公开(公告)号：US20110045290A1

公开(公告)日：2011-02-24

申请号：US12920325

申请日：2009-03-02

申请人： Jun Maeda ,  Keiko Tanaka ,  Yoji Wakayama

发明人： Jun Maeda ,  Keiko Tanaka ,  Yoji Wakayama

IPC分类号： C09J7/02 ,  B32B38/10 ,  B32B38/04 ,  B32B27/00

CPC分类号： C09J133/08 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/1052 ,  Y10T428/2891

摘要： An adhesive sheet includes a substrate and an energy ray curable adhesive layer formed thereon The energy ray curable adhesive layer includes an acrylic adhesive polymer having a weight average molecular weight of not less than 100,000, and a polymerizable group is bonded to the acrylic adhesive polymer through a polyalkyleneoxy group. The energy ray curable adhesive sheet improves the breaking elongation and the expandability of the cured adhesives, thereby preventing the glue residue on the adherend of the sheet after release.

摘要翻译： 粘合片包括基材和在其上形成的能量射线固化粘合剂层。能量射线固化型粘合剂层包括重均分子量不小于100,000的丙烯酸粘合剂聚合物，并且可聚合基团通过 聚亚烷基氧基。 能量射线固化性粘合片提高了固化粘合剂的断裂伸长率和膨胀性，从而防止了剥离后的片材的被粘附物上的残胶。

公开(公告)号：US20120302041A1

公开(公告)日：2012-11-29

申请号：US13570306

申请日：2012-08-09

申请人： Jun Maeda ,  Keiko Tanaka

发明人： Jun Maeda ,  Keiko Tanaka

IPC分类号： H01L21/304 ,  C09J139/00 ,  C09J7/02

CPC分类号： H01L21/6836 ,  C08F220/14 ,  C08F220/18 ,  C08F220/26 ,  C08F220/30 ,  C09J7/20 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2852 ,  Y10T428/2891

摘要： In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.

摘要翻译： 在含有能量射线固化性聚合物的压敏粘合剂组合物或压敏粘合片中克服了组合物中所含的低分子化合物挥发相关的问题。 一种能量射线固化性聚合物，其特征在于，含有自由基生成基团，其能够在能量射线激发时引发聚合反应，并且在主链或侧链键合在一起的能量射线聚合性基团。

公开(公告)号：US20100233868A1

公开(公告)日：2010-09-16

申请号：US12724459

申请日：2010-03-16

申请人： Jun Maeda ,  Keiko Tanaka

发明人： Jun Maeda ,  Keiko Tanaka

IPC分类号： H01L21/78 ,  C09J7/02

CPC分类号： H01L21/6836 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2848

摘要： The objective of the present invention is to solve the various problems involving the evaporation or the moving of the low-molecular weight included in the intermediate layer, in the adhesive sheet having a multilayered adhesive layer. The above mentioned problems are solved by an adhesive sheet comprising a substrate, an intermediate layer formed thereon, and an adhesive layer formed on said intermediate layer, wherein, said intermediate layer includes an energy ray-curable polymer in which an energy ray-polymerizable group and a radical-generating group initiating a polymerization under excitation by an energy ray are bound at a main chain or side chain.

摘要翻译： 本发明的目的是解决在具有多层粘合剂层的粘合片中涉及包含在中间层中的低分子量的蒸发或移动的各种问题。 上述问题通过包括基材，形成在其上的中间层和形成在所述中间层上的粘合剂层的粘合片来解决，其中所述中间层包括能量射线可固化聚合物，其中能量射线可聚合基团 在能量射线的激发下引发聚合的自由基产生基团被结合在主链或侧链上。

公开(公告)号：US20100190293A1

公开(公告)日：2010-07-29

申请号：US12670127

申请日：2008-07-18

申请人： Jun Maeda ,  Keiko Tanaka ,  Osamu Yamazaki

发明人： Jun Maeda ,  Keiko Tanaka ,  Osamu Yamazaki

IPC分类号： H01L21/50

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L21/563 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83208 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/351 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： The present invention has been achieved reflecting such situation, and its object is to provide a manufacturing method of a semiconductor device capable of continuously performing the mounting process which applies a so-called DBG process and a flip chip bonding method, and can contribute to simplify the manufacturing process and to improve the reliability with no void in the product. The manufacturing method of a semiconductor device according to the present invention comprises: laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhesive film is adhered on the circuit surface of the wafer; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer; picking up individual chips together with the adhesive film; die-bonding said individual chip to predetermined position of a chip mounting substrate via said adhesive film; fixing the chip to the chip mounting substrate by heating the die-bonded chip having the adhesive film; and applying a static pressure larger than an ambient pressure by 0.05 MPa or more to a stacked body including the adhesive film one or more times, at any point between adhering the wafer to the adhesive film and fixing the chip to the chip mounting substrate.

摘要翻译： 已经实现了本发明，反映了这种情况，其目的在于提供能够连续进行所谓的DBG处理和倒装芯片接合方法的安装工序的半导体装置的制造方法，能够有助于简化 制造过程中提高产品的可靠性，无空白。 根据本发明的半导体器件的制造方法包括：将表面保护片层压到形成有凹槽的晶片的电路表面侧，所述晶片将每个电路分开，其中粘合剂膜粘附在晶片的电路表面上; 减小晶片的厚度，最后通过研磨晶片的背面将晶片分成单独的芯片; 用粘合膜拾取单个芯片; 将所述单个芯片经由所述粘合膜将所述芯片贴合到芯片安装基板的预定位置; 通过加热具有粘合膜的芯片接合芯片将芯片固定到芯片安装基板; 并且在将晶片粘附到粘合剂膜上并将芯片固定到芯片安装基板之间的任何点处，将包括粘合剂膜的层叠体施加大于0.05MPa或更大的环境压力的静态压力一次或多次。

公开(公告)号：US20110104874A1

公开(公告)日：2011-05-05

申请号：US12935677

申请日：2009-03-12

申请人： Jun Maeda ,  Keiko Tanaka

发明人： Jun Maeda ,  Keiko Tanaka

IPC分类号： H01L21/304 ,  C08F216/10

CPC分类号： H01L21/6836 ,  C08F220/14 ,  C08F220/18 ,  C08F220/26 ,  C08F220/30 ,  C09J7/20 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2852 ,  Y10T428/2891

摘要： In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.

摘要翻译： 在含有能量射线固化性聚合物的压敏粘合剂组合物或压敏粘合片中克服了组合物中所含的低分子化合物挥发相关的问题。 一种能量射线固化性聚合物，其特征在于，含有自由基生成基团，其能够在能量射线激发时引发聚合反应，并且在主链或侧链键合在一起的能量射线聚合性基团。

公开(公告)号：US20080233392A1

公开(公告)日：2008-09-25

申请号：US12051731

申请日：2008-03-19

申请人： Keiko Tanaka ,  Jun Maeda ,  Masaharu Ito

发明人： Keiko Tanaka ,  Jun Maeda ,  Masaharu Ito

IPC分类号： B32B7/12

CPC分类号： B32B27/30 ,  B32B27/40 ,  C08G18/44 ,  C08G18/4825 ,  C08G18/4854 ,  C08G18/672 ,  C08G18/73 ,  C08G18/755 ,  C08G18/765 ,  C08L33/08 ,  C08L33/14 ,  C09D133/08 ,  C09D133/14 ,  C09J7/385 ,  C09J175/16 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2475/00 ,  Y10T428/2809 ,  C08G18/48 ,  C08L2666/04

摘要： An adhesive sheet includes a substrate and an energy-ray curable adhesive layer formed on the substrate. The energy-ray curable adhesive layer includes an energy-ray curable acrylic copolymer and an energy-ray curable urethane acrylate. The energy-ray curable acrylic copolymer is formed by copolymerizing dialkyl(meth)acrylamide and includes a side chain with an unsaturated group. The energy-ray curable urethane acrylate includes an isocyanate block and a (meth)acryloyl group. The isocyanate block includes at least one of an isophorone diisocyanate, a trimethyl-hexamethyene diisocyanate, and a tetramethyl-xylene diisocyanate.

摘要翻译： 粘合片包括基材和形成在基材上的能量线可固化粘合剂层。 能量射线固化性粘合剂层包括能量射线固化型丙烯酸共聚物和能量射线固化型聚氨酯丙烯酸酯。 能量射线固化性丙烯酸共聚物是通过使（甲基）丙烯酰
基二烷基共聚而形成的，并且包含具有不饱和基团的侧链。 能量射线固化性氨基甲酸酯丙烯酸酯包括异氰酸酯嵌段和（甲基）丙烯酰基。 异氰酸酯嵌段包括异佛尔酮二异氰酸酯，三甲基 - 六亚甲基二异氰酸酯和四甲基 - 二甲苯二异氰酸酯中的至少一种。

公开(公告)号：US08304920B2

公开(公告)日：2012-11-06

申请号：US12935677

申请日：2009-03-12

申请人： Jun Maeda ,  Keiko Tanaka

发明人： Jun Maeda ,  Keiko Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/6836 ,  C08F220/14 ,  C08F220/18 ,  C08F220/26 ,  C08F220/30 ,  C09J7/20 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2852 ,  Y10T428/2891

摘要： In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.

摘要翻译： 在含有能量射线固化性聚合物的压敏粘合剂组合物或压敏粘合片中克服了组合物中所含的低分子化合物挥发相关的问题。 一种能量射线固化性聚合物，其特征在于，含有自由基生成基团，其能够在能量射线激发时引发聚合反应，并且在主链或侧链键合在一起的能量射线聚合性基团。

公开(公告)号：US08003441B2

公开(公告)日：2011-08-23

申请号：US12670127

申请日：2008-07-18

申请人： Jun Maeda ,  Keiko Tanaka ,  Osamu Yamazaki

发明人： Jun Maeda ,  Keiko Tanaka ,  Osamu Yamazaki

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L21/563 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83208 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/351 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A manufacturing method of a semiconductor device according to the present invention comprises: laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhesive film is adhered on the circuit surface of the wafer; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer; picking up individual chips together with the adhesive film; die-bonding said individual chip to predetermined position of a chip mounting substrate via said adhesive film; fixing the chip to the chip mounting substrate by heating the die-bonded chip having the adhesive film; and applying a static pressure larger than an ambient pressure by 0.05 MPa or more to a stacked body including the adhesive film one or more times, at any point between adhering the wafer to the adhesive film and fixing the chip to the chip mounting substrate.

摘要翻译： 根据本发明的半导体器件的制造方法包括：将表面保护片层压到形成有凹槽的晶片的电路表面侧，所述晶片将每个电路分开，其中粘合剂膜粘附在晶片的电路表面上; 减小晶片的厚度，最后通过研磨晶片的背面将晶片分成单独的芯片; 用粘合膜拾取单个芯片; 将所述单个芯片经由所述粘合膜将所述芯片贴合到芯片安装基板的预定位置; 通过加热具有粘合膜的芯片接合芯片将芯片固定到芯片安装基板; 并且在将晶片粘附到粘合剂膜上并将芯片固定到芯片安装基板之间的任何点处，将包括粘合剂膜的层叠体施加大于0.05MPa或更大的环境压力的静态压力一次或多次。

公开(公告)号：US20070066206A1

公开(公告)日：2007-03-22

申请号：US11448995

申请日：2006-06-07

申请人： Michio Ono ,  Masahiro Endou ,  Keiko Tanaka

发明人： Michio Ono ,  Masahiro Endou ,  Keiko Tanaka

IPC分类号： B60H1/00

CPC分类号： B60H1/3421 ,  B60H1/3428

摘要： In an air outlet device for a vehicle cabin, primary wind-direction adjustment plates are rotated between a parallel condition and a series condition, to thereby provide a wind distribution function of opening the outlet opening of a tubular body and adjusting the flow direction of air and a wind shutoff function of closing the outlet opening. Of the primary wind-direction adjustment plates, a certain primary wind-direction adjustment plate is configured such that its tip end edge gradually separates from an inner wall surface of the tubular body when the primary wind-direction adjustment plates are rotated so as to open the outlet opening. A secondary wind-direction adjustment plate is secured to the back of the certain primary wind-direction adjustment plate with a predetermined spacing formed therebetween. The secondary wind-direction adjustment plate rotates, together with the certain primary wind-direction adjustment plate, about the rotation center of the certain primary wind-direction adjustment plate.

摘要翻译： 在车厢的出风装置中，主风向调节板在平行状态和串联状态之间旋转，从而提供打开管状体的出口的风力分配功能，并调节空气的流动方向 以及关闭出口的风切断功能。 在主风向调节板中，主风向调整板被构造为使得当主风向调节板旋转以使其开口时其顶端边缘与管状体的内壁表面逐渐分离 出口开口。 二次风向调整板以特定的间隔形成在一定的主风向调整板的背面。 二次风向调整板与某一个主风向调整板一起围绕某一主风向调整板的旋转中心旋转。

公开(公告)号：US06904403B1

公开(公告)日：2005-06-07

申请号：US09667666

申请日：2000-09-22

申请人： Kenji Muraki ,  Keiko Tanaka ,  Naoki Ejima ,  Yasushi Nakajima

发明人： Kenji Muraki ,  Keiko Tanaka ,  Naoki Ejima ,  Yasushi Nakajima

IPC分类号： G11B20/10 ,  H04H20/00 ,  H04L12/40 ,  H04L12/64 ,  G10L19/00

CPC分类号： H04L12/40058 ,  H04L12/40071 ,  H04L12/40117

摘要： In transmission of digital audio data usingIEEE1394, for example, when the audio data is changed from linear PCM to nonlinear PCM, identifier adding means of the transmitting apparatus inserts a silent identifier and nearly zero data for a specific time, and first identifier distinguishing means of the receiving apparatus changes over the output of data processing selecting means from linear PCM processing side to nonlinear processing side when detecting the silent identifier, thereby preventing generation of noise when changing over the data.

摘要翻译： 在使用IEEE1394传输数字音频数据时，例如，当音频数据从线性PCM变为非线性PCM时，发送装置的标识符添加装置在特定时间内插入无声标识符和近零数据，以及第一标识符辨别装置 当检测到无声标识符时，接收装置将数据处理选择装置的输出从线性PCM处理侧切换到非线性处理侧，从而防止在切换数据时产生噪声。