摘要:
The present invention provides an intermediate film for laminated glass that can increase the heat-insulating properties of laminated glass. The intermediate film for laminated glass according to the present invention is an intermediate film for laminated glass having a one-layer structure or a laminated structure of two or more layers, an intermediate film 1 for laminated glass has a first layer 2 containing silicon dioxide particles 51 having hollow parts and shell parts and having a porosity of 40% or more and 80% or less, when the intermediate film 1 for laminated glass has a one-layer structure, the first layer further contains a thermoplastic resin, and when the intermediate film 1 for laminated glass has a laminated structure of two or more layers, the intermediate film 1 for laminated glass further has a second layer 3 which is arranged on a first surface 2a side of the first layer 2 and which contains a thermoplastic resin.
摘要:
The present invention provides an intermediate film for laminated glass that can increase the heat-insulating properties of laminated glass. The intermediate film for laminated glass according to the present invention is an intermediate film for laminated glass having a one-layer structure or a laminated structure of two or more layers, an intermediate film 1 for laminated glass has a first layer 2 containing silicon dioxide particles 51 having hollow parts and shell parts and having a porosity of 40% or more and 80% or less, when the intermediate film 1 for laminated glass has a one-layer structure, the first layer further contains a thermoplastic resin, and when the intermediate film 1 for laminated glass has a laminated structure of two or more layers, the intermediate film 1 for laminated glass further has a second layer 3 which is arranged on a first surface 2a side of the first layer 2 and which contains a thermoplastic resin.
摘要:
It is an object of the invention to provide a separation method of an adherend capable of easily and reliably separating an adherend stuck using an adhesive, a method for recovering an electronic part from an electronic part laminate, and a separation method of laminate glass.The invention provides a separation method of an adherend, which is a method of separating an adherend stuck by using an adhesive, and comprises the steps of: air-tightly sealing the adherend together with a fluid being a gas at a normal temperature and normal pressure in a pressure resistant container, making the inside of the pressure resistant container in a high pressure state, and releasing the pressure of the inside of the pressure resistant container.
摘要:
It is an object of the invention to provide a separation method of an adherend capable of easily and reliably separating an adherend stuck using an adhesive, a method for recovering an electronic part from an electronic part laminate, and a separation method of laminate glass. The invention provides a separation method of an adherend, which is a method of separating an adherend stuck by using an adhesive, and comprises the steps of: air-tightly sealing the adherend together with a fluid being a gas at a normal temperature and normal pressure in a pressure resistant container, making the inside of the pressure resistant container in a high pressure state, and releasing the pressure of the inside of the pressure resistant container.
摘要:
A dispersion of tin-doped indium oxide fine particles has tin-doped indium oxide fine particles, a plasticizer for an interlayer film, an organic solvent containing alcohols as a main component, and a dispersion stabilizer, wherein under measuring conditions of a concentration of tin-doped indium oxide fine particles of 0.7% by weight and an optical path length of a glass cell of 1 mm, a visible light transmittance is 80% or more, a solar radiation transmittance at a wavelength within a range from 300 nm to 2100 nm is ¾ or less of the visible light transmittance, a haze value is 1.0% or less, and a reflection yellow index is −20 or more.
摘要:
A dispersion of tin-doped indium oxide fine particles has tin-doped indium oxide fine particles, a plasticizer for an interlayer film, an organic solvent containing alcohols as a main component, and a dispersion stabilizer, wherein under measuring conditions of a concentration of tin-doped indium oxide fine particles of 0.7% by weight and an optical path length of a glass cell of 1 mm, a visible light transmittance is 80% or more, a solar radiation transmittance at a wavelength within a range from 300 nm to 2100 nm is ¾ or less of the visible light transmittance, a haze value is 1.0% or less, and a reflection yellow index is −20 or more.
摘要:
A dispersion of tin-doped indium oxide fine particles has tin-doped indium oxide fine particles, a plasticizer for an interlayer film, an organic solvent containing alcohols as a main component, and a dispersion stabilizer, wherein under measuring conditions of a concentration of tin-doped indium oxide fine particles of 0.7% by weight and an optical path length of a glass cell of 1 mm, a visible light transmittance is 80% or more, a solar radiation transmittance at a wavelength within a range from 300 nm to 2100 nm is ¾ or less of the visible light transmittance, a haze value is 1.0% or less, and a reflection yellow index is −20 or more.
摘要:
An object of the present invention is to provide an interlayer film for a laminated glass and a laminated glass, which are superior in transparency, heat shield property, electromagnetic wave permeability and weatherability.The present invention is directed to an interlayer film for a laminated glass, wherein a laminated glass, produced by interposing the film between two sheets of glass selected from the group consisting of clear glass, green glass and high heat ray absorbing glass, has an electromagnetic wave shielding performance of 10 dB or less at a frequency of 0.1 to 10 MHz and 2 to 26.5 GHz, a haze of 1.0% or less, a visible light transmittance of 70% or more and a solar radiation transmittance of 85% or less of the visible light transmittance in a wavelength region of 300 nm to 2100 nm.
摘要:
Provided is a voltage detection circuit, which can remove influence of error voltage caused by tiny amount of self-inductance existing in a shunt resistor, though in the resistor for large current usage, which is impossible to surface-mount on a voltage detection circuit board. The shunt resistor device comprises: a resistance body (11); a pair of main electrode (12) for flowing current to be monitored through the resistance body; a pair of detection terminal (13a) for detecting voltage caused in the resistance body; and a pair of wiring (23) each electrically connected to the detection terminal. And, a pair of voltage detection wiring consisting of the detection terminal (13a) and the wiring (23) is brought closer, at prescribed location, than distance between each of connection position of the pair of the detection terminal (13a) on the main electrode (12). A low-pass filter having resistance value (r) and capacitance (C) is provided at next stage after the pair of the wiring, and said low-pass filter having a relationship Le/R=C·r, when Le (=L−M) is the effective inductance, and R is the resistance value of the resistance body.
摘要:
Provided is a shunt resistor which has an excellent accuracy of current detection and a small temperature drift as well as a compact structure, and improves the operability. The shunt resistor is provided with a resistance body (11), a pair of main electrodes (12, 12) separated from the resistance body, and a pair of voltage detection electrodes (13, 13) separated from the main electrodes. The voltage detection electrodes (13) are provided and fixed between the resistance body (11) and the main electrodes (12). The voltage detection electrode (13) is provided with a detection terminal (13a) to be connected to a terminal of a voltage detection circuit. The resistance body (11) has a columnar shape. The voltage detection electrode (13) and main electrode (12) are fixed to both end faces of the resistance body (11) in the length direction, so that they are opposing each other. The components are bonded by diffusion boding, friction bonding, wax bonding, etc., after abutting the bonding surfaces with each other.