公开(公告)号：US06621707B2

公开(公告)日：2003-09-16

申请号：US09968041

申请日：2001-10-02

申请人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

发明人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

公开(公告)号：US06404640B1

公开(公告)日：2002-06-11

申请号：US09235498

申请日：1999-01-22

申请人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wie ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

发明人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wie ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

公开(公告)号：US5195020A

公开(公告)日：1993-03-16

申请号：US785198

申请日：1991-11-01

申请人： Masahiro Suzuki ,  Haruhiko Yamamoto ,  Yoshiaki Udagawa

发明人： Masahiro Suzuki ,  Haruhiko Yamamoto ,  Yoshiaki Udagawa

IPC分类号： H01L23/433

CPC分类号： H01L23/4332 ,  H01L2924/0002

摘要： A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically. As the result, the thermal contact resistance between the heat transfer plate and the circuit component is favorably reduced and stabilized.

摘要翻译： 与印刷电路板一起使用的冷却系统在其上至少具有固体电路部件。 冷却系统包括连接到冷却集管的冷却集管和冷却模块。 每个冷却模块接合到每个部件。 冷却模块具有连接到另一端连接到冷却集管的波纹管的一端的传热板。 在传热板和相应的电路部件之间插入一层导热性化合物，例如导热油脂层。 首先以高于临界压力的压力压制导热层，然后将压力降低到通过波纹管的弹力和冷却剂的液压力施加在电路部件上的工作压力。 临界压力是实验性地或实际地预定的。 结果，传热板和电路部件之间的热接触电阻有利地降低并稳定。

公开(公告)号：US4783721A

公开(公告)日：1988-11-08

申请号：US79877

申请日：1987-07-30

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G02F1/00 ,  G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G02F1/0036 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 一种冷却系统，包括：冷却模块，其具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏置，用于将由所述部件散发的热传递到所述冷却剂;以及用于引导和 防止转印板的不正确对准，因为它们朝向电路部件弹性偏压。 冷却剂模块可以包括用于在转印板和电路部件之间建立热接触的焊料或低熔点金属。

公开(公告)号：US5126919A

公开(公告)日：1992-06-30

申请号：US261904

申请日：1988-10-25

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G11B11/10586 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属 用于在转印板和电路部件之间建立热接触。

公开(公告)号：US4920574A

公开(公告)日：1990-04-24

申请号：US79876

申请日：1987-07-30

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  H01L23/4332 ,  H01L2924/0002

摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.

摘要翻译： 一种冷却系统，包括冷却模块，该冷却模块具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏压，以将由部件散发的热量传递给冷却剂。 在传热板上提供一系列突起，用于在冷却剂流中产生湍流。 或者，圆柱形管板安装在传热板上，用于增加与冷却剂流接触的表面积。

公开(公告)号：US4879632A

公开(公告)日：1989-11-07

申请号：US914942

申请日：1986-10-03

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G02F1/00 ,  G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G02F1/0036 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属 用于在转印板和电路部件之间建立热接触。

公开(公告)号：US5136856A

公开(公告)日：1992-08-11

申请号：US659658

申请日：1991-02-25

申请人： Haruhiko Yamamoto ,  Akihiko Fujisaki

发明人： Haruhiko Yamamoto ,  Akihiko Fujisaki

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： G06F1/206 ,  G06F2200/201

摘要： A cooling system comprising an airtight box which accommodates a cooling module and an electronic device which is cooled by the cooling module and has a door which is opened when attending to maintenance of parts within the airtight box, a dew condensation preventing unit for absorbing humidity within the airtight box and/or replacing air or gas within said airtight box when operated, a coolant supply unit for recirculating a coolant between the coolant supply unit and the cooling module, and a controller for operating the coolant supply unit and the dew condensation preventing unit in response to a first instruction signal which instructs a cooling operation, and for heating the electronic device in response to a second instruction signal which instructs the maintenance of the parts within the airtight box, where only one of the first and second instruction signals exists at one time. The controller includes a circuit part responsive to the second instruction signal for supplying an operating signal to the electronic device to operate the electronic device for a predetermined time, so that the electronic device rises to a predetermined temperature due to heat generated by the electronic device itself.

公开(公告)号：US4729060A

公开(公告)日：1988-03-01

申请号：US695142

申请日：1985-01-25

申请人： Haruhiko Yamamoto ,  Masaaki Sakai ,  Yoshiaki Udagawa ,  Kouji Katsuyama ,  Mitsuhiko Nakata

发明人： Haruhiko Yamamoto ,  Masaaki Sakai ,  Yoshiaki Udagawa ,  Kouji Katsuyama ,  Mitsuhiko Nakata

IPC分类号： H01L23/473 ,  H01L23/36 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4332 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204

摘要： A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.

摘要翻译： 用于印刷电路板上的电子电路部件的冷却模块包括冷却剂流过的通道，暴露于冷却剂流的第一传热板，固定到电路部件的第二传热板， 用于在其之间建立柔性接触的第一和第二传热板，以及连接到第一传热板的波纹管，以通过柔性构件和第二传热板将第一传热板弹性地按压在电路部件上。

公开(公告)号：US4158220A

公开(公告)日：1979-06-12

申请号：US862498

申请日：1977-12-20

申请人： Haruhiko Yamamoto ,  Yoshiaki Udagawa ,  Yoshinao Hirose

发明人： Haruhiko Yamamoto ,  Yoshiaki Udagawa ,  Yoshinao Hirose

IPC分类号： H05K7/02 ,  G06F1/18 ,  H05K1/14 ,  H05K3/36 ,  H05K7/14 ,  H02B1/02

CPC分类号： H05K7/1424 ,  H05K1/144 ,  H05K3/368

摘要： Disclosed is a printed circuit card construction comprising laminated conductor plates, a plurality of poles mounted on the laminated conductor plates, a plurality of mother boards fixed by two adjacent poles, a plurality of Input/Output connectors supported by the mother boards for holding each printed circuit card, and a plurality of power sources, wherein the poles and the power sources are directly connected to the corresponding conductor plates of the laminated conductor plates, which poles act as both mechanical means for supporting the mother boards and electrical means for supplying power to the printed circuit cards.

摘要翻译： 公开了一种印刷电路卡结构，包括层压导体板，安装在层叠导体板上的多个极，由两个相邻极固定的多个母板，由母板支撑的多个输入/输出连接器，用于保持每个印刷 电路卡和多个电源，其中极和电源直接连接到层压导体板的相应导体板，这些极用作支撑母板的机械装置和用于向 印刷电路卡。