METHODS FOR THE SYNTHESIS OF DEUTERATED ACRYLATE SALTS
    1.
    发明申请
    METHODS FOR THE SYNTHESIS OF DEUTERATED ACRYLATE SALTS 有权
    合成丙烯酸丁酯盐的方法

    公开(公告)号:US20130079554A1

    公开(公告)日:2013-03-28

    申请号:US13611927

    申请日:2012-09-12

    IPC分类号: C07C51/36

    摘要: A method for synthesizing a deuterated acrylate of the Formula (1), the method comprising: (i) deuterating a propiolate compound of Formula (2) to a methyne-deuterated propiolate compound of Formula (3) in the presence of a base and D2O: and (ii) reductively deuterating the methyne-deuterated propiolate compound of Formula (3) in a reaction solvent in the presence of deuterium gas and a palladium-containing catalyst to afford the deuterated acrylate of the Formula (1). The resulting deuterated acrylate compounds, derivatives thereof, and polymers derived therefrom are also described.

    摘要翻译: 一种用于合成式(1)的氘化丙烯酸酯的方法,所述方法包括:(i)在碱和D 2 O存在下将式(2)的丙炔酸酯化合物肟化为式(3)的甲基氘代丙炔酸酯化合物 :和(ii)在氘气和含钯催化剂的存在下,在反应溶剂中还原式肟化式(3)的甲炔 - 氘代丙炔酸酯化合物,得到式(1)的氘代丙烯酸酯。 还描述了所得到的氘化丙烯酸酯化合物,其衍生物和由其衍生的聚合物。

    Methods for the synthesis of deuterated acrylate salts
    2.
    发明授权
    Methods for the synthesis of deuterated acrylate salts 有权
    氘代丙烯酸盐的合成方法

    公开(公告)号:US08829238B2

    公开(公告)日:2014-09-09

    申请号:US13611927

    申请日:2012-09-12

    IPC分类号: C07C51/36

    摘要: A method for synthesizing a deuterated acrylate of the Formula (1), the method comprising: (i) deuterating a propiolate compound of Formula (2) to a methyne-deuterated propiolate compound of Formula (3) in the presence of a base and D2O: and (ii) reductively deuterating the methyne-deuterated propiolate compound of Formula (3) in a reaction solvent in the presence of deuterium gas and a palladium-containing catalyst to afford the deuterated acrylate of the Formula (1). The resulting deuterated acrylate compounds, derivatives thereof, and polymers derived therefrom are also described.

    摘要翻译: 一种用于合成式(1)的氘化丙烯酸酯的方法,所述方法包括:(i)在碱和D 2 O存在下将式(2)的丙炔酸酯化合物肟化为式(3)的甲基氘代丙炔酸酯化合物 :和(ii)在氘气和含钯催化剂的存在下,在反应溶剂中还原式肟化式(3)的甲炔 - 氘代丙炔酸酯化合物,得到式(1)的氘代丙烯酸酯。 还描述了所得到的氘化丙烯酸酯化合物,其衍生物和由其衍生的聚合物。

    Methods for the synthesis of deuterated vinyl pyridine monomers
    3.
    发明授权
    Methods for the synthesis of deuterated vinyl pyridine monomers 有权
    氘代乙烯基吡啶单体的合成方法

    公开(公告)号:US08658802B2

    公开(公告)日:2014-02-25

    申请号:US13553293

    申请日:2012-07-19

    IPC分类号: C07D213/06

    CPC分类号: C07D213/16 C07D213/127

    摘要: Methods for synthesizing deuterated vinylpyridine compounds of the Formula (1), wherein the method includes: (i) deuterating an acyl pyridine of the Formula (2) in the presence of a metal catalyst and D2O, wherein the metal catalyst is active for hydrogen exchange in water, to produce a deuterated acyl compound of Formula (3); (ii) reducing the compound of Formula (3) with a deuterated reducing agent to convert the acyl group to an alcohol group, and (iii) dehydrating the compound produced in step (ii) with a dehydrating agent to afford the vinylpyridine compound of Formula (1). The resulting deuterated vinylpyridine compounds are also described.

    摘要翻译: 用于合成式(1)的氘化乙烯基吡啶化合物的方法,其中所述方法包括:(i)在金属催化剂和D 2 O存在下使式(2)的酰基吡啶氘化,其中所述金属催化剂用于氢交换 在水中制备式(3)的氘代酰基化合物; (ii)用氘代还原剂还原式(3)的化合物以将酰基转化为醇基,和(ⅲ)用脱水剂将步骤(ⅱ)中生成的化合物脱水得到式(Ⅴ)的乙烯基吡啶化合物, (1)。 还描述了所得的氘代乙烯基吡啶化合物。

    METHODS FOR THE SYNTHESIS OF DEUTERATED VINYL PYRIDINE MONOMERS
    4.
    发明申请
    METHODS FOR THE SYNTHESIS OF DEUTERATED VINYL PYRIDINE MONOMERS 有权
    合成乙烯基吡啶单体的方法

    公开(公告)号:US20140024836A1

    公开(公告)日:2014-01-23

    申请号:US13553293

    申请日:2012-07-19

    IPC分类号: C07D213/16 C07D213/127

    CPC分类号: C07D213/16 C07D213/127

    摘要: Methods for synthesizing deuterated vinylpyridine compounds of the Formula (1), wherein the method includes: (i) deuterating an acyl pyridine of the Formula (2) in the presence of a metal catalyst and D2O, wherein the metal catalyst is active for hydrogen exchange in water, to produce a deuterated acyl compound of Formula (3); (ii) reducing the compound of Formula (3) with a deuterated reducing agent to convert the acyl group to an alcohol group, and (iii) dehydrating the compound produced in step (ii) with a dehydrating agent to afford the vinylpyridine compound of Formula (1). The resulting deuterated vinylpyridine compounds are also described.

    摘要翻译: 用于合成式(1)的氘化乙烯基吡啶化合物的方法,其中所述方法包括:(i)在金属催化剂和D 2 O存在下使式(2)的酰基吡啶氘化,其中所述金属催化剂用于氢交换 在水中制备式(3)的氘代酰基化合物; (ii)用氘代还原剂还原式(3)的化合物以将酰基转化为醇基,和(ⅲ)用脱水剂将步骤(ⅱ)中生成的化合物脱水得到式(Ⅴ)的乙烯基吡啶化合物, (1)。 还描述了所得的氘代乙烯基吡啶化合物。

    ADJUSTING STRUCTURE AND STAND FOR PHOTOGRAPHIC APPARATUS

    公开(公告)号:US20240052967A1

    公开(公告)日:2024-02-15

    申请号:US17983667

    申请日:2022-11-09

    IPC分类号: F16M11/04 F16M11/32 G03B17/56

    摘要: The invention discloses an adjusting structure and a stand for photographic apparatus. The adjusting structure includes a first adjusting rod, a first connecting member, a second connecting member, a second adjusting rod, a first locking member and a supporting member. The first connecting member is fixedly connected with the first adjusting rod, the second connecting member is rotationally connected with the first connecting member and is provided with a first mounting hole, wherein the second connecting member can be rotated relative to the first connecting member to adjust an included angle with the first connecting member, the second adjusting rod is penetrated through the first mounting hole and movablely connected with the first adjusting rod, and can be moved relative to the first adjusting rod along a straight direction.

    METHOD AND APPARATUS FOR WITHIN-WAFER PROFILE LOCALIZED TUNING

    公开(公告)号:US20180226263A1

    公开(公告)日:2018-08-09

    申请号:US15941839

    申请日:2018-03-30

    申请人: Jun Yang

    发明人: Jun Yang

    摘要: A method and apparatus for within-wafer profile localized tuning is disclosed. In one aspect, the method includes providing a wafer attached to a rotating vacuum stage front side up, the wafer including a surface film with an incoming film thickness profile, providing a pad attached to a rotating head front side down, the head configured to sweep along a path, computing a film thickness removal amount based upon the incoming film thickness profile, and removing at least a portion of the surface film of the wafer based on the computed film thickness removal amount via a plurality of steps.