公开(公告)号：US06621707B2

公开(公告)日：2003-09-16

申请号：US09968041

申请日：2001-10-02

申请人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

发明人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

公开(公告)号：US06404640B1

公开(公告)日：2002-06-11

申请号：US09235498

申请日：1999-01-22

申请人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wie ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

发明人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wie ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

公开(公告)号：US07007506B2

公开(公告)日：2006-03-07

申请号：US10837651

申请日：2004-05-04

申请人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

发明人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

IPC分类号： F25B39/02

CPC分类号： F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

摘要翻译： 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的冷凝器蒸发期间，制冷剂的质量保持在预定阈值水平以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

公开(公告)号：US06748755B2

公开(公告)日：2004-06-15

申请号：US09749622

申请日：2000-12-28

申请人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

发明人： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

IPC分类号： F25B4104

CPC分类号： F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

摘要： A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

摘要翻译： 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的制冷剂蒸发期间，制冷剂的质量保持在预定阈值以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

公开(公告)号：US5862038A

公开(公告)日：1999-01-19

申请号：US825679

申请日：1997-03-20

申请人： Masahiro Suzuki ,  Junichi Ishimine ,  Hisashi Kawashima ,  Keizo Takemura ,  Kiyotaka Seyama

发明人： Masahiro Suzuki ,  Junichi Ishimine ,  Hisashi Kawashima ,  Keizo Takemura ,  Kiyotaka Seyama

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L23/40 ,  H01L23/433

CPC分类号： H01L23/4338 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/73253

摘要： A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

摘要翻译： 一种用于安装模块的冷却装置，其中由安装在安装模块上的预定数量的电路元件产生的热量通过冷却装置消散。 冷却装置由至少一个将电路元件与冷却装置连接的导电元件组成，导电元件包括​​预定数量的第一导电构件，该第一导电构件放置在形成于导电装置中的相应的孔中，并且可移动地由 填充在第一导电构件的侧表面和导电元件的表面之间的第一导电材料，以便完成从电路元件到冷却装置的热流。

公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。

公开(公告)号：US5640046A

公开(公告)日：1997-06-17

申请号：US431978

申请日：1995-05-01

申请人： Masahiro Suzuki ,  Akihiko Fujisaki ,  Junichi Ishimine

发明人： Masahiro Suzuki ,  Akihiko Fujisaki ,  Junichi Ishimine

IPC分类号： H05K7/20 ,  H01L23/433 ,  H01L23/467 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/4332 ,  H01L2924/0002

摘要： In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.

摘要翻译： 在安装在电路板上并具有散热器的冷却电路元件模块的冷却结构中，设置有连接电路元件模块的主导管和连接到主管道并供应的冷却剂供应装置 一个冷却剂到主管道。

公开(公告)号：US09113582B2

公开(公告)日：2015-08-18

申请号：US12781258

申请日：2010-05-17

申请人： Yuji Ohba ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki ,  Seiichi Saito

发明人： Yuji Ohba ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki ,  Seiichi Saito

IPC分类号： H05K7/20 ,  G05D23/19

CPC分类号： H05K7/20836 ,  G05D23/19 ,  G05D23/1917

摘要： An air conditioning control apparatus for controlling an air conditioner in a room which accommodates a computer, includes obtaining repetitively a detected value of a total power consumption of the computer and the air conditioner and a detected value of a air temperature at the air inlet, storing the obtained values into a memory, determining an approximate expression representing a relation between the total power consumption and the air temperature on the basis of the values stored into the memory, determining a value of the air temperature corresponding to the lowest value of the total power consumption, by using the calculated approximate expression, and controlling the air conditioner so that the air temperature become equal the calculated air temperature.

摘要翻译： 一种用于控制容纳计算机的房间中的空调的空调控制装置，包括重复地获得计算机和空调的总功耗的检测值和检测到的空气入口温度的值，存储 将获得的值存储到存储器中，基于存储在存储器中的值来确定表示总功耗和空气温度之间的关系的近似表达式，确定与总功率的最低值相对应的空气温度值 消耗，通过使用计算的近似表达式，并且控制空调，使得空气温度变得等于计算出的空气温度。

公开(公告)号：US20110060571A1

公开(公告)日：2011-03-10

申请号：US12805591

申请日：2010-08-06

申请人： Akira Ueda ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Nobuyoshi Yamaoka ,  Yasushi Uraki

发明人： Akira Ueda ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Nobuyoshi Yamaoka ,  Yasushi Uraki

IPC分类号： G06G7/48

CPC分类号： G06F17/50 ,  G06F17/5004 ,  G06F17/5018 ,  G06F2217/16 ,  G06F2217/80 ,  H05K7/20609 ,  H05K7/20836

摘要： A thermal-fluid-simulation analyzing apparatus includes an execution unit that generates an analysis model using analysis conditions to conduct a first thermal fluid simulation analysis based on the generated analysis model, an analysis-condition collecting unit that collects analysis conditions when a predetermined period passes after the first thermal fluid simulation analysis, a condition extracting unit that extracts a boundary condition from the analysis conditions collected by the analysis-condition collecting unit, and a re-execution unit that selects a region corresponding to the boundary condition extracted by the condition extracting unit from regions of the analysis model generated by the execution unit, updates the selected region with the boundary condition, and conducts a second thermal fluid simulation analysis for the updated analysis model.

摘要翻译： 热流体模拟分析装置包括执行单元，其使用分析条件生成分析模型，以基于所生成的分析模型进行第一热流体模拟分析;分析条件收集单元，其在预定时间段通过时收集分析条件 在第一热流体模拟分析之后，条件提取单元从分析条件收集单元收集的分析条件中提取边界条件，以及重新执行单元，其选择与条件提取所提取的边界条件相对应的区域 由执行单元生成的分析模型的区域的单位，更新所选择的区域与边界条件，并对更新的分析模型进行第二热流体模拟分析。

公开(公告)号：US20110059687A1

公开(公告)日：2011-03-10

申请号：US12873909

申请日：2010-09-01

申请人： Tadashi Katsui ,  Junichi Ishimine ,  Seiichi Saito ,  Masahiro Suzuki ,  Ikuro Nagamatsu ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki

发明人： Tadashi Katsui ,  Junichi Ishimine ,  Seiichi Saito ,  Masahiro Suzuki ,  Ikuro Nagamatsu ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki

IPC分类号： F24F7/00

CPC分类号： H05K7/20745

摘要： A data center includes a housing room that houses an information technology device; an air conditioning machine that cools air in the housing room and supplies the air under a floor of the housing room; a grille that allows the air supplied under the floor to circulate in the housing room; and a rack device that houses the information technology device. In the housing room in the data center, the rack device is arranged in such a way as to surround the grille. The information technology device is housed in the rack device in such a way as to take in air from a space surrounded by the rack device via the grille and discharge air to the housing room. The air conditioning machine is arranged at a side from which the information technology device discharges air.

摘要翻译： 数据中心包括一个容纳信息技术设备的房间; 空调机，其对所述收容室内的空气进行冷却，并将所述空气供给到所述收容室的地板下; 允许在地板下方供应的空气在容纳室中循环的格栅; 以及容纳信息技术装置的机架装置。 在数据中心的房屋中，机架装置以围绕格栅的方式布置。 信息技术装置被容纳在机架装置中，以便经由格栅从由机架装置包围的空间吸入空气，并将空气排出到容纳室。 空调机设置在信息技术装置排出空气的一侧。