摘要:
An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
摘要:
A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.
摘要:
A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.
摘要:
A cooling module includes a thermal conductive member. An endoergic chamber, a radiative chamber and a circulation pump chamber are defined along the thermal conductive member. The thermal conductive member contacts a heat generating object outside the endoergic chamber. The thermal energy is transferred to the coolant in the endoergic chamber. The coolant then flows into the radiative chamber. The thermal energy of the coolant is taken away in the radiative chamber. The thermal energy is radiated from the outer wall surface of the radiative chamber. This cooling cycle is repeated so that an efficient cooling operation can be realized in the cooling module. Arrangement of the endoergic, radiative and circulation pump chambers along the thermal conductive member leads to a minimized height of the cooling module.
摘要:
A cooling module includes a thermal conductive member. An endoergic chamber, a radiative chamber and a circulation pump chamber are defined along the thermal conductive member. The thermal conductive member contacts a heat generating object outside the endoergic chamber. The thermal energy is transferred to the coolant in the endoergic chamber. The coolant then flows into the radiative chamber. The thermal energy of the coolant is taken away in the radiative chamber. The thermal energy is radiated from the outer wall surface of the radiative chamber. This cooling cycle is repeated so that an efficient cooling operation can be realized in the cooling module. Arrangement of the endoergic, radiative and circulation pump chambers along the thermal conductive member leads to a minimized height of the cooling module.
摘要:
The present invention relates to (i) novel fluoroionic compounds capable of dispersing particulate filler compositions into a fluoropolymer; (ii) novel particulate compositions in which particulates are surface-functionalized with a fluoroionic compound; (iii) fluoropolymer composite materials containing the surface-functionalized particulates of (ii) incorporated into a fluoropolymer; (iv) crosslinked versions of (iii); v) methods for producing the crosslinked material of (iv); and (vi) articles of manufacture containing the compositions (iii) and (iv).
摘要:
The present invention relates to (i) novel fluoroionic compounds capable of dispersing particulate filler compositions into a fluoropolymer; (ii) novel particulate compositions in which particulates are surface-functionalized with a fluoroionic compound; (iii) fluoropolymer composite materials containing the surface-functionalized particulates of (ii) incorporated into a fluoropolymer; (iv) crosslinked versions of (iii); v) methods for producing the crosslinked material of (iv); and (vi) articles of manufacture containing the compositions (iii) and (iv).
摘要:
A polyamide composition is formed from a low viscosity polyamide-6 and a nucleating agent. The nucleating agent includes an organic material, a first inorganic material and a second inorganic material. Suitable organic materials include organic polymers. Suitable inorganic metallic materials include metal oxides and silicates. The polyamide composition may include polyamide-66 materials and carbon black.
摘要:
A polyamide composition is formed from a low viscosity polyamide-6 and a nucleating agent. The nucleating agent includes an organic material, a first inorganic material and a second inorganic material. Suitable organic materials include organic polymers. Suitable inorganic metallic materials include metal oxides and silicates. The polyamide composition may include polyamide-66 materials and carbon black.
摘要:
The circulation main loop supplies the liquid coolant by means of the main pump to the cooling plate which cools the electronic element, and then, dissipates the heat by the main heat exchanger 20 to return the same to the reservoir tank. The circulation sub-loop supplies the liquid coolant by means of the sub-pump, and after dissipating the heat by the sub-heat exchanger, returns the same to the refrigerant tank. The controller controls as required the supply flow rate from the main pump and the sub-pump.