摘要:
The present invention provides a process for producing a nano-graphite structure having a desired two-dimensional or three-dimensional shape, which process possesses enough potential for ultra-fine processing to allow free selection of the size, shape, and position for the construction therefor; typically a process in which the nano-graphite structure 4 is produced by such a way where a nano-structure amorphous carbon structure 2 formed on a substrate 1 in advance in the shape of a desired ultra-fine steric configuration by a beam-excited reaction is equipped with catalyst metal atoms such as iron contained therein, and when subjecting the steric structure to a low-temperature heat treatment, the structure is converted into the graphite structure 3 through a catalytic thermal reaction by means of the catalyst metal atoms involved therein, while the shape of steric configuration thereof holds.
摘要:
An amorphous carbon rod (13) is formed in contact with a catalyst fine particle (11). The fine particle (11) is liquefied by heat treatment, and moved along the amorphous carbon rod (13). The trail of the movement is converted to a carbon nanotube.
摘要:
An amorphous carbon rod (13) is formed in contact with a catalyst fine particle (11). The fine particle (11) is liquefied by heat treatment, and moved along the amorphous carbon rod (13). The trail of the movement is converted to a carbon nanotube.
摘要:
There has been a problem that micromiaturization causes increase of the resistance of wiring structure and degradation of electron migration resistance and stress migration resistance. The present invention provides a wiring structure of a semiconductor device having a low resistance even when the semiconductor device is microminiaturized, free of electron migration and stress migration, and having a high reliability and a method for manufacturing the same. A semiconductor device having a wiring or a connection plug made of a mixture of a metal and carbon nanotubes berried in a wiring groove or a via hole made in an insulating film on a substrate where a semiconductor chip is fabricated, and its manufacturing method are provided.
摘要:
There has been a problem that micromiaturization causes increase of the resistance of wiring structure and degradation of electron migration resistance and stress migration resistance. The present invention provides a wiring structure of a semiconductor device having a low resistance even when the semiconductor device is microminiaturized, free of electron migration and stress migration, and having a high reliability and a method for manufacturing the same. A semiconductor device having a wiring or a connection plug made of a mixture of a metal and carbon nanotubes berried in a wiring groove or a via hole made in an insulating film on a substrate where a semiconductor chip is fabricated, and its manufacturing method are provided.
摘要:
Scale down design has posed problems in an increase in the resistance value of an interconnection structure and a decrease in the resistance to electromigration and stress migration. The present invention provides an interconnection structure of a high-reliability semiconductor device which has a low resistance value even in the case of scale down design and does not produce electromigration or stress migration, and a method of manufacturing the interconnection structure. Provided are a semiconductor device which has an interconnection or a connection plug, both of which are fabricated from a mixture of a metal and carbon nanotubes, in an interconnection trench or a via hole, both of which are formed on an insulating film on a substrate on which a semiconductor device element is formed, and a method of manufacturing this semiconductor device.
摘要:
The method for forming a fine pattern on a substrate disclosed includes a step of preparing a hologram having a pattern, a step of irradiating material waves (de Broglie waves) such as neutral beams, ion beams and electron beams on the hologram, and a step of imaging the pattern on the substrate with the material waves being interfered by passing through the hologram. The light source has a source that emits a beam having a coherent wave front. Since the fine patterns are formed by utilizing the interference of material waves, the minimum processing precision can be enhanced to the extent of the wavelength of the material wave.
摘要:
A technique of forming an elastic DLC structure having ultra high strength by controlling an amount of focused ion beam current from 0.1 to 10 pA, and a growth rate in the range from 0.6 to 5 μm/min. and by using hydrocarbon gas such as phenanthrene (C14H10) and pyrene (C16H10), as source gas, in an apparatus having a gas nozzle for locally maintaining a higher partial gas pressure near the substrate and a structure for confining the gas on the substrate. In this manner, the elastic DLC having the ultra high strength can be obtained of which a hardness can be controlled in a relatively broader range.
摘要:
The resist according to the present invention includes any one of tetrachloromethyl tetramethoxycalix [4] arene and trichloromethyl tetramethoxycalix [4] arene. The resist including such kind of components is soluble in the solvent having less effect to worsen a working environment, namely, ethyl lactate (EL), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl propionate, n-butyl acetate and 2-heptanone. It can be developed by tetra-methyl ammonium hydroxide in addition to the above mentioned solvent. By exposing this resist by electronic ray, high resolution of 8 nm is attained, and by using this resist as a mask, various materials can be formed into a hyperfine shape. According to such kind of resist, a photosensitive resist material which has high resolution and solvable to solvents having less effect to worsen the working environment and can be developed by the solvents, a exposure method using it, and a hyperfine processing method using it are provided.
摘要:
The resist according to the present invention includes any one of tetrachloromethyl tetramethoxycalix [4] arene and trichloromethyl tetramethoxycalix [4] arene. The resist including such kind of components is soluble in the solvent having less effect to worsen a working environment, namely, ethyl lactate (EL), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl propionate, n-butyl acetate and 2-heptanone. It can be developed by tetra-methyl ammonium hydroxide in addition to the above mentioned solvent. By exposing this resist by electronic ray, high resolution of 8 nm is attained, and by using this resist as a mask, various materials can be formed into a hyperfine shape. According to such kind of resist, a photosensitive resist material which has high resolution and solvable to solvents having less effect to worsen the working environment and can be developed by the solvents, a exposure method using it, and a hyperfine processing method using it are provided.