Abstract:
A static random access memory cell comprising a first inverter, a second inverter, a first transistor, a second transistor, and a third transistor. The first inverter is cross-coupled with the second inverter. The first transistor is connected with a write word line, a write bit line, and a first output node of the first inverter. The second transistor is connected with a complementary write bit line, the write word line, and a second output node of the second inverter. The third transistor is connected with a read bit line, a read word line, and the first input node of the first inverter to form a read port transistor, and a read port is formed. The read port transistor has a feature of asymmetric threshold voltage, and the read bit line swing can be expanded by the decrease of clamping current or the boosted read bit line.
Abstract:
A static random access memory cell comprising a first inverter, a second inverter, a first transistor, a second transistor, and a third transistor. The first inverter is cross-coupled with the second inverter. The first transistor is connected with a write word line, a write bit line, and a first output node of the first inverter. The second transistor is connected with a complementary write bit line, the write word line, and a second output node of the second inverter. The third transistor is connected with a read bit line, a read word line, and the first input node of the first inverter to form a read port transistor, and a read port is formed. The read port transistor has a feature of asymmetric threshold voltage, and the read bit line swing can be expanded by the decrease of clamping current or the boosted read bit line.
Abstract:
A digital memory element has a sense circuit latch to read the value stored in a bit cell. Before addressing a word line, the bit lines are precharged. During the read operation, a bit line is coupled to a supply voltage through a bit cell memory element that has different resistances at logic states “0” and “1.” A reference bit line is coupled to the supply voltage through a comparison resistance value, especially a resistance between high and low resistance of the memory element in the two logic states. Voltages on the bit line and reference bit line ramp toward a switching threshold at rates related to the resistance values. The first line to discharge to switching threshold voltage sets the sense circuit latch.
Abstract:
A current mirror modified level shifter includes a pair of PMOS including a PMOS (MPL) and a PMOS (MPR), wherein a Vot node connected to a drain of the PMOS (MPR); a pair of NMOS including NMOS (MNL) and a NMOS (MNR), wherein sources of the PMOS (MPL) and the PMOS (MPR) are coupled to a high voltage (HV), respectively; gates of the PMOS (MPL) and the PMOS (MPR) coupled together through a Vm node which located between the gates of the PMOS (MPL) and the PMOS (MPR); and a suspended PMOS (MPM) coupled to drain of the PMOS (MPL), the Vm node being coupled to a Va node between drain of the suspend PMOS (MPM) and drain of the NMOS (MNL).
Abstract:
A process variation detection apparatus and a process variation detection method are provided. The process variation detection apparatus includes a process variation detector and a compensation signal generator. The process variation detector includes a first process variation detection component, a second process variation detection component and a current comparator. The channel of the first process variation detection component is a first conductive type, and the channel of the second process variation detection component is a second conductive type, wherein the above-mentioned first conductive type is different from the second conductive type. The current comparator is connected to the first process variation detection component and the second process variation detection component for comparing the current difference between the two components and outputting a current comparison result. The compensation signal generator is connected to the process variation detector, and produces a corresponding compensation signal according to the current comparison result.
Abstract:
A process variation detection apparatus and a process variation detection method are provided. The process variation detection apparatus includes a process variation detector and a compensation signal generator. The process variation detector includes a first process variation detection component, a second process variation detection component and a current comparator. The channel of the first process variation detection component is a first conductive type, and the channel of the second process variation detection component is a second conductive type, wherein the above-mentioned first conductive type is different from the second conductive type. The current comparator is connected to the first process variation detection component and the second process variation detection component for comparing the current difference between the two components and outputting a current comparison result. The compensation signal generator is connected to the process variation detector, and produces a corresponding compensation signal according to the current comparison result.
Abstract:
A current-sense amplifier with low-offset adjustment and a low-offset adjustment method thereof are disclosed. The current-sense amplifier includes a sensing unit, an equalizing unit and a bias compensation unit. The sensing unit includes a sense amplifier, a latch circuit, a first precharged bit line, and a second precharged bit line. The equalizing unit is electrically connected to the first and the second precharged bit line for regulating a voltage of the first precharged bit line and a voltage of the second precharged bit line to the same electric potential. The bias compensation unit is electrically connected to the sense amplifier for compensating an input offset voltage of the current-sense amplifier.
Abstract:
A low-offset current-sense amplifier and an operating method thereof are disclosed. The low-offset current-sense amplifier includes a sense amplifier, a first current supply unit, a second current supply unit, and a processing unit. The first current supply unit is coupled to the sense amplifier, and includes a first transistor group and a first current output terminal. The second current supply unit is coupled to the sense amplifier, and includes a second transistor group and a second current output terminal. The processing unit controls the on/off of some transistors of the first transistor group and the second transistor group according to electric currents output from the first current output terminal and the second current output terminal, respectively.
Abstract:
The present invention discloses a charge pump system with low noise and high output current and voltage, comprising: a four phase clock generator used to generate a first signals group; a serial of delay circuits coupled to said four phase clock generator, wherein each of said delay circuits is coupled to a previous delay circuit relative to each of said delay circuits for delaying a signals group received from said previous delay circuit; a first charge pump circuit coupled to the four phase clock generator and the delay circuits; and an output terminal coupled to the first charge pump circuit; wherein high level of said first signal overlaps two sections of high level of said third signal to generate a first overlapping time and a second overlapping time, and said first overlapping time is not equal to said second overlapping time.
Abstract:
This disclosure uses a differential sensing and TSV timing control scheme for 3D-IC, which includes a first chip layer of the stacked device having a detecting circuits and a relative high ability driver horizontally coupled to the detecting circuits. A sensing circuit is coupled to the detecting circuits by a horizontal line, a first differential signal driver is coupled to the sensing circuit, horizontally. The Nth chip layer of the stacked device includes a Nth relative high ability driver and a Nth differential signal driver formed on the Nth chip layer. The Nth relative high ability driver is vertically coupled to the first relative high ability driver through one relative low loading TSV and (N−2) TSVs to act as dummy loadings. The TSV and (N−2) TSVs penetrate the stacked device from Nth chip layer to first chip layer. The TSV shares same configuration with the (N−2) TSVs. The Nth differential signal driver is vertically coupled to the first differential signal driver through a pair of TSVs and (N−2) pairs of TSVs, vertically. The pair of TSVs and the (N−2) TSVs penetrate the stacked device from the Nth chip layer to the first chip layer. Each of TSV is formed between a first and a second chip layers. Each of TSV is formed between any adjacent two chip layers of the stacked device.