Process for production of nano-graphite structure
    1.
    发明申请
    Process for production of nano-graphite structure 审中-公开
    纳米石墨结构生产工艺

    公开(公告)号:US20050079120A1

    公开(公告)日:2005-04-14

    申请号:US10503660

    申请日:2003-01-31

    IPC分类号: C01B31/02 C01B31/04

    摘要: The present invention provides a process for producing a nano-graphite structure having a desired two-dimensional or three-dimensional shape, which process possesses enough potential for ultra-fine processing to allow free selection of the size, shape, and position for the construction therefor; typically a process in which the nano-graphite structure 4 is produced by such a way where a nano-structure amorphous carbon structure 2 formed on a substrate 1 in advance in the shape of a desired ultra-fine steric configuration by a beam-excited reaction is equipped with catalyst metal atoms such as iron contained therein, and when subjecting the steric structure to a low-temperature heat treatment, the structure is converted into the graphite structure 3 through a catalytic thermal reaction by means of the catalyst metal atoms involved therein, while the shape of steric configuration thereof holds.

    摘要翻译: 本发明提供一种具有所需二维或三维形状的纳米石墨结构的制造方法,该方法具有足够的超细加工潜力,可以自由选择结构的尺寸,形状和位置 为此; 通常是通过以下方式制造纳米石墨结构体4的方法:其中通过束激发反应,预先形成在所需的超细立方体形状的基板1上的纳米结构无定形碳结构2 配有催化剂金属原子如铁中所含的铁,并且当对空间结构进行低温热处理时,通过催化热反应借助于其中涉及的催化剂金属原子将结构转化为石墨结构3, 而其立体形状的形状成立。

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    6.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20090181535A1

    公开(公告)日:2009-07-16

    申请号:US12406487

    申请日:2009-03-18

    IPC分类号: H01L21/4763

    摘要: Scale down design has posed problems in an increase in the resistance value of an interconnection structure and a decrease in the resistance to electromigration and stress migration. The present invention provides an interconnection structure of a high-reliability semiconductor device which has a low resistance value even in the case of scale down design and does not produce electromigration or stress migration, and a method of manufacturing the interconnection structure. Provided are a semiconductor device which has an interconnection or a connection plug, both of which are fabricated from a mixture of a metal and carbon nanotubes, in an interconnection trench or a via hole, both of which are formed on an insulating film on a substrate on which a semiconductor device element is formed, and a method of manufacturing this semiconductor device.

    摘要翻译: 缩小设计在互连结构的电阻值的增加和电迁移和应力迁移的阻力降低方面存在问题。 本发明提供即使在缩小设计的情况下也具有低电阻值并且不产生电迁移或应力迁移的高可靠性半导体器件的互连结构,以及制造互连结构的方法。 提供一种半导体器件,其具有互连或连接插头,它们都由互连沟槽或通孔中的金属和碳纳米管的混合物制成,它们都形成在衬底上的绝缘膜上 其上形成有半导体器件元件,以及制造该半导体器件的方法。

    Method and system for forming fine patterns using hologram
    7.
    发明授权
    Method and system for forming fine patterns using hologram 失效
    使用全息图形成精细图案的方法和系统

    公开(公告)号:US5838468A

    公开(公告)日:1998-11-17

    申请号:US631237

    申请日:1996-04-12

    CPC分类号: G03H5/00 G03H2001/0094

    摘要: The method for forming a fine pattern on a substrate disclosed includes a step of preparing a hologram having a pattern, a step of irradiating material waves (de Broglie waves) such as neutral beams, ion beams and electron beams on the hologram, and a step of imaging the pattern on the substrate with the material waves being interfered by passing through the hologram. The light source has a source that emits a beam having a coherent wave front. Since the fine patterns are formed by utilizing the interference of material waves, the minimum processing precision can be enhanced to the extent of the wavelength of the material wave.

    摘要翻译: 在所公开的基板上形成精细图案的方法包括制备具有图案的全息图的步骤,在全息图上照射材料波(德布罗意波)如中性光束,离子束和电子束的步骤,以及步骤 在材料波被穿过全息图的干扰下对图案进行成像。 光源具有发射具有相干波前的光束的源。 由于通过利用材料波的干扰来形成精细图案,所以可以将最小的加工精度提高到材料波的波长的程度。

    Resist and method of forming resist pattern
    9.
    发明授权
    Resist and method of forming resist pattern 失效
    抗蚀剂图案的抗蚀剂和方法

    公开(公告)号:US07514197B2

    公开(公告)日:2009-04-07

    申请号:US10527068

    申请日:2003-09-04

    摘要: The resist according to the present invention includes any one of tetrachloromethyl tetramethoxycalix [4] arene and trichloromethyl tetramethoxycalix [4] arene. The resist including such kind of components is soluble in the solvent having less effect to worsen a working environment, namely, ethyl lactate (EL), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl propionate, n-butyl acetate and 2-heptanone. It can be developed by tetra-methyl ammonium hydroxide in addition to the above mentioned solvent. By exposing this resist by electronic ray, high resolution of 8 nm is attained, and by using this resist as a mask, various materials can be formed into a hyperfine shape. According to such kind of resist, a photosensitive resist material which has high resolution and solvable to solvents having less effect to worsen the working environment and can be developed by the solvents, a exposure method using it, and a hyperfine processing method using it are provided.

    摘要翻译: 根据本发明的抗蚀剂包括四氯甲基四甲氧基钙[4]芳烃和三氯甲基四甲氧基钙[4]芳烃中的任一种。 包含这种组分的抗蚀剂可溶于对工作环境恶化的影响较小的溶剂,即乳酸乙酯(EL),丙二醇单甲醚(PGME),丙二醇单甲醚乙酸酯(PGMEA),丙酸乙酯, 乙酸丁酯和2-庚酮。 除了上述溶剂之外,还可以通过四甲基氢氧化铵来显影。 通过电子射线曝光该抗蚀剂,达到8nm的高分辨率,通过使用该抗蚀剂作为掩模,可以将各种材料形成为超精细的形状。 根据这种抗蚀剂,提供了具有高分辨率且可溶于溶剂的光敏抗蚀剂材料,其效果较差,可以使工作环境恶化并且可以通过溶剂显影,使用它的曝光方法和使用它的超精细加工方法 。

    Resist and method of forming resist pattern

    公开(公告)号:US20060127798A1

    公开(公告)日:2006-06-15

    申请号:US10527068

    申请日:2003-09-04

    IPC分类号: G03C1/76

    摘要: The resist according to the present invention includes any one of tetrachloromethyl tetramethoxycalix [4] arene and trichloromethyl tetramethoxycalix [4] arene. The resist including such kind of components is soluble in the solvent having less effect to worsen a working environment, namely, ethyl lactate (EL), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl propionate, n-butyl acetate and 2-heptanone. It can be developed by tetra-methyl ammonium hydroxide in addition to the above mentioned solvent. By exposing this resist by electronic ray, high resolution of 8 nm is attained, and by using this resist as a mask, various materials can be formed into a hyperfine shape. According to such kind of resist, a photosensitive resist material which has high resolution and solvable to solvents having less effect to worsen the working environment and can be developed by the solvents, a exposure method using it, and a hyperfine processing method using it are provided.