元件。 通过提供两个封装模块，第二模块可以在处理装置的连续操作期间被清洁，而第一封装模块在涂覆的基板上产生封装。 以这种方式，提供了用于在OLED涂层上沉积OLED涂层和封装元件的涂覆装置的连续操作。
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8.发明授权Tooling carrier for inline coating machine, method of operating thereof and process of coating a substrate 有权用于在线涂布机的模具载体，其操作方法和涂布基材的方法公开(公告)号：US08961690B2
公开(公告)日：2015-02-24
申请号：US13104753
申请日：2011-05-10
CPC分类号： C23C14/542 , C23C14/12
摘要： A process of coating at least one substrate with a plurality of deposition sources, a method of tooling, a carrier unit and a deposition system are described. The systems and methods provide for or allow for exposing a first substrate portion 112a of said at least one substrate 112 to a first deposition source 118a through an aperture 122 of a carrier unit 110, 510, depositing a first layer 126a over the first substrate portion, said first layer including material from said first deposition source, varying a relative position between said at least one substrate and said aperture for exposing a second substrate portion of said at least one substrate, or another substrate, to a second deposition source, and depositing a second layer 126b over the second substrate portion 112b, said second layer including material from said second deposition source.
摘要翻译： 描述了使用多个沉积源涂覆至少一个基板的工艺，加工方法，载体单元和沉积系统。 这些系统和方法提供或允许通过载体单元110,510的孔122将所述至少一个基板112的第一基板部分112a暴露于第一沉积源118a，在第一基板部分上沉积第一层126a 所述第一层包括来自所述第一沉积源的材料，改变所述至少一个基底和所述孔之间的相对位置，用于将所述至少一个基底或另一基底的第二基底部分暴露于第二沉积源，以及沉积 在第二衬底部分112b上方的第二层126b，所述第二层包括来自所述第二沉积源的材料。
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9.发明授权Method of cleaning a patterning device, method of depositing a layer system on a substrate, system for cleaning a patterning device, and coating system for depositing a layer system on a substrate 有权清洁图案形成装置的方法，在基板上沉积层系统的方法，用于清洁图案形成装置的系统和用于在衬底上沉积层系统的涂覆系统公开(公告)号：US07973345B2
公开(公告)日：2011-07-05
申请号：US12109067
申请日：2008-04-24
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L51/0011 , C23C14/042 , C23C14/12 , H01L51/56
摘要： A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, where the method includes the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 μm/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently.
摘要翻译： 一种清洁图案形成装置的方法，所述图案形成装置至少具有沉积在其上的有机涂层材料（OLED材料），其中所述方法包括提供用于通过等离子体蚀刻从图案形成装置移除涂层材料的清洁等离子体的步骤 处理。 在从图案形成装置中除去涂料的步骤中，图案形成装置的温度不超过引起图案形成装置损坏的临界温度，同时保持等离子体蚀刻速率至少为0.2μm/分钟。 为了产生脉冲清洁等离子体，提供脉冲能量。 该方法可以在直接等离子体蚀刻工艺中或在远程等离子体蚀刻工艺中进行。 可以随后组合或执行不同的蚀刻工艺。
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10.发明申请公开(公告)号：US20090020416A1
公开(公告)日：2009-01-22
申请号：US12145755
申请日：2008-06-25
IPC分类号： C23C14/35
CPC分类号： C23C14/352 , C23C14/20 , C23C14/564
摘要： A sputter coating device comprises a vacuum coating chamber, substrates arranged within the coating chamber, a cylindrical hollow cathode including a rotatable target rotating around a central axis A, and a magnet assembly which is arranged within the hollow cathode such that confining plasma zones are generated in an area above the surface of the target. At least one substrate is to be coated. The substrate has an OLED layer deposited on the substrate surface. An intermediate area is arranged between the surface of the target and a shield that shields particles sputtered from the surface of the target that move in a direction toward the shield. On each side of the shield, passages are provided between the intermediate area and coating area. Through the passage, only sputtered particles that have been scattered in the intermediate area may enter the coating area via the passage, and impinge the OLED layer.
摘要翻译： 溅射涂覆装置包括真空涂布室，布置在涂布室内的基板，包括围绕中心轴线A旋转的可旋转靶的圆柱形空心阴极和布置在中空阴极内的磁体组件，从而产生限制的等离子体区域 在目标表面上方的一个区域。 要涂覆至少一个基材。 衬底具有沉积在衬底表面上的OLED层。 中间区域布置在靶的表面和屏蔽件之间，该屏蔽件屏蔽从朝着屏蔽的方向移动的目标表面溅射的颗粒。 在屏蔽的每一侧，通道设置在中间区域和涂层区域之间。 通过该通道，仅在中间区域中散布的溅射颗粒可以经由该通道进入涂覆区域并撞击OLED层。
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