Abstract:
A flash memory accessing method is provided. The method includes: firstly, dividing the flash memory into a primary storage area and a backup storage area, wherein the difference between a first start address of the primary storage area and a second start address of the backup storage area is an offset address not equal to zero; reading the flash memory according to a address pointer equal to the first start address so as to obtain the boot data; making the electronic apparatus perform a boot sequence according to the boot data; then, detecting whether the boot sequence is normal or not, and when the boot sequence is abnormal, providing the flash memory with changing the read pointer to the second start address according to an offset address to read the backup boot data.
Abstract:
A flash memory apparatus with serial interface is disclosed. The flash memory apparatus includes a selector, a core circuit and a programmable data bank. The selector decides whether or not to connect one of a write protect pin and a hold pin to a reset signal line. The core circuit receives a reset signal transmitted by the reset signal line and activates a reset operation accordingly. A selecting data is written into the programmable data bank through a programming method and the programmable data bank outputs the selecting data to serve as a selecting signal.
Abstract:
A flash memory apparatus with serial interface is disclosed. The flash memory apparatus includes a selector, a core circuit and a programmable data bank. The selector decides whether or not to connect one of a write protect pin and a hold pin to a reset signal line. The core circuit receives a reset signal transmitted by the reset signal line and activates a reset operation accordingly. A selecting data is written into the programmable data bank through a programming method and the programmable data bank outputs the selecting data to serve as a selecting signal.
Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate and a transistor formed in the substrate. The transistor includes a gate stack having a high-k dielectric and metal gate, a sealing layer formed on sidewalls of the gate stack, the sealing layer having an inner edge and an outer edge, the inner edge interfacing with the sidewall of the gate stack, a spacer formed on the outer edge of the sealing layer, and a source/drain region formed on each side of the gate stack, the source/drain region including a lightly doped source/drain (LDD) region that is aligned with the outer edge of the sealing layer.
Abstract:
An apparatus includes a process chamber configured to perform an ion implantation process. A cooling platen or electrostatic chuck is provided within the process chamber. The cooling platen or electrostatic chuck is configured to support a semiconductor wafer. The cooling platen or electrostatic chuck has a plurality of temperature zones. Each temperature zone includes at least one fluid conduit within or adjacent to the cooling platen or electrostatic chuck. At least two coolant sources are provided, each fluidly coupled to a respective one of the fluid conduits and configured to supply a respectively different coolant to a respective one of the plurality of temperature zones during the ion implantation process. The coolant sources include respectively different chilling or refrigeration units.
Abstract:
A device for compensating a semiconductor memory defect, suitable for use in a semiconductor memory, is provided. The device includes a memory array, having at least a defectless sub-memory region, the memory array being coupled to an address decoder circuit and a sensing circuit for storing data. A selection circuit is coupled to a control unit and outputs a selection signal to the control unit. A first input address buffer is coupled to the control unit and the address decoder circuit, and outputs an address signal to the address decoder circuit in response to the selection signal for selecting the defectless sub-memory region to store data. A method for compensating a semiconductor memory defect is also provided, including determining whether the memory region of the semiconductor memory has a defect; and replacing the memory region with the defectless sub-memory region to store data when the semiconductor memory is defective.
Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate and a transistor formed in the substrate. The transistor includes a gate stack having a high-k dielectric and metal gate, a sealing layer formed on sidewalls of the gate stack, the sealing layer having an inner edge and an outer edge, the inner edge interfacing with the sidewall of the gate stack, a spacer formed on the outer edge of the sealing layer, and a source/drain region formed on each side of the gate stack, the source/drain region including a lightly doped source/drain (LDD) region that is aligned with the outer edge of the sealing layer.
Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate and a transistor formed in the substrate. The transistor includes a gate stack having a high-k dielectric and metal gate, a sealing layer formed on sidewalls of the gate stack, the sealing layer having an inner edge and an outer edge, the inner edge interfacing with the sidewall of the gate stack, a spacer formed on the outer edge of the sealing layer, and a source/drain region formed on each side of the gate stack, the source/drain region including a lightly doped source/drain (LDD) region that is aligned with the outer edge of the sealing layer.
Abstract:
A device for compensating a semiconductor memory defect, suitable for use in a semiconductor memory, is provided. The device includes a memory array, having at least a defectless sub-memory region, the memory array being coupled to an address decoder circuit and a sensing circuit for storing data. A selection circuit is coupled to a control unit and outputs a selection signal to the control unit. A first input address buffer is coupled to the control unit and the address decoder circuit, and outputs an address signal to the address decoder circuit in response to the selection signal for selecting the defectless sub-memory region to store data. A method for compensating a semiconductor memory defect is also provided, including determining whether the memory region of the semiconductor memory has a defect; and replacing the memory region with the defectless sub-memory region to store data when the semiconductor memory is defective.
Abstract:
A device for compensating a semiconductor memory defect suitable for a semiconductor memory is provided. The device comprises: a memory array, the memory array having a memory region consisting of a plurality of memory cells, the memory array being coupled to the address decoder circuit and the sensing circuit for storing data, if the memory array has a defect, the memory array is divided into a plurality of sub-memory regions, wherein one of the plurality of sub-memory regions is defectless, the memory array is replaced by the defectless sub-memory regions for storing data. A selection circuit coupled to the control unit, selects one of the memory region and the defectless sub-memory region to store data. A first input address buffer coupled to the control unit and the address decoder circuit has an address input port and an address output port. The address input port receives a most significant bit address signal, wherein if the memory array is defectless, the selection circuit outputs a selection signal to select the memory region to store data and makes the control unit control the address output port to output the most significant bit address signal to the address decoder circuit. If the memory array has the defect, the selection circuit outputs a selection signal to select the defectless memory region to store data and makes the control unit control the address output port to output the selection signal to the address decoder circuit.