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    Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
    3.
    发明授权
    Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator 失效
    利用蒸发器中制冷剂不完全蒸发的制冷系统

    公开(公告)号：US07007506B2

    公开(公告)日：2006-03-07

    申请号：US10837651

    申请日：2004-05-04

    申请人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

    发明人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

    IPC分类号： F25B39/02

    CPC分类号： F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

    摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

    摘要翻译： 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的冷凝器蒸发期间，制冷剂的质量保持在预定阈值水平以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

    Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
    4.
    发明授权
    Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator 失效
    利用蒸发器中制冷剂不完全蒸发的制冷系统

    公开(公告)号：US06748755B2

    公开(公告)日：2004-06-15

    申请号：US09749622

    申请日：2000-12-28

    申请人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

    发明人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

    IPC分类号： F25B4104

    CPC分类号： F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

    摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

    摘要翻译： 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的制冷剂蒸发期间，制冷剂的质量保持在预定阈值以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

    Cooling device for mounting module
    5.
    发明授权
    Cooling device for mounting module 失效
    用于安装模块的冷却装置

    公开(公告)号：US5862038A

    公开(公告)日：1999-01-19

    申请号：US825679

    申请日：1997-03-20

    申请人： Masahiro Suzuki ,  Junichi Ishimine ,  Hisashi Kawashima ,  Keizo Takemura ,  Kiyotaka Seyama

    发明人： Masahiro Suzuki ,  Junichi Ishimine ,  Hisashi Kawashima ,  Keizo Takemura ,  Kiyotaka Seyama

    IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L23/40 ,  H01L23/433

    CPC分类号： H01L23/4338 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/73253

    摘要： A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

    摘要翻译： 一种用于安装模块的冷却装置，其中由安装在安装模块上的预定数量的电路元件产生的热量通过冷却装置消散。 冷却装置由至少一个将电路元件与冷却装置连接的导电元件组成，导电元件包括​​预定数量的第一导电构件，该第一导电构件放置在形成于导电装置中的相应的孔中，并且可移动地由 填充在第一导电构件的侧表面和导电元件的表面之间的第一导电材料，以便完成从电路元件到冷却装置的热流。

    Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer
    8.
    发明授权
    Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer 失效
    与其中包括导热化合物层的冷却回路部件的电子电路装置一起使用的冷却系统及其形成方法

    公开(公告)号：US5195020A

    公开(公告)日：1993-03-16

    申请号：US785198

    申请日：1991-11-01

    申请人： Masahiro Suzuki ,  Haruhiko Yamamoto ,  Yoshiaki Udagawa

    发明人： Masahiro Suzuki ,  Haruhiko Yamamoto ,  Yoshiaki Udagawa

    IPC分类号： H01L23/433

    CPC分类号： H01L23/4332 ,  H01L2924/0002

    摘要： A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically. As the result, the thermal contact resistance between the heat transfer plate and the circuit component is favorably reduced and stabilized.

    摘要翻译： 与印刷电路板一起使用的冷却系统在其上至少具有固体电路部件。 冷却系统包括连接到冷却集管的冷却集管和冷却模块。 每个冷却模块接合到每个部件。 冷却模块具有连接到另一端连接到冷却集管的波纹管的一端的传热板。 在传热板和相应的电路部件之间插入一层导热性化合物，例如导热油脂层。 首先以高于临界压力的压力压制导热层，然后将压力降低到通过波纹管的弹力和冷却剂的液压力施加在电路部件上的工作压力。 临界压力是实验性地或实际地预定的。 结果，传热板和电路部件之间的热接触电阻有利地降低并稳定。