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    Semiconductor laser device
    4.
    发明授权
    Semiconductor laser device 失效
    半导体激光器件

    公开(公告)号：US4858241A

    公开(公告)日：1989-08-15

    申请号：US198859

    申请日：1988-05-26

    申请人： Nobuo Suzuki ,  Motoyasu Morinaga ,  Hideto Furuyama ,  Yuzo Hirayama ,  Hajime Okuda ,  Masaru Nakamura ,  Nawoto Motegi

    发明人： Nobuo Suzuki ,  Motoyasu Morinaga ,  Hideto Furuyama ,  Yuzo Hirayama ,  Hajime Okuda ,  Masaru Nakamura ,  Nawoto Motegi

    IPC分类号： H01S5/02 ,  H01S5/026 ,  H01S5/042 ,  H01S5/227 ,  H01S5/323

    CPC分类号： H01S5/0422 ,  H01S5/026 ,  H01S5/227 ,  H01S5/0208 ,  H01S5/0425 ,  H01S5/2275 ,  H01S5/2277 ,  H01S5/32391

    摘要： A semiconductor laser device comprises a semiconductor mesa portion formed above semiconductor substrate by a predetermined interval, an active region, formed between the mesa portion and semiconductor substrate and consisting of a semiconductor having a forbidden band width smaller than those of the mesa portion and semiconductor substrate, for contributing to light emission, a pair of buried portions formed at both sides in a widthwise direction of and in contact with the active region and consisting of a semiconductor having a forbidden band width larger than that of the active region, a total width of the buried portions and the active region being smaller than that of the mesa portion, thereby forming a gap at a side of each of the buried portions between the mesa portion and semiconductor substrate to electrically insulate the mesa portion and semiconductor substrate, and supporting portions formed integrally with the mesa portion so as to support the mesa portion with respect to the substrate in association with the active region and the buried portions.

    摘要翻译： 一种半导体激光器件，包括在半导体衬底上形成预定间隔的半导体台面部分，形成在台面部分和半导体衬底之间的有源区域，其具有禁带宽度小于台面部分和半导体衬底的宽度的半导体 用于有助于发光的一对掩埋部分，形成在有源区域的宽度方向两侧并且与有源区域接触的一对掩埋部分，并且由禁带宽度大于有源区域的宽度的半导体构成， 埋入部分和有源区域小于台面部分，从而在台面部分和半导体衬底之间的每个掩埋部分的一侧形成间隙，以使台面部分和半导体衬底电绝缘，形成的支撑部分 与台面部分一体地相对于台面部分支撑 与有源区域和掩埋部分相关联的衬底。

    Semiconductor photo-detector having a two-stepped impurity profile
    6.
    发明授权
    Semiconductor photo-detector having a two-stepped impurity profile 失效
    具有二阶杂质分布的半导体光电检测器

    公开(公告)号：US4949144A

    公开(公告)日：1990-08-14

    申请号：US240345

    申请日：1988-09-01

    申请人： Fumihiko Kuroda ,  Tetsuo Sadamasa ,  Nobuo Suzuki ,  Masaru Nakamura

    发明人： Fumihiko Kuroda ,  Tetsuo Sadamasa ,  Nobuo Suzuki ,  Masaru Nakamura

    IPC分类号： H01L21/265 ,  H01L31/105 ,  H01L31/107

    CPC分类号： H01L21/26546 ,  H01L31/105 ,  H01L31/1075

    摘要： A semiconductor photo-detector having a two-stepped impurity profile comprises a semiconductor substrate, a light absorption layer of a first conductivity type formed on a semiconductor substrate, a multiplication layer of a first conductivity type formed on the light absorption layer to multiply a photocurrent, a semiconductor region of a second conductivity type formed on the multiplication layer and constituting an abrupt pn junction with the multiplication layer, and a guard ring area of a second conductivity type formed around a periphery of the semiconductor region, whereby the carrier concentration profile of the guard ring region is sharp at its surface and flat below that surface.

    摘要翻译： 具有二阶杂质分布的半导体光检测器包括半导体衬底，形成在半导体衬底上的第一导电类型的光吸收层，形成在光吸收层上的第一导电类型的倍增层，以将光电流 形成在乘法层上并与乘法层构成突变pn结的第二导电类型的半导体区域，以及形成在半导体区域周围的第二导电类型的保护环区域，由此载流子浓度分布 保护环区域在其表面处是锋利的并且在该表面下方平坦。

    Workpiece dividing method including two laser beam application steps
    7.
    发明授权
    Workpiece dividing method including two laser beam application steps 有权
    工件分割方法包括两个激光束施加步骤

    公开(公告)号：US09099546B2

    公开(公告)日：2015-08-04

    申请号：US13275878

    申请日：2011-10-18

    申请人： Masaru Nakamura

    发明人： Masaru Nakamura

    IPC分类号： H01L21/00 ,  H01L21/78

    CPC分类号： H01L21/78

    摘要： A dividing method for a workpiece having a substrate with a film formed on the front side thereof. A first laser beam is applied to the film from the front side of the workpiece along the streets formed on the film, thereby forming a plurality of laser processed grooves along the streets to cut the film along the streets. Thereafter, an adhesive tape is attached to the front side of the workpiece. Thereafter, a second laser beam is applied to the substrate from the back side of the workpiece along the streets in the condition where the focal point of the second laser beam is set inside the substrate, thereby forming a plurality of modified layers inside the substrate along the streets. Thereafter, the adhesive tape is expanded to thereby divide the substrate along the streets, thereby obtaining a plurality of individual devices. Thereafter, the back side of the substrate of each device is ground to remove the modified layers and reduce the thickness of each device to a predetermined thickness.

    摘要翻译： 一种具有在其前侧形成有膜的基板的工件的分割方法。 第一激光束沿着形成在膜上的街道从工件的前侧施加到膜上，从而沿着街道形成多个激光加工槽，以沿着街道切割膜。 此后，粘合带附着在工件的正面。 此后，在第二激光束的焦点设置在基板的内部的状态下，沿着街道将第二激光束从工件的背面施加到基板，由此在基板内部形成多个改性层 街头。 此后，将胶带膨胀，从而沿着街道划分基板，从而获得多个单独的装置。 此后，研磨每个器件的衬底的背面以去除改性层，并将每个器件的厚度减小到预定厚度。

    Laser beam machining apparatus
    8.
    发明授权
    Laser beam machining apparatus 有权
    激光束加工设备

    公开(公告)号：US08704126B2

    公开(公告)日：2014-04-22

    申请号：US12248685

    申请日：2008-10-09

    申请人： Masaru Nakamura

    发明人： Masaru Nakamura

    IPC分类号： B23K26/00 ,  B23K26/06

    CPC分类号： B23K26/0853 ,  B23K26/0006 ,  B23K2101/40 ,  B23K2103/56

    摘要： A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator. The control unit includes a memory for storing coordinates of an arcuate chamfer part formed at the outer periphery of the wafer and coordinates of a flat surface part surrounded by the chamfer part, and controls the repetition frequency setting section so as to set the repetition frequency of the pulses in the laser beam with which to irradiate the flat surface part to a value suitable for machining of the wafer and as to set the repetition frequency of the pulses in the laser beam with which to irradiate the chamfer part to a value higher than the repetition frequency in the pulses of the laser beam with which to irradiate the flat surface part.

    摘要翻译： 一种激光束加工设备，包括：激光束照射单元，用于用激光束照射夹持在卡盘台上的晶片;以及控制单元。 激光束照射单元包括激光束振荡器，用于振荡具有透射通过所述晶片的波长的激光束，重复频率设置部分用于设置从激光束振荡器振荡的激光束中的脉冲的重复频率。 控制单元包括存储器，用于存储形成在晶片外围的弧形倒角部分的坐标和由倒角部分包围的平坦表面部分的坐标，并控制重复频率设置部分，以便设置重复频率 用于将平坦表面部分照射到激光束中的脉冲到适于晶片加工的值，并且将激光束中的脉冲的重复频率设置为高于 用于照射平面部分的激光束的脉冲中的重复频率。

    System, device and method for TDMA-based networking using space division multiplexed transmissions
    9.
    发明授权
    System, device and method for TDMA-based networking using space division multiplexed transmissions 失效
    使用空分复用传输的基于TDMA的网络的系统，设备和方法

    公开(公告)号：US08605708B2

    公开(公告)日：2013-12-10

    申请号：US13233152

    申请日：2011-09-15

    申请人： Masaru Nakamura

    发明人： Masaru Nakamura

    IPC分类号： H04B1/00

    CPC分类号： H04B7/0617 ,  G01S13/74 ,  H04B7/026 ,  H04B7/0408 ,  H04B7/0452 ,  H04B7/0697 ,  H04B7/2643 ,  H04W16/28 ,  H04W72/0446 ,  H04W72/046 ,  H04W74/0816 ,  H04W84/18 ,  H04W88/02

    摘要： A wireless communication system includes wireless terminals. Each of the wireless terminals includes an SDM transmitting unit that includes antennas and generates directional radio signals to be transmitted to other terminals, each of which is obtained by superimposing radio signals at the antennas, each of which is composed of modulated data for each of the other terminals; a single-system receiving unit; and a TDMA control unit that controls a transmission of the SDM transmitting unit and a reception of the receiving unit in a time division manner. Using a TDMA scheme, the wireless terminals are controlled such that one of the wireless terminals acquires a transmission right for a predetermined time period to simultaneously transmit the generated directional radio signals from the SDM transmitting unit, while during the predetermined time period, the receiving units of the other wireless terminals having no transmission right simultaneously receive their corresponding directional radio signals.

    摘要翻译： 无线通信系统包括无线终端。 每个无线终端包括包含天线的SDM发送单元，并且生成要发送到其他终端的定向无线电信号，其中每个终端通过在天线叠加无线电信号而获得，每个由无线电信号组成，每个由 其他终端; 单系统接收单元; 以及TDMA控制单元，其以时分方式控制SDM发送单元的发送和接收单元的接收。 使用TDMA方案，控制无线终端，使得无线终端中的一个在预定时间段内获取发送权限，以在SDM发送单元同时发送生成的定向无线电信号，而在预定时间段期间，接收单元 没有发送权限的其他无线终端同时接收其相应的定向无线电信号。

    Method of dividing workpiece
    10.
    发明授权
    Method of dividing workpiece 有权
    分割工件的方法

    公开(公告)号：US08476553B2

    公开(公告)日：2013-07-02

    申请号：US13223941

    申请日：2011-09-01

    申请人： Satoshi Usuda ,  Kiyoshi Ohsuga ,  Masaru Nakamura

    发明人： Satoshi Usuda ,  Kiyoshi Ohsuga ,  Masaru Nakamura

    IPC分类号： B23K26/38

    CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

    摘要： A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

    摘要翻译： 分割工件的方法包括：在不形成装置的区域的内部形成预加工变更区域; 通过成像装置通过红外成像来检测预加工变更区域的位置，从而将预加工变更区域与计划分割线之间的偏差识别为加工位置校正信息; 并通过利用加工位置校正信息形成主加工变更区域，由此能够将工件沿着规划的分割线精确地划分成单独的装置。